Zhenxian Liang
- Electrical and Electronic Engineering top 2%
- Mechanical Engineering top 10%
- Automotive Engineering top 10%
- Condensed Matter Physics top 10%
- Control and Systems Engineering
- Co-authors
- Fred WangPuqi NingJ.D. van WykZhiqiang WangF.C. LeeLeon M. TolbertBenjamin J. BlalockXiaojie Shi
- Topics
- Silicon Carbide Semiconductor Technologies (45 papers)Electronic Packaging and Soldering Technologies (32 papers)3D IC and TSV technologies (32 papers)
- Journals
- IEEE Transactions on Power ElectronicsIEEE Transactions on Industry ApplicationsIEEE Journal of Emerging and Selected Topics in Power Electronics
- Partner nations
- United StatesChinaSouth Africa
In The Last Decade
Zhenxian Liang
74 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 49
- Electrical and Electronic Engineering 1.7k
- Mechanical Engineering 307
- Automotive Engineering 104
- Condensed Matter Physics 84
- Control and Systems Engineering 62
Countries citing papers authored by Zhenxian Liang
This map shows the geographic impact of Zhenxian Liang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhenxian Liang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhenxian Liang more than expected).
Fields of papers citing papers by Zhenxian Liang
This network shows the impact of papers produced by Zhenxian Liang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhenxian Liang. The network helps show where Zhenxian Liang may publish in the future.
Co-authorship network of co-authors of Zhenxian Liang
This figure shows the co-authorship network connecting the top 25 collaborators of Zhenxian Liang. A scholar is included among the top collaborators of Zhenxian Liang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhenxian Liang. Zhenxian Liang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | Power module packaging with double sided planar interconnection and heat exchangers | 1 |
| 3 | Integrated packaging of multiple double sided cooling planar bond power modules | 0 |
| 4 | 59 | |
| 5 | 4 | |
| 6 | 55 | |
| 7 | 37 | |
| 8 | Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure | 16 |
| 9 | Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry | 10 |
| 10 | 10 | |
| 11 | Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules | 1 |
| 12 | 8 | |
| 13 | An integrated power electronics modular approach: concept and implementation | 27 |
| 14 | An integrated power switching stage with multichip planar interconnection construction | 2 |
| 15 | 1 | |
| 16 | 11 | |
| 17 | 3 | |
| 18 | 27 | |
| 19 | 75 | |
| 20 | Development of Measurement Capability for Micro-Vibration Evaluations with Application to Chip Fabrication Facilities | 13 |
About Zhenxian Liang
Zhenxian Liang is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Mechanical Engineering, having authored 76 papers that have together received 1.8k indexed citations. Recurring topics across this work include Silicon Carbide Semiconductor Technologies (45 papers), Electronic Packaging and Soldering Technologies (32 papers) and 3D IC and TSV technologies (32 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Automotive Engineering (104 citations) and Mechanical Engineering (307 citations). Zhenxian Liang has collaborated with scholars based in United States, China and South Africa. Frequent co-authors include Fred Wang, Puqi Ning, J.D. van Wyk, Zhiqiang Wang, F.C. Lee, Leon M. Tolbert, Benjamin J. Blalock, Xiaojie Shi, Daniel Costinett and Fei Yang. Their work appears in journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Industry Applications and IEEE Journal of Emerging and Selected Topics in Power Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.