Ming-Chun Hsieh
- Biomaterials top 10%
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- Electronic Packaging and Soldering Technologies 9
- 3D IC and TSV technologies 6
- Silicon Carbide Semiconductor Technologies 4
- Nanomaterials and Printing Technologies 4
- Electrodeposition and Electroless Coatings 4
- Photonic and Optical Devices 3
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- Aluminum Alloys Composites Properties 6
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- Nanoporous metals and alloys 3
- Co-authors
- Katsuaki SuganumaMasaya NogiChangjae KimChuantong ChenAiji SuetakeHirotaka KogaDongjin KimZheng Zhang
- Partner nations
- JapanTaiwanSouth Korea
In The Last Decade
Ming-Chun Hsieh
28 papers receiving 433 citations
Peers
Comparison fields: 5 of 44
- Biomaterials 141
- Ceramics and Composites 33
- Electrical and Electronic Engineering 247
- Surfaces, Coatings and Films 26
- Electronic, Optical and Magnetic Materials 65
Countries citing papers authored by Ming-Chun Hsieh
This map shows the geographic impact of Ming-Chun Hsieh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ming-Chun Hsieh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ming-Chun Hsieh more than expected).
Fields of papers citing papers by Ming-Chun Hsieh
This network shows the impact of papers produced by Ming-Chun Hsieh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ming-Chun Hsieh. The network helps show where Ming-Chun Hsieh may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Ming-Chun Hsieh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 1 | |
| 3 | 2024 | 1 | |
| 4 | 2024 | 0 | |
| 5 | 2024 | 1 | |
| 6 | 2024 | 1 | |
| 7 | 2023 | 3 | |
| 8 | 2023 | 2 | |
| 9 | 2022 | 1 | |
| 10 | 2022 | 8 | |
| 11 | 2022 | 15 | |
| 12 | 2021 | 3 | |
| 13 | 2021 | 27 | |
| 14 | 2017 | 80 | |
| 15 | 2013 | 122 | |
| 16 | 2011 | 16 | |
| 17 | 2003 | 1 | |
| 18 | 2002 | 5 | |
| 19 | 2002 | 3 | |
| 20 | 2002 | 16 |
About Ming-Chun Hsieh
Ming-Chun Hsieh is a scholar working on Electrical and Electronic Engineering, Biomaterials and Ceramics and Composites, having authored 31 papers that have together received 445 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (9 papers), 3D IC and TSV technologies (6 papers), Aluminum Alloys Composites Properties (6 papers), Silicon Carbide Semiconductor Technologies (4 papers), Nanomaterials and Printing Technologies (4 papers), Electrodeposition and Electroless Coatings (4 papers), Nanoporous metals and alloys (3 papers) and Photonic and Optical Devices (3 papers). The work is most often cited by research in Biomaterials (141 citations), Ceramics and Composites (33 citations) and Electrical and Electronic Engineering (247 citations). Ming-Chun Hsieh has collaborated with scholars based in Japan, Taiwan and South Korea. Frequent co-authors include Katsuaki Suganuma, Masaya Nogi, Changjae Kim, Chuantong Chen, Aiji Suetake, Hirotaka Koga, Dongjin Kim, Zheng Zhang, Chunsheng Lin and S.F. Ting.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.