John Barrett
Impact in
- Human-Computer Interaction top 5%
- Virtual Reality Applications and Impacts
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrodeposition and Electroless Coatings
Papers in
-
- Electronic Packaging and Soldering Technologies 20
- 3D IC and TSV technologies 13
- Ultra-Wideband Communications Technology 6
- Advanced MEMS and NEMS Technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
-
- Ultrasonics and Acoustic Wave Propagation 4
- Co-authors
- Howard EhrlichmanG. KellyYuansong QiaoNiall MurrayChristian TimmererC. LydenW. E. QuinnGer Kelly
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)IEEE Transactions on Advanced Packaging (2 papers)IEEE Microwave and Wireless Components Letters (2 papers)Applied Surface Science (1 paper)
- Partner nations
- IrelandUnited StatesFrance
In The Last Decade
John Barrett
59 papers receiving 737 citations
Peers
Comparison fields: 5 of 91
- Human-Computer Interaction 92
- Electrical and Electronic Engineering 421
- Cognitive Neuroscience 124
- Mechanics of Materials 114
- Mechanical Engineering 153
Countries citing papers authored by John Barrett
This map shows the geographic impact of John Barrett's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John Barrett with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John Barrett more than expected).
Fields of papers citing papers by John Barrett
This network shows the impact of papers produced by John Barrett. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John Barrett. The network helps show where John Barrett may publish in the future.
Co-authorship network
The 25 scholars most cited alongside John Barrett, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 5 | |
| 2 | 2018 | 5 | |
| 3 | 2017 | 4 | |
| 4 | Experimental Analysis of a Wireless Sensor Network in a Multi-Chamber Metal Environment | 2016 | 5 |
| 5 | 2016 | 10 | |
| 6 | 2012 | 4 | |
| 7 | 2012 | 3 | |
| 8 | 2011 | 2 | |
| 9 | 2011 | 6 | |
| 10 | 2011 | 8 | |
| 11 | 2009 | 8 | |
| 12 | 2008 | 14 | |
| 13 | 2006 | 3 | |
| 14 | 2002 | 1 | |
| 15 | 1998 | 2 | |
| 16 | 1997 | 27 | |
| 17 | 1996 | 79 | |
| 18 | 1993 | 1 | |
| 19 | 1992 | 15 | |
| 20 | 1982 | 15 |
About John Barrett
John Barrett is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Automotive Engineering, Human-Computer Interaction and Mechanical Engineering, having authored 61 papers that have together received 789 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (13 papers), Ultra-Wideband Communications Technology (6 papers), Gyrotron and Vacuum Electronics Research (5 papers), Advanced MEMS and NEMS Technologies (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Ultrasonics and Acoustic Wave Propagation (4 papers) and Structural Health Monitoring Techniques (4 papers). The work is most often cited by research in Human-Computer Interaction (92 citations), Electrical and Electronic Engineering (421 citations), Cognitive Neuroscience (124 citations), Mechanics of Materials (114 citations) and Mechanical Engineering (153 citations). John Barrett has collaborated with scholars based in Ireland, United States and France. Frequent co-authors include Howard Ehrlichman, G. Kelly, Yuansong Qiao, Niall Murray, Christian Timmerer, C. Lyden, W. E. Quinn, Ger Kelly, G.M. Crean and Matthew O’Reilly. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Advanced Packaging, IEEE Microwave and Wireless Components Letters and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.