Ron Anderson

675 total citations
22 papers, 476 citations indexed

About

Ron Anderson is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films and Biomedical Engineering. According to data from OpenAlex, Ron Anderson has authored 22 papers receiving a total of 476 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 11 papers in Surfaces, Coatings and Films and 9 papers in Biomedical Engineering. Recurrent topics in Ron Anderson's work include Integrated Circuits and Semiconductor Failure Analysis (11 papers), Electron and X-Ray Spectroscopy Techniques (11 papers) and Advanced Surface Polishing Techniques (8 papers). Ron Anderson is often cited by papers focused on Integrated Circuits and Semiconductor Failure Analysis (11 papers), Electron and X-Ray Spectroscopy Techniques (11 papers) and Advanced Surface Polishing Techniques (8 papers). Ron Anderson collaborates with scholars based in United States. Ron Anderson's co-authors include J. Benedict, D. R. Kerr, Steven J. Koester, J. O. Chu, H.‐S. Philip Wong, C. D’Emic, D. Canaperi, Lida Huang, Mohamed Chaker and P. M. Mooney and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Hazardous Materials.

In The Last Decade

Ron Anderson

19 papers receiving 431 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Ron Anderson United States	9	334	133	84	62	58	22	476
K.P. Purushotham United States	9	79 0.2×	201 1.5×	47 0.6×	31 0.5×	42 0.7×	13	334
Tomohiro Aoyama Japan	10	121 0.4×	134 1.0×	31 0.4×	70 1.1×	32 0.6×	38	357
R. K. Hart United States	9	100 0.3×	262 2.0×	43 0.5×	62 1.0×	27 0.5×	18	417
K. Ibe Japan	9	141 0.4×	110 0.8×	34 0.4×	23 0.4×	100 1.7×	21	333
Tian T. Li United States	13	85 0.3×	250 1.9×	42 0.5×	9 0.1×	33 0.6×	30	566
Yen-Hsing Liu Taiwan	11	176 0.5×	167 1.3×	119 1.4×	71 1.1×	60 1.0×	22	405
W. Hänni Switzerland	13	230 0.7×	310 2.3×	142 1.7×	7 0.1×	239 4.1×	23	589
David W. Susnitzky United States	13	92 0.3×	294 2.2×	44 0.5×	30 0.5×	28 0.5×	31	453
P. E. Doherty United States	8	107 0.3×	221 1.7×	30 0.4×	31 0.5×	25 0.4×	13	400
K. Seshan United States	12	259 0.8×	172 1.3×	36 0.4×	8 0.1×	87 1.5×	33	362

Countries citing papers authored by Ron Anderson

Since Specialization

Citations

This map shows the geographic impact of Ron Anderson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ron Anderson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ron Anderson more than expected).

Fields of papers citing papers by Ron Anderson

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ron Anderson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ron Anderson. The network helps show where Ron Anderson may publish in the future.

Co-authorship network of co-authors of Ron Anderson

This figure shows the co-authorship network connecting the top 25 collaborators of Ron Anderson. A scholar is included among the top collaborators of Ron Anderson based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ron Anderson. Ron Anderson is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Chu, J. O., C. D’Emic, Steven J. Koester, et al.. (2002). Electron and hole mobility enhancement in strained SOI by wafer bonding. IEEE Transactions on Electron Devices. 49(9). 1566–1571. 43 indexed citations

Huang, Lixiao, J. O. Chu, C. D’Emic, et al.. (2002). Carrier mobility enhancement in strained Si-on-insulator fabricated by wafer bonding. 57–58. 23 indexed citations

Anderson, Ron. (2002). Comparison of Fib Tem Specimen Preparation Methods. Microscopy and Microanalysis. 8(S02). 44–45. 7 indexed citations

Huang, Lida, J. O. Chu, D. Canaperi, et al.. (2001). SiGe-on-insulator prepared by wafer bonding and layer transfer for high-performance field-effect transistors. Applied Physics Letters. 78(9). 1267–1269. 78 indexed citations

Anderson, Ron, et al.. (2000). FIB Dimpling: A Method for Preparing Plan-View TEM Specimens. Microscopy and Microanalysis. 6(S2). 506–507.

Anderson, Ron, et al.. (1999). Particle size separation via soil washing to obtain volume reduction. Journal of Hazardous Materials. 66(1-2). 89–98. 48 indexed citations

Anderson, Ron. (1998). Analytical Microscopy in the Real Semiconductor Processing World. Microscopy and Microanalysis. 4(5). 467–474.

Benedict, J., et al.. (1998). Preparation of Tem Plan View Sections on Specific Devices Using the Tripod Polisher. MRS Proceedings. 523. 2 indexed citations

Anderson, Ron, et al.. (1998). <title>Progress in video immersion using Panospheric imaging</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3363. 394–406. 3 indexed citations

10.

Anderson, Ron, et al.. (1997). Combined Tripod Polishing and Fib Method for Preparing Semiconductor Plan View Specimens. MRS Proceedings. 480. 10 indexed citations

11.

Benedict, J., et al.. (1993). Rapid preparation of semiconductor cross sections for TEM analysis. Proceedings annual meeting Electron Microscopy Society of America. 51. 708–709. 1 indexed citations

12.

Benedict, J., et al.. (1991). Recent Developments in the use of the Tripod Polisher for TEM Specimen Preparation. MRS Proceedings. 254. 72 indexed citations

13.

Anderson, Ron, et al.. (1991). TEM sample preparation with focused ion beams. Proceedings annual meeting Electron Microscopy Society of America. 49. 1108–1109. 1 indexed citations

14.

Anderson, Ron & J. Benedict. (1991). Precision Ion Milling of Layered, Multi-Element TEM Specimens with High Specimen Preparation Spatial Resolution. MRS Proceedings. 254. 4 indexed citations

15.

Benedict, J., et al.. (1990). A Procedure for Cross Sectioning Specific Semiconductor Devices for Both SEM and TEM Analysis. MRS Proceedings. 199. 44 indexed citations

16.

Bravman, J. C., Ron Anderson, & Michael L. McDonald. (1988). Specimen Preparation for Transmission Electron Microscopy of Materials (Materials Research Society Proceedings. Volume 115).. 6 indexed citations

17.

Benedict, J., et al.. (1987). A Grinding/Polishing Tool for TEM Sample Preparation. MRS Proceedings. 115. 56 indexed citations

18.

Anderson, Ron, et al.. (1980). TEM Analysis of Printed Circuit Board Copper Foil. Proceedings annual meeting Electron Microscopy Society of America. 38. 408–409. 1 indexed citations

19.

Anderson, Ron & D. R. Kerr. (1977). Evidence for surface asperity mechanism of conductivity in oxide grown on polycrystalline silicon. Journal of Applied Physics. 48(11). 4834–4836. 69 indexed citations

20.

Anderson, Ron & G.W. Neudeck. (1971). Flatness and Surface Roughness of Some Common Thin Film Substrate Materials. Journal of Vacuum Science and Technology. 8(2). 454–457. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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