Everett C. C. Yeh

14 papers receiving 834 citations

Peers

Everett C. C. Yeh
Comparison fields: 5 of 36
  • Electrical and Electronic Engineering 852
  • Electronic, Optical and Magnetic Materials 371
  • Mechanical Engineering 153
  • Atomic and Molecular Physics, and Optics 72
  • Materials Chemistry 39
Replace H. Gan with:
H. Gan United States
P. Elenius United States
King-Ning Tu United States
H. Balkan United States
Brook Chao United States
Kuan-Hsun Lu United States
Yi-Wun Wang Taiwan
E. Wolfgang Germany
Oliver Aubel Germany
M. Petras United States
Everett C. C. Yeh relative to H. Gan United States H. Gan's profile →
Citations per field
00.5×1.5×2.2×
H. Gan · 1×
Citations per year

Countries citing papers authored by Everett C. C. Yeh

Since Specialization
Citations

This map shows the geographic impact of Everett C. C. Yeh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Everett C. C. Yeh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Everett C. C. Yeh more than expected).

Fields of papers citing papers by Everett C. C. Yeh

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Everett C. C. Yeh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Everett C. C. Yeh. The network helps show where Everett C. C. Yeh may publish in the future.

Co-authorship network of co-authors of Everett C. C. Yeh

This figure shows the co-authorship network connecting the top 25 collaborators of Everett C. C. Yeh. A scholar is included among the top collaborators of Everett C. C. Yeh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Everett C. C. Yeh. Everett C. C. Yeh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

14 of 14 papers shown
#WorkIndexed citations
1 9
2 22
3
The Stress-dependent Permeability/Porosity Of Drilled Cores From TCDP Hole-A
1
4 228
5 193
6 35
7 301
8 15
9 2
10 12
11 36
12 2
13 9
14 8

About Everett C. C. Yeh

Everett C. C. Yeh is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Atomic and Molecular Physics, and Optics, having authored 14 papers that have together received 873 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (8 papers), Semiconductor materials and devices (6 papers) and Electronic Packaging and Soldering Technologies (6 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (371 citations), Electrical and Electronic Engineering (852 citations) and General Materials Science (20 citations). Everett C. C. Yeh has collaborated with scholars based in United States, Taiwan and Italy. Frequent co-authors include Woon‐Seop Choi, K. N. Tu, K. N. Tu, Neal Mielke, S. Rangan, H. Balkan, P. Elenius, Chih Chen, Shuqi Liang and T. L. Shao. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026