Jae Pil Jung

3.5k total citations
190 papers, 2.8k citations indexed

About

Jae Pil Jung is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Jae Pil Jung has authored 190 papers receiving a total of 2.8k indexed citations (citations by other indexed papers that have themselves been cited), including 142 papers in Electrical and Electronic Engineering, 96 papers in Mechanical Engineering and 21 papers in Materials Chemistry. Recurrent topics in Jae Pil Jung's work include Electronic Packaging and Soldering Technologies (129 papers), 3D IC and TSV technologies (100 papers) and Advanced Welding Techniques Analysis (41 papers). Jae Pil Jung is often cited by papers focused on Electronic Packaging and Soldering Technologies (129 papers), 3D IC and TSV technologies (100 papers) and Advanced Welding Techniques Analysis (41 papers). Jae Pil Jung collaborates with scholars based in South Korea, Canada and Australia. Jae Pil Jung's co-authors include Ashutosh Sharma, Do-Hyun Jung, Jaephil Cho, Hu Young Jeong, Jang‐Soo Lee, Y. Zhou, Santosh Kumar, M. Mayer, Jörg Töpfer and A. Feltz and has published in prestigious journals such as Angewandte Chemie International Edition, Journal of Materials Science and Sensors.

In The Last Decade

Jae Pil Jung

180 papers receiving 2.7k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Jae Pil Jung South Korea 28 2.1k 1.3k 481 308 232 190 2.8k
Jingdong Guo China 31 1.8k 0.9× 748 0.6× 991 2.1× 126 0.4× 148 0.6× 128 2.4k
Jiajun Zhu China 27 762 0.4× 671 0.5× 890 1.9× 202 0.7× 133 0.6× 100 1.9k
Weibin Zhang China 22 688 0.3× 797 0.6× 646 1.3× 141 0.5× 180 0.8× 115 1.7k
V. Senthilkumar India 33 1.3k 0.6× 1.5k 1.2× 1.7k 3.5× 316 1.0× 190 0.8× 115 3.3k
Peng Fan China 28 1.6k 0.8× 792 0.6× 1.1k 2.3× 101 0.3× 117 0.5× 105 2.8k
Xiongxin Jiang China 29 1.5k 0.7× 2.0k 1.5× 438 0.9× 544 1.8× 130 0.6× 93 2.6k
Xiaoqing Si China 26 1.1k 0.5× 1.0k 0.8× 932 1.9× 762 2.5× 208 0.9× 135 2.5k
Qizhong Huang China 24 991 0.5× 720 0.5× 890 1.9× 319 1.0× 74 0.3× 117 2.1k
M. Schneider Germany 30 2.1k 1.0× 657 0.5× 672 1.4× 78 0.3× 263 1.1× 180 3.1k
Zhi Sun China 27 1.0k 0.5× 643 0.5× 546 1.1× 478 1.6× 319 1.4× 112 1.9k

Countries citing papers authored by Jae Pil Jung

Since Specialization
Citations

This map shows the geographic impact of Jae Pil Jung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jae Pil Jung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jae Pil Jung more than expected).

Fields of papers citing papers by Jae Pil Jung

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jae Pil Jung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jae Pil Jung. The network helps show where Jae Pil Jung may publish in the future.

Co-authorship network of co-authors of Jae Pil Jung

This figure shows the co-authorship network connecting the top 25 collaborators of Jae Pil Jung. A scholar is included among the top collaborators of Jae Pil Jung based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jae Pil Jung. Jae Pil Jung is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Jung, Jae Pil, et al.. (2024). Recent Progress of TGV Technology for High Performance Semiconductor Packaging. Journal of Welding and Joining. 42(2). 155–164. 4 indexed citations
2.
Sharma, Ashutosh, et al.. (2024). Electrochemical deposition of Sn-0.7Cu alloy modified with nano-WO3 for high-density mini-LED packaging. Journal of Materials Science Materials in Electronics. 35(14).
3.
Park, Jin Yong, et al.. (2023). Joining Si3N4 ceramic to Invar using Mo mesh and Cu foil interlayer. Materials Chemistry and Physics. 313. 128732–128732. 4 indexed citations
4.
Shin, Dong‐Sik, et al.. (2022). Welding Properties of Dissimilar Al-Cu Thin Plate by a Single-Mode Fiber Laser. Metals. 12(11). 1957–1957. 6 indexed citations
5.
Tewari, Saurabh, Susham Biswas, Bharat Lohani, et al.. (2021). Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals. 11(10). 1537–1537. 26 indexed citations
6.
Hwang, Seung Jun, et al.. (2020). Laser Micro Soldering and Soldering Factors. Journal of the Microelectronics and Packaging Society. 27(3). 1–8. 2 indexed citations
7.
Sharma, Ashutosh, et al.. (2019). Influence of Arc Brazing Parameters on Microstructure and Joint Properties of Electro-Galvanized Steel. Metals. 9(9). 1006–1006. 12 indexed citations
8.
Lee, Jeong‐Hyun, Do-Hyun Jung, & Jae Pil Jung. (2018). Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging. Journal of the Microelectronics and Packaging Society. 25(4). 9–15.
9.
Lee, Jeong‐Hyun, et al.. (2018). High Technology and Latest Trends of WBG Power Semiconductors. Journal of the Microelectronics and Packaging Society. 25(4). 17–23. 5 indexed citations
10.
Jung, Jae Pil, et al.. (2018). Aluminum alloys and their joining methods. Journal of the Microelectronics and Packaging Society. 25(2). 9–17. 2 indexed citations
11.
Sharma, Ashutosh, et al.. (2014). Effect of Soldering Temperature on Wetting and Optical Density of Dip Coated Sn and Sn-3.5Ag Solders. Materials and Manufacturing Processes. 30(1). 127–132. 9 indexed citations
12.
Jung, Jae Pil & Jianwei Wan. (2011). Wettability alteration upon reaction with scCO2: Silica, mica, and calcite. AGU Fall Meeting Abstracts. 2011. 1 indexed citations
13.
Hong, Sung Chul, Wonjoong Kim, & Jae Pil Jung. (2011). High-Speed Cu Filling into TSV and Non-PR Bumping for 3D Chip Packaging. Journal of the Microelectronics and Packaging Society. 18(4). 49–53. 5 indexed citations
14.
Jung, Jae Pil, et al.. (2011). Joining of Ceramic and Metal using Active Metal Brazing. Journal of the Microelectronics and Packaging Society. 18(3). 1–7. 4 indexed citations
15.
Hong, Sungjun, Sung-Chul Hong, Wonjoong Kim, & Jae Pil Jung. (2010). Copper Filling to TSV (Through-Si-Via) and Simplification of Bumping Process. Journal of the Microelectronics and Packaging Society. 17(3). 79–84. 7 indexed citations
16.
Jung, Jae Pil, et al.. (2006). OVERVIEW OF FRETTING CORROSION IN ELECTRICAL CONNECTORS. International Journal of Automotive Technology. 7(1). 75–83. 13 indexed citations
17.
Park, Jae-Yong, et al.. (2000). Study on the Soldering of Off-eutectic Pb-Sn Solders in Partial Melting State. Journal of the Microelectronics and Packaging Society. 7(2). 63–68. 1 indexed citations
18.
19.
Jung, Jae Pil, et al.. (1997). Interfacial Phases in Diffusion-Bonded Joints of Al-X Alloys (X=Mg,Si,Mn,Zn,Cu). Diffusion-Bonding Mechanism of Al Alloys by Transmission Electron Microscopy. (Report 5).. QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY. 15(2). 352–358. 1 indexed citations
20.
Jung, Jae Pil. (1984). Investigation of various end joints in parallel-laminated veneer. Forest Products Journal. 34(5). 51–55. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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