Everett C. C. Yeh

1.1k total citations
14 papers, 873 citations indexed

About

Everett C. C. Yeh is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Everett C. C. Yeh has authored 14 papers receiving a total of 873 indexed citations (citations by other indexed papers that have themselves been cited), including 11 papers in Electrical and Electronic Engineering, 8 papers in Electronic, Optical and Magnetic Materials and 5 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Everett C. C. Yeh's work include Copper Interconnects and Reliability (8 papers), Semiconductor materials and devices (6 papers) and Electronic Packaging and Soldering Technologies (6 papers). Everett C. C. Yeh is often cited by papers focused on Copper Interconnects and Reliability (8 papers), Semiconductor materials and devices (6 papers) and Electronic Packaging and Soldering Technologies (6 papers). Everett C. C. Yeh collaborates with scholars based in United States, Taiwan and Italy. Everett C. C. Yeh's co-authors include Woon‐Seop Choi, K. N. Tu, K. N. Tu, Neal Mielke, S. Rangan, H. Balkan, P. Elenius, Chih Chen, Shuqi Liang and T. L. Shao and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.

In The Last Decade

Everett C. C. Yeh

14 papers receiving 834 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Everett C. C. Yeh United States	10	852	371	153	72	39	14	873
H. Gan United States	8	583 0.7×	199 0.5×	120 0.8×	45 0.6×	30 0.8×	15	608
P. Elenius United States	13	718 0.8×	231 0.6×	272 1.8×	42 0.6×	20 0.5×	27	733
H. Balkan United States	9	526 0.6×	205 0.6×	229 1.5×	33 0.5×	16 0.4×	15	545
King-Ning Tu United States	4	307 0.4×	107 0.3×	136 0.9×	26 0.4×	39 1.0×	6	338
Brook Chao United States	7	431 0.5×	171 0.5×	203 1.3×	28 0.4×	43 1.1×	12	453
Yi-Wun Wang Taiwan	14	684 0.8×	84 0.2×	535 3.5×	26 0.4×	58 1.5×	35	750
Kuan-Hsun Lu United States	6	476 0.6×	104 0.3×	79 0.5×	43 0.6×	13 0.3×	9	481
E. Wolfgang Germany	11	224 0.3×	73 0.2×	32 0.2×	65 0.9×	44 1.1×	30	314
Ryszard Kisiel Poland	11	404 0.5×	32 0.1×	221 1.4×	40 0.6×	42 1.1×	67	456
M. Petras United States	10	206 0.2×	140 0.4×	29 0.2×	61 0.8×	71 1.8×	23	356

Countries citing papers authored by Everett C. C. Yeh

Since Specialization

Citations

This map shows the geographic impact of Everett C. C. Yeh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Everett C. C. Yeh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Everett C. C. Yeh more than expected).

Fields of papers citing papers by Everett C. C. Yeh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Everett C. C. Yeh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Everett C. C. Yeh. The network helps show where Everett C. C. Yeh may publish in the future.

Co-authorship network of co-authors of Everett C. C. Yeh

This figure shows the co-authorship network connecting the top 25 collaborators of Everett C. C. Yeh. A scholar is included among the top collaborators of Everett C. C. Yeh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Everett C. C. Yeh. Everett C. C. Yeh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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14 of 14 papers shown

Liang, Shuqi, T. L. Shao, Chih Chen, Everett C. C. Yeh, & K. N. Tu. (2006). Relieving the current crowding effect in flip-chip solder joints during current stressing. Journal of materials research/Pratt's guide to venture capital sources. 21(1). 137–146. 22 indexed citations

Yao, D. J., et al.. (2006). Temperature and current-density distributions in flip-chip solder joints with Cu traces. Journal of Electronic Materials. 35(5). 947–953. 9 indexed citations

Hsu, John R. C., et al.. (2005). The Stress-dependent Permeability/Porosity Of Drilled Cores From TCDP Hole-A. AGU Fall Meeting Abstracts. 2005. 1 indexed citations

Rangan, S., Neal Mielke, & Everett C. C. Yeh. (2004). Universal recovery behavior of negative bias temperature instability [PMOSFETs]. 14.3.1–14.3.4. 228 indexed citations

Choi, Woon‐Seop, Everett C. C. Yeh, K. N. Tu, P. Elenius, & H. Balkan. (2003). Electromigration of flip chip solder bump on Cu/Ni(V)/Al thin film under bump metallization. 1201–1205. 35 indexed citations

Choi, Woon‐Seop, Everett C. C. Yeh, & K. N. Tu. (2003). Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization. Journal of Applied Physics. 94(9). 5665–5671. 193 indexed citations

Yeh, Everett C. C., Woon‐Seop Choi, K. N. Tu, P. Elenius, & H. Balkan. (2002). Current-crowding-induced electromigration failure in flip chip solder joints. Applied Physics Letters. 80(4). 580–582. 301 indexed citations

Zhang, Zhibo, Jia-Sheng Huang, E. Martin, et al.. (2002). A Robust Multilevel Interconnect Module for Subquartermicrometer Complementary Metal Oxide Semiconductor Technology Integration. Journal of The Electrochemical Society. 149(5). G324–G324. 2 indexed citations

Huang, Jia-Sheng, et al.. (2002). The effect of contact resistance on current crowding and electromigration in ULSI multi-level interconnects. Materials Chemistry and Physics. 77(2). 377–383. 15 indexed citations

10.

Yeh, Everett C. C. & K. N. Tu. (2001). Effects of contact resistance and film thickness on current crowding and the critical product of electromigration in Blech structures. Journal of Applied Physics. 89(6). 3203–3208. 12 indexed citations

11.

Yeh, Everett C. C. & K. N. Tu. (2000). Numerical simulation of current crowding phenomena and their effects on electromigration in very large scale integration interconnects. Journal of Applied Physics. 88(10). 5680–5686. 36 indexed citations

12.

Yeh, Everett C. C., et al.. (1998). Study on the Electrical Conduction of p+ Porous Silicon. physica status solidi (a). 165(1). 63–67. 2 indexed citations

13.

Yeh, Everett C. C., et al.. (1998). Electrical conductance simulation of two-dimensional directional site percolated networks for porous silicon structures. Journal of Applied Physics. 83(1). 326–331. 9 indexed citations

14.

Yeh, Everett C. C., et al.. (1997). Computer simulation of percolated porous Si structure and its application to electrical conductivity simulation. Thin Solid Films. 297(1-2). 88–91. 8 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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