Erping Deng
Impact in
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- Silicon Carbide Semiconductor Technologies
- Electromagnetic Compatibility and Noise Suppression
- Electrostatic Discharge in Electronics
- Advancements in Semiconductor Devices and Circuit Design
- Silicon and Solar Cell Technologies
- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Mechanical Engineering top 10%
- Induction Heating and Inverter Technology
Papers in
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- Silicon Carbide Semiconductor Technologies 52
- Electrostatic Discharge in Electronics 17
- Electromagnetic Compatibility and Noise Suppression 15
- Advancements in Semiconductor Devices and Circuit Design 10
- Semiconductor materials and devices 9
- Silicon and Solar Cell Technologies 8
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- Induction Heating and Inverter Technology 7
- Heat Transfer and Optimization 6
- Co-authors
- Yongzhang HuangZhibin ZhaoJingyuan LiJie ChenJosef LutzXiang CuiPeng ZhangYanhao Wang
- Journals
- IEEE Transactions on Power Electronics (18 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (10 papers)Microelectronics Reliability (7 papers)IEEE Journal of Emerging and Selected Topics in Power Electronics (3 papers)IEEE Transactions on Electron Devices (2 papers)
In The Last Decade
Erping Deng
54 papers receiving 735 citations
Peers
Comparison fields: 5 of 31
- Electrical and Electronic Engineering 671
- Mechanical Engineering 202
- Control and Systems Engineering 48
- Condensed Matter Physics 23
- Automotive Engineering 20
Countries citing papers authored by Erping Deng
This map shows the geographic impact of Erping Deng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Erping Deng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Erping Deng more than expected).
Fields of papers citing papers by Erping Deng
This network shows the impact of papers produced by Erping Deng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Erping Deng. The network helps show where Erping Deng may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Erping Deng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 0 | |
| 4 | 2024 | 1 | |
| 5 | 2024 | 1 | |
| 6 | 2024 | 1 | |
| 7 | 2024 | 4 | |
| 8 | 2023 | 6 | |
| 9 | 2023 | 3 | |
| 10 | 2023 | 20 | |
| 11 | 2023 | 1 | |
| 12 | 2023 | 1 | |
| 13 | 2022 | 16 | |
| 14 | 2021 | 12 | |
| 15 | 2021 | 21 | |
| 16 | Power Cycling Capability of High Power IGBT Modules for Flexible HVDC System | 2020 | 1 |
| 17 | 2020 | 20 | |
| 18 | 2020 | 41 | |
| 19 | Influence of the Temperature on the Thermal Contact Resistance Within Press Pack IGBTs | 2016 | 2 |
| 20 | Analysis of the Reliability Difference Between IGBT Modules and Press-Pack IGBTs | 2016 | 1 |
About Erping Deng
Erping Deng is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Ceramics and Composites, Control and Systems Engineering and Condensed Matter Physics, having authored 59 papers that have together received 746 indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (52 papers), Electrostatic Discharge in Electronics (17 papers), Electromagnetic Compatibility and Noise Suppression (15 papers), Advancements in Semiconductor Devices and Circuit Design (10 papers), Semiconductor materials and devices (9 papers), Silicon and Solar Cell Technologies (8 papers), Induction Heating and Inverter Technology (7 papers) and Heat Transfer and Optimization (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (671 citations), Mechanical Engineering (202 citations), Control and Systems Engineering (48 citations), Condensed Matter Physics (23 citations) and Automotive Engineering (20 citations). Erping Deng has collaborated with scholars based in China, Germany and Hong Kong. Frequent co-authors include Yongzhang Huang, Zhibin Zhao, Jingyuan Li, Jie Chen, Josef Lutz, Xiang Cui, Peng Zhang, Yanhao Wang, Peng Zhang and Yushan Zhao. Their work appears in journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, IEEE Journal of Emerging and Selected Topics in Power Electronics and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.