Zhenxian Liang

2.4k total citations
76 papers, 1.8k citations indexed

About

Zhenxian Liang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, Zhenxian Liang has authored 76 papers receiving a total of 1.8k indexed citations (citations by other indexed papers that have themselves been cited), including 74 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 7 papers in Automotive Engineering. Recurrent topics in Zhenxian Liang's work include Silicon Carbide Semiconductor Technologies (45 papers), Electronic Packaging and Soldering Technologies (32 papers) and 3D IC and TSV technologies (32 papers). Zhenxian Liang is often cited by papers focused on Silicon Carbide Semiconductor Technologies (45 papers), Electronic Packaging and Soldering Technologies (32 papers) and 3D IC and TSV technologies (32 papers). Zhenxian Liang collaborates with scholars based in United States, China and South Africa. Zhenxian Liang's co-authors include Fred Wang, Puqi Ning, J.D. van Wyk, Zhiqiang Wang, F.C. Lee, Leon M. Tolbert, Benjamin J. Blalock, Xiaojie Shi, Daniel Costinett and Fei Yang and has published in prestigious journals such as IEEE Transactions on Power Electronics, IEEE Transactions on Industry Applications and IEEE Journal of Emerging and Selected Topics in Power Electronics.

In The Last Decade

Zhenxian Liang

74 papers receiving 1.7k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Zhenxian Liang United States 24 1.7k 307 104 84 62 76 1.8k
Ty McNutt United States 19 1.6k 1.0× 198 0.6× 192 1.8× 56 0.7× 93 1.5× 85 1.7k
Olayiwola Alatise United Kingdom 24 2.2k 1.3× 191 0.6× 89 0.9× 154 1.8× 108 1.7× 151 2.3k
Shan Yin China 19 1.1k 0.6× 278 0.9× 73 0.7× 87 1.0× 123 2.0× 88 1.3k
Szymon Bęczkowski Denmark 22 1.7k 1.0× 152 0.5× 67 0.6× 96 1.1× 89 1.4× 74 1.8k
Uwe Scheuermann Germany 18 1.6k 0.9× 184 0.6× 78 0.8× 48 0.6× 77 1.2× 29 1.6k
Yvan Avenas France 19 1.4k 0.8× 466 1.5× 89 0.9× 75 0.9× 114 1.8× 77 1.8k
Jacek Rąbkowski Poland 23 2.1k 1.2× 171 0.6× 127 1.2× 95 1.1× 220 3.5× 139 2.2k
Zoubir Khatir France 19 1.8k 1.1× 310 1.0× 357 3.4× 68 0.8× 175 2.8× 68 2.0k
Alexander B. Lostetter United States 16 949 0.6× 145 0.5× 170 1.6× 30 0.4× 55 0.9× 46 1.0k
Jose Ortiz Gonzalez United Kingdom 18 1.4k 0.8× 113 0.4× 46 0.4× 99 1.2× 52 0.8× 98 1.4k

Countries citing papers authored by Zhenxian Liang

Since Specialization
Citations

This map shows the geographic impact of Zhenxian Liang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Zhenxian Liang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Zhenxian Liang more than expected).

Fields of papers citing papers by Zhenxian Liang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Zhenxian Liang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Zhenxian Liang. The network helps show where Zhenxian Liang may publish in the future.

Co-authorship network of co-authors of Zhenxian Liang

This figure shows the co-authorship network connecting the top 25 collaborators of Zhenxian Liang. A scholar is included among the top collaborators of Zhenxian Liang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Zhenxian Liang. Zhenxian Liang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Liang, Zhenxian. (2025). A new statistical model with optimal fitting performance: Its assessments in management sciences and reliability. Alexandria Engineering Journal. 119. 545–557.
2.
Liang, Zhenxian. (2023). Power module packaging with double sided planar interconnection and heat exchangers. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 1 indexed citations
3.
Yang, Fei, Zhenxian Liang, Zhiqiang Wang, & Fred Wang. (2017). Design of a low parasitic inductance SiC power module with double-sided cooling. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 3057–3062. 59 indexed citations
4.
Yang, Fei, Zhenxian Liang, Zhiqiang Wang, & Fred Wang. (2016). Parasitic inductance extraction and verification for 3D planar bond all module. 1–15. 6 indexed citations
5.
Zhang, Zheyu, Ben Guo, Fred Wang, et al.. (2014). Impact of ringing on switching losses of wide band-gap devices in a phase-leg configuration. 37 indexed citations
6.
Liang, Zhenxian. (2014). Packaging technologies to exploit the attributes of WBG power electronics. 1–73. 4 indexed citations
7.
Onar, Omer C., Steven Campbell, Puqi Ning, John M. Miller, & Zhenxian Liang. (2013). Fabrication and evaluation of a high performance SiC inverter for wireless power transfer applications. 125–130. 5 indexed citations
8.
Liang, Zhenxian, Puqi Ning, Fred Wang, & Laura D. Marlino. (2012). Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure. 1–6. 16 indexed citations
9.
Wereszczak, Andrew A., et al.. (2012). Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry. 1–6. 10 indexed citations
10.
Xu, Zhuxian, Dong Jiang, Ming Li, et al.. (2012). Si IGBT phase-leg module packaging and cooling design for operation at 200 °C in hybrid electrical vehicle applications. 483–490. 10 indexed citations
11.
Lim, M. H., J.D. van Wyk, & Zhenxian Liang. (2008). Internal Geometry Variation of LTCC Inductors to Improve Light-Load Efficiency of DC-DC Converters. IEEE Transactions on Components and Packaging Technologies. 32(1). 3–11. 23 indexed citations
12.
Zhu, Ning Hua, J.D. van Wyk, & Zhenxian Liang. (2006). Thermo-mechanical Stress Analysis for Planar Metallization in Integrated Power Electronics Modules. 1–6. 1 indexed citations
13.
Lim, M. H., Zhenxian Liang, & J.D. van Wyk. (2006). Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications. 32. 593–599. 8 indexed citations
14.
Liang, Zhenxian, J.D. van Wyk, F.C. Lee, & Dushan Boroyevich. (2004). An integrated power switching stage with multichip planar interconnection construction. International Power Electronics and Motion Control Conference. 1. 364–369. 2 indexed citations
15.
Lee, F.C., et al.. (2004). An integrated power electronics modular approach: concept and implementation. International Power Electronics and Motion Control Conference. 1. 1–13. 27 indexed citations
16.
Wyk, J.D. van & Zhenxian Liang. (2004). The future of dielectric materials in electronic power processing. 2. 847–855. 1 indexed citations
17.
Liang, Zhenxian & F.C. Lee. (2002). Embedded power technology for IPEMs packaging applications. 2. 1057–1061. 27 indexed citations
18.
Liang, Zhenxian, et al.. (2002). Embedded power-a multilayer integration technology for packaging of IPEMs and PEBBs. 41–45. 6 indexed citations
19.
Lee, F.C., J.D. van Wyk, Dushan Boroyevich, et al.. (2002). Technology trends toward a system-in-a-module in power electronics. IEEE Circuits and Systems Magazine. 2(4). 4–22. 75 indexed citations
20.
Liang, Zhenxian, et al.. (1999). Development of Measurement Capability for Micro-Vibration Evaluations with Application to Chip Fabrication Facilities. 13 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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