Fred Barlow

1.5k citations

60 papers · 1.1k indexed · h-index 18

Impact in

Electrical and Electronic Engineering top 5%
- Silicon Carbide Semiconductor Technologies
- Advanced DC-DC Converters
- Electromagnetic Compatibility and Noise Suppression
- Multilevel Inverters and Converters
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Semiconductor materials and devices
Mechanical Engineering top 10%
- Aluminum Alloys Composites Properties

Papers in

Electrical and Electronic Engineering 53
- Electromagnetic Compatibility and Noise Suppression 21
- 3D IC and TSV technologies 17
- Silicon Carbide Semiconductor Technologies 17
- Electronic Packaging and Soldering Technologies 16
- Advanced DC-DC Converters 13
- Electrical and Thermal Properties of Materials 6
- Microwave Engineering and Waveguides 5
Architecture 1

Co-authors: Aicha Elshabini Juan Carlos Balda Takashi Hikihara Tsuyoshi Funaki Jeremy Junghans H. Alan Mantooth Alexander B. Lostetter Avinash S. Kashyap
Journals: IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Power Electronics (2 papers)Microelectronics Reliability (2 papers)Behaviour Research and Therapy (1 paper)Electronics (1 paper)
Partner nations: United States Japan Argentina

In The Last Decade

Fred Barlow

59 papers receiving 1.1k citations

Peers

Countries citing papers authored by Fred Barlow

Since Specialization

Citations

This map shows the geographic impact of Fred Barlow's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fred Barlow with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fred Barlow more than expected).

Fields of papers citing papers by Fred Barlow

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Fred Barlow. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fred Barlow. The network helps show where Fred Barlow may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Fred Barlow, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Fred Barlow Line = papers co-authored together Fred Barlow links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects IEEE Transactions on Components Packaging and Manufacturing Technology ·Oudainia, Sibel Özalp, Aicha Elshabini, Fred Barlow	2015	13
2	Thermal Cycling Reliability Study of Ag–In Joints Between Si Chips and Cu Substrates Made by Fluxless Processes IEEE Transactions on Components Packaging and Manufacturing Technology ·Rini Nurdini, JOSIAH E. QUINCY, Fred Barlow, Michelle do Carmo Vieira	2014	21
3	Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects Journal of Microelectronics and Electronic Packaging ·Oudainia, Sibel Özalp, Aicha Elshabini, Fred Barlow	2014	5
4	Numerical simulation of silicon wafer warpage due to thin film residual stresses 顾柯军, Gabriel P. Potirniche, Fred Barlow, Aicha Elshabini, 正博白浜, ابراهیم رجائیان	2013	17
5	Evaluation of Ceramic Substrates for High Power and High Temperature Applications Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ·حسين إبراهيم الصباغ, J Clark-Berry, Brian M. Patterson, Gabriel P. Potirniche, Aicha Elshabini, Fred Barlow	2011	3
6	Design methodology for designing second order microstrip dual-mode filters Iva Lujak, Fred Barlow, Aicha Elshabini	2009	2
7	Power Conversion With SiC Devices at Extremely High Ambient Temperatures IEEE Transactions on Power Electronics ·Tsuyoshi Funaki, Juan Carlos Balda, Jeremy Junghans, Avinash S. Kashyap, H. Alan Mantooth, Fred Barlow, Tsunenobu Kimoto Tsunenobu Kimoto, Takashi Hikihara	2007	264
8	Future trends in electronic packaging Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Aicha Elshabini, Muhammad Fadil Zaidi, Fred Barlow	2006	7
9	Characterization of SiC Diodes in Extremely High Temperature Ambient Tsuyoshi Funaki, M. Narayanan, H. Alan Mantooth, Juan Carlos Balda, Fred Barlow, Tsunenobu Kimoto, Takashi Hikihara	2006	15
10	Modeling-based design optimization of wafer-level and chip-scale packaging for RF-MEMS devices Zhanar Sapargalikyzy, Ajay P. Malshe, Fred Barlow	2005	3
11	SiC JFET dc characteristics under extremely high ambient temperatures IEICE Electronics Express ·Tsuyoshi Funaki, Juan Carlos Balda, Jeremy Junghans, Avinash S. Kashyap, Fred Barlow, H. Alan Mantooth, Tsunenobu Kimoto, Takashi Hikihara	2004	25
12	Low cost flex substrates for miniaturized electronic assemblies Microelectronics Reliability ·Fred Barlow, Alexander B. Lostetter, Aicha Elshabini	2002	27
13	A flip-chip power electronics packaging technology on a flexible polymeric substrates Yaoyao Qi, Simon S. Ang, Fred Barlow, Aicha Elshabini, K.J. Olejniczak, Ajay P. Malshe, Antonella Navarrete	2002	2
14	Microelectronics and electronic packaging education and research at Virginia Tech A. Elshabini-Riad, Fred Barlow	2002	3
15	Materials issues for solutions of Power Electronic Building Blocks (PEBB) Alexander B. Lostetter, James Webster, Kika Gutiérrez-Moyano Zimmermann, Fred Barlow, A. Elshabini-Riad, Austin Nelson	2002	1
16	Getting aggressive with passive devices IEEE Circuits and Devices Magazine ·Richard K. Ulrich, W.D. Brown, 王成明, Fred Barlow, Aicha Elshabini, Anthony Scaramozzi, Hameed A. Naseem, A. A. Yashina, J.P. Parkerson, チョウコハタケヤマ, I Putu Citra	2000	7
17	UBM Formation on Single Die/Dice for Flip Chip Applications VTechWorks (Virginia Tech) ·Alec Wright, Fred Barlow, Christiane Gupta, Aicha Elshabini	1999	3
18	The utilization of polymer thick film (PTF) and flex technologies for low cost Power electronics packaging of DC/DC down converters Alexander B. Lostetter, J. C. White, Fred Barlow, Aicha Elshabini	1999	1
19	Electronic Packaging Solutions for Power Electronic Building Blocks (PEBB) Fred Barlow, A. Elshabini-Riad, Douglas J. Nelson	1996	2
20	Quantitative studies on human spermatogenesis. I. Spermatogonia American Journal of Anatomy ·Edward C. Roosen‐Runge, Fred Barlow	1953	51

About Fred Barlow

Fred Barlow is a scholar working on Electrical and Electronic Engineering, Architecture, Astronomy and Astrophysics, Mechanical Engineering and Materials Chemistry, having authored 60 papers that have together received 1.1k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (21 papers), 3D IC and TSV technologies (17 papers), Silicon Carbide Semiconductor Technologies (17 papers), Electronic Packaging and Soldering Technologies (16 papers), Advanced DC-DC Converters (13 papers), Electrical and Thermal Properties of Materials (6 papers), Microwave Engineering and Waveguides (5 papers) and Lightning and Electromagnetic Phenomena (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (981 citations), Mechanical Engineering (189 citations), Automotive Engineering (60 citations), Reproductive Medicine (42 citations) and Ceramics and Composites (21 citations). Fred Barlow has collaborated with scholars based in United States, Japan and Argentina. Frequent co-authors include Aicha Elshabini, Juan Carlos Balda, Takashi Hikihara, Tsuyoshi Funaki, Jeremy Junghans, H. Alan Mantooth, Alexander B. Lostetter, Avinash S. Kashyap, Tsunenobu Kimoto Tsunenobu Kimoto and Edward C. Roosen‐Runge. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Power Electronics, Microelectronics Reliability, Behaviour Research and Therapy and Electronics.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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