Till Huesgen

623 total citations
30 papers, 479 citations indexed

About

Till Huesgen is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Till Huesgen has authored 30 papers receiving a total of 479 indexed citations (citations by other indexed papers that have themselves been cited), including 23 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 9 papers in Biomedical Engineering. Recurrent topics in Till Huesgen's work include Electromagnetic Compatibility and Noise Suppression (10 papers), Silicon Carbide Semiconductor Technologies (10 papers) and Electronic Packaging and Soldering Technologies (7 papers). Till Huesgen is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (10 papers), Silicon Carbide Semiconductor Technologies (10 papers) and Electronic Packaging and Soldering Technologies (7 papers). Till Huesgen collaborates with scholars based in Germany, Switzerland and Netherlands. Till Huesgen's co-authors include Peter Woias, Norbert Kockmann, Paul Vulto, Michael Kroener, Gerald Urban, Thomas Lemke, Gabriel Lenk, Ankit Sharma, Ingmar Kallfass and Michael Gruber and has published in prestigious journals such as SHILAP Revista de lepidopterología, Applied Physics Letters and IEEE Transactions on Industry Applications.

In The Last Decade

Till Huesgen

28 papers receiving 458 citations

Peers

Till Huesgen

EEE

CSE

Julian Weber Germany

Heng-Chieh Chien Taiwan

Ayan Ray India

Laurent Hirsinger France

Shuling Zhou China

Fang Dong China

Y. van Andel Netherlands

Seungwoo Han South Korea

Maciej Haras Poland

Julian Weber Germany

Till Huesgen

146 ×0.6

EEE

77 ×0.4

160 ×0.9

112 ×0.6

89 ×1.1

CSE

Citations per year, relative to Till Huesgen Till Huesgen (= 1×) peers Julian Weber

Countries citing papers authored by Till Huesgen

Since Specialization

Citations

This map shows the geographic impact of Till Huesgen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Till Huesgen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Till Huesgen more than expected).

Fields of papers citing papers by Till Huesgen

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Till Huesgen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Till Huesgen. The network helps show where Till Huesgen may publish in the future.

Co-authorship network of co-authors of Till Huesgen

This figure shows the co-authorship network connecting the top 25 collaborators of Till Huesgen. A scholar is included among the top collaborators of Till Huesgen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Till Huesgen. Till Huesgen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Sharma, Ankit, et al.. (2023). Application-Oriented Characterization of Thermally Optimized, Asymmetrical Single Chip Packages for 100 V GaN HEMTs. 48–51. 1 indexed citations

Huesgen, Till, et al.. (2023). An Advanced Integrated Cooling Solution for High Voltage and Power Density Modules. SPIRE - Sciences Po Institutional REpository. 27. 1–6.

Huesgen, Till. (2022). Printed circuit board embedded power semiconductors: A technology review. SHILAP Revista de lepidopterología. 3. 100017–100017. 18 indexed citations

Sharma, Ankit, et al.. (2021). Top side isolation investigation of PCB embedded 1.2kV dies. 1–7. 1 indexed citations

Sharma, Ankit, et al.. (2021). Asymmetric Packages for Optimal Performance of GaN-HEMT using PCB Fabrication Technology. 1–8. 3 indexed citations

Sharma, Ankit, et al.. (2020). Thermal Study on Leadframe Dimensioning for High Power Dissipation and Low Inductance Commutation Cells. 1–8. 2 indexed citations

Sharma, Ankit, et al.. (2019). Development of a novel 600V/50A power package with semiconductor chips sandwiched between PCB substrates using double-side Ag-sintering. 1–6. 1 indexed citations

Wilde, Juergen, et al.. (2019). Silver Sintering on Organic Substrates for the Embedding of Power Semiconductor Devices. FreiDok plus (Universitätsbibliothek Freiburg). 1443–1450. 3 indexed citations

Wilde, Juergen, et al.. (2018). Power Electronic Assemblies on Printed Wiring Boards Mounted by Silver Sintering. FreiDok plus (Universitätsbibliothek Freiburg). 1–6. 4 indexed citations

10.

Sharma, Ankit, et al.. (2016). PCB embedded power package with reinforced top-side chip contacts. 1–5. 14 indexed citations

11.

Josifović, I., Till Huesgen, Jelena Popović-Gerber, & J.A. Ferreira. (2013). Thermal performance of double-sided SMT capacitors: Operation and soldering. 1091–1097.

12.

Huesgen, Till, et al.. (2012). Performance improvement of a micro thermomechanical generator by incorporating Galinstan® micro droplet arrays. Journal of Micromechanics and Microengineering. 22(9). 94002–94002. 2 indexed citations

13.

Huesgen, Till. (2012). Thermal resistance of snap-in type aluminum electrolytic capacitor attached to heat sink. 1338–1345. 4 indexed citations

14.

Huesgen, Till, et al.. (2011). A self-sustaining pyroelectric energy harvester utilizing spatial thermal gradients. 657–660. 17 indexed citations

15.

Lemke, Thomas, et al.. (2011). Fabrication of a normally-closed microvalve utilizing lithographically defined silicone micro O-rings. Journal of Micromechanics and Microengineering. 21(2). 25011–25011. 10 indexed citations

16.

Huesgen, Till, Gabriel Lenk, Thomas Lemke, & Peter Woias. (2010). Bistable silicon microvalve with thermoelectrically driven thermopneumatic actuator for liquid flow control. 80. 1159–1162. 3 indexed citations

17.

Huesgen, Till & Peter Woias. (2010). A novel self-starting MEMS-heat engine for thermal energy harvesting. 136. 1179–1182. 4 indexed citations

18.

Ruhhammer, Johannes, Till Huesgen, & Peter Woias. (2009). Bistable switching with a thermoelectrically driven thermopneumatic actuator. TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference. 64. 33–36. 4 indexed citations

19.

Vulto, Paul, et al.. (2009). A full-wafer fabrication process for glass microfluidic chips with integrated electroplated electrodes by direct bonding of dry film resist. Journal of Micromechanics and Microengineering. 19(7). 77001–77001. 65 indexed citations

20.

Huesgen, Till, Peter Woias, & Norbert Kockmann. (2007). Design and fabrication of MEMS thermoelectric generators with high temperature efficiency. Sensors and Actuators A Physical. 145-146. 423–429. 158 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact