Aicha Elshabini

704 total citations
39 papers, 476 citations indexed

About

Aicha Elshabini is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Aicha Elshabini has authored 39 papers receiving a total of 476 indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 9 papers in Mechanical Engineering and 8 papers in Materials Chemistry. Recurrent topics in Aicha Elshabini's work include Electronic Packaging and Soldering Technologies (15 papers), Electromagnetic Compatibility and Noise Suppression (14 papers) and 3D IC and TSV technologies (13 papers). Aicha Elshabini is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), Electromagnetic Compatibility and Noise Suppression (14 papers) and 3D IC and TSV technologies (13 papers). Aicha Elshabini collaborates with scholars based in United States, Bahrain and Canada. Aicha Elshabini's co-authors include Fred Barlow, Alexander B. Lostetter, Gang Wang, Gabriel P. Potirniche, Jeremy Junghans, R. Panneer Selvam, Juan Carlos Balda, Kimberly Y. Donaldson, D. P. H. Hasselman and Simon S. Ang and has published in prestigious journals such as IEEE Microwave and Wireless Components Letters, Electronics and Microelectronics Reliability.

In The Last Decade

Aicha Elshabini

37 papers receiving 436 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Aicha Elshabini United States 11 342 144 93 78 55 39 476
Qi-Chu Zhang Australia 16 425 1.2× 146 1.0× 49 0.5× 108 1.4× 59 1.1× 24 803
Ender Savrun United States 11 237 0.7× 182 1.3× 139 1.5× 123 1.6× 106 1.9× 40 467
Weiwei Gong China 13 334 1.0× 104 0.7× 65 0.7× 87 1.1× 60 1.1× 28 537
Harumichi Sato Japan 13 300 0.9× 96 0.7× 137 1.5× 97 1.2× 125 2.3× 53 517
Ho-Young Lee South Korea 10 340 1.0× 200 1.4× 91 1.0× 70 0.9× 83 1.5× 39 444
Alan Myers United States 15 441 1.3× 163 1.1× 199 2.1× 178 2.3× 23 0.4× 37 710
Pavel L. Komarov United States 13 251 0.7× 306 2.1× 73 0.8× 77 1.0× 160 2.9× 37 522
So Baba Japan 12 207 0.6× 232 1.6× 80 0.9× 29 0.4× 75 1.4× 25 364
R. E. Acosta United States 9 339 1.0× 86 0.6× 150 1.6× 69 0.9× 58 1.1× 32 477

Countries citing papers authored by Aicha Elshabini

Since Specialization
Citations

This map shows the geographic impact of Aicha Elshabini's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Aicha Elshabini with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Aicha Elshabini more than expected).

Fields of papers citing papers by Aicha Elshabini

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Aicha Elshabini. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Aicha Elshabini. The network helps show where Aicha Elshabini may publish in the future.

Co-authorship network of co-authors of Aicha Elshabini

This figure shows the co-authorship network connecting the top 25 collaborators of Aicha Elshabini. A scholar is included among the top collaborators of Aicha Elshabini based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Aicha Elshabini. Aicha Elshabini is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Elshabini, Aicha, et al.. (2015). Spectrally Accurate Causality Enforcement Using SVD-Based Fourier Continuations for High-Speed Digital Interconnects. IEEE Transactions on Components Packaging and Manufacturing Technology. 5(7). 991–1005. 13 indexed citations
2.
Elshabini, Aicha, et al.. (2014). Causality Verification Using Polynomial Periodic Continuations for Electrical Interconnects. Journal of Microelectronics and Electronic Packaging. 11(4). 181–196. 5 indexed citations
3.
4.
Potirniche, Gabriel P., et al.. (2013). Numerical simulation of silicon wafer warpage due to thin film residual stresses. 9–12. 17 indexed citations
5.
Patterson, Brian M., et al.. (2011). Evaluation of Ceramic Substrates for High Power and High Temperature Applications. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2011(CICMT). 199–206. 3 indexed citations
6.
Potirniche, Gabriel P., et al.. (2011). Finite element modeling of a back grinding process for Through Silicon Vias. 18. 1–4. 2 indexed citations
7.
Barlow, Fred, et al.. (2010). Develop procedure for designing fourth order microstrip dual-mode bandpass filters. 1. 236–240. 1 indexed citations
8.
Barlow, Fred, et al.. (2009). Design methodology for designing second order microstrip dual-mode filters. 15. 1–5. 2 indexed citations
9.
Elshabini, Aicha, et al.. (2006). Future trends in electronic packaging. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6172. 61720Z–61720Z. 7 indexed citations
10.
Wang, Gang, et al.. (2006). Fabrication of Microvias for Multilayer LTCC Substrates. IEEE Transactions on Electronics Packaging Manufacturing. 29(1). 32–41. 38 indexed citations
11.
Junghans, Jeremy, et al.. (2005). A novel packaging methodology for spray cooling of power semiconductor devices using dielectric liquids. Twentieth Annual IEEE Applied Power Electronics Conference and Exposition, 2005. APEC 2005.. 3. 2014–2018. 7 indexed citations
12.
13.
Barlow, Fred, Alexander B. Lostetter, & Aicha Elshabini. (2002). Low cost flex substrates for miniaturized electronic assemblies. Microelectronics Reliability. 42(7). 1091–1099. 27 indexed citations
14.
Lostetter, Alexander B., Fred Barlow, Aicha Elshabini, K.J. Olejniczak, & Simon S. Ang. (2002). Polymer thick film (PTF) and flex technologies for low cost power electronics packaging. 21. 33–40. 16 indexed citations
15.
16.
Selvam, R. Panneer & Aicha Elshabini. (2000). Nonlinear thermal stress and flow modeling in various electronic packages. 23(2). 224–233. 2 indexed citations
17.
Ulrich, Richard K., W.D. Brown, Fred Barlow, et al.. (2000). Getting aggressive with passive devices. IEEE Circuits and Devices Magazine. 16(5). 16–25. 7 indexed citations
18.
Lostetter, Alexander B., J. C. White, Fred Barlow, & Aicha Elshabini. (1999). The utilization of polymer thick film (PTF) and flex technologies for low cost Power electronics packaging of DC/DC down converters. 3906. 625–630. 1 indexed citations
19.
Barlow, Fred, et al.. (1999). UBM Formation on Single Die/Dice for Flip Chip Applications. VTechWorks (Virginia Tech). 3906. 39–44. 3 indexed citations
20.
Elshabini, Aicha. (1997). Thin Film Technology Handbook. Medical Entomology and Zoology. 139 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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