B.J. Rubin

1.9k citations

63 papers · 1.2k indexed · h-index 18

Electrical and Electronic Engineering top 5%
- Electromagnetic Compatibility and Noise Suppression 39
- 3D IC and TSV technologies 18
- Electromagnetic Simulation and Numerical Methods 11
- Microwave and Dielectric Measurement Techniques 11
- Low-power high-performance VLSI design 10
- Electromagnetic Compatibility and Measurements 10
Hardware and Architecture top 5%
Aerospace Engineering top 5%
- Advanced Antenna and Metasurface Technologies 16
Atomic and Molecular Physics, and Optics top 10%
- Electromagnetic Scattering and Analysis 20
Electronic, Optical and Magnetic Materials

Co-authors: S. Daijavad A. Deutsch G.V. Kopcsay C.W. Surovic Lewis M. Terman Rajiv Dunne Tom Gallo R.H. Dennard
Cited by: Electrical and Electronic Engineering Hardware and Architecture Aerospace Engineering
Journals: IEEE Transactions on Microwave Theory and Techniques (6 papers)IEEE Transactions on Antennas and Propagation (4 papers)IEEE Transactions on Advanced Packaging (4 papers)
Partner nations: United States Germany Israel

In The Last Decade

B.J. Rubin

58 papers receiving 1.1k citations

Peers

Countries citing papers authored by B.J. Rubin

Since Specialization

Citations

This map shows the geographic impact of B.J. Rubin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B.J. Rubin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B.J. Rubin more than expected).

Fields of papers citing papers by B.J. Rubin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by B.J. Rubin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B.J. Rubin. The network helps show where B.J. Rubin may publish in the future.

Co-authorship network

The 25 scholars most cited alongside B.J. Rubin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with B.J. Rubin Line = papers co-authored together B.J. Rubin links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer The HKU Scholars Hub (University of Hong Kong) ·J. Morsey,Lijun Jiang,B.J. Rubin,A. Deutsch,C.W. Surovic,Dale Becker,Alexandra Hopfner-Stasiewski	2008	3
2	Novel Capacitance Extraction Method Using Direct Boundary Integral Equation Method and Hierarchical Approach The HKU Scholars Hub (University of Hong Kong) ·Л. Д. Панова,B.J. Rubin,J. Morsey,Hongqing Hu,Ibrahim M. Elfadel	2006	4
3	Computer Security Education and Research: Handle with Care IEEE Security & Privacy ·B.J. Rubin,Lílian Rodrigues de Lima Costa Suzuki	2006	7
4	Principles for Physical-Based Gridding of Package Structures B.J. Rubin	2006	0
5	Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- and multi-chip modules Sungjun Chun,Alexandra Hopfner-Stasiewski,A. Deutsch,B.J. Rubin,C.W. Surovic,Shirley Anggraini Tunggadewi,Daniel O’Connor,祐太根本,Росляков И. В.,Zaksas, Matas,,Masaaki Sakakibara,G. Katopis,G.V. Kopcsay	2005	3
6	Extraction of ε(f) and tan δ(f) for BT insulator up to 30GHz using the short pulse propagation technique Electrical Performance of Electronic Packaging ·A. Deutsch,G.V. Kopcsay,C.W. Surovic,B.J. Rubin,G. Katopis,B. Chamberlin	2003	0
7	Using shadow lines to assure accurate signal return current in electrical package analysis codes B.J. Rubin	2003	0
8	A comprehensive 2-D inductance modeling approach for VLSI interconnects: frequency-dependent extraction and compact circuit model synthesis IEEE Transactions on Very Large Scale Integration (VLSI) Systems ·G.V. Kopcsay,B. Krauter,N. Lipsman,A. Deutsch,B.J. Rubin,H.H. Smith	2002	21
9	Design guidelines for short, medium, and long on-chip interconnections Electrical Performance of Electronic Packaging ·A. Deutsch,Dale Becker,G. Katopis,H. Smith,P.J. Restle,P. Coteus,C.W. Surovic,G.V. Kopcsay,B.J. Rubin,Rajiv Dunne,Tom Gallo,K.A. Jenkins,Lewis M. Terman,R.H. Dennard,D.R. Knebel	2002	14
10	Understanding modeling and measurements of differential transmission lines B.J. Rubin	2002	1
11	Challenges raised by long on-chip wiring for CMOS microprocessor applications A. Deutsch,G.V. Kopcsay,C.W. Surovic,B.J. Rubin,Lewis M. Terman,Rajiv Dunne,Tom Gallo	2002	3
12	Canonical package problem solved using six different codes B.J. Rubin	2002	2
13	The San Francisco project: an object-oriented framework approach to building business applications Yasushi Mizoue,J. Kiełbiński,Anders Nilsson,B.J. Rubin	2002	5
14	General solution for propagation, radiation and scattering in arbitrary 3D inhomogeneous structures IEEE Antennas and Propagation Magazine ·B.J. Rubin	1992	9
15	Measurement of particle size and electrostatic charge distributions on toners using E-SPART analyzer IEEE Transactions on Industry Applications ·Malay K. Mazumder,Yingjuan Li,Takashi Yokoyama,B.J. Rubin,D. Kamp	1991	75
16	Radiation and scattering from structures involving finite-size dielectric regions IEEE Transactions on Antennas and Propagation ·B.J. Rubin,S. Daijavad	1990	75
17	Electrical considerations for interconnections inside a computer Fiber & Integrated Optics ·G. Arjavalingam,B.J. Rubin	1989	1
18	Automated Digital Analysis of Fiber Interferograms Textile Research Journal ·E. J. Roche,B.J. Rubin,Yelena Gofman	1987	10
19	Scattering from a periodic array of apertures or plates where the conductors have arbitrary shape, thickness, and resistivity B.J. Rubin	1985	1
20	The Propagation Characteristics of Signal Lines in a Mesh-Plane Environment IEEE Transactions on Microwave Theory and Techniques ·B.J. Rubin	1984	25

About B.J. Rubin

B.J. Rubin is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Atomic and Molecular Physics, and Optics, Statistics, Probability and Uncertainty and Management Information Systems, having authored 63 papers that have together received 1.2k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (39 papers), Electromagnetic Scattering and Analysis (20 papers), 3D IC and TSV technologies (18 papers), Advanced Antenna and Metasurface Technologies (16 papers), Electromagnetic Simulation and Numerical Methods (11 papers), Microwave and Dielectric Measurement Techniques (11 papers), Low-power high-performance VLSI design (10 papers) and Electromagnetic Compatibility and Measurements (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.1k citations), Hardware and Architecture (99 citations), Aerospace Engineering (232 citations), Atomic and Molecular Physics, and Optics (241 citations) and Electronic, Optical and Magnetic Materials (57 citations). B.J. Rubin has collaborated with scholars based in United States, Germany and Israel. Frequent co-authors include S. Daijavad, A. Deutsch, G.V. Kopcsay, C.W. Surovic, Lewis M. Terman, Rajiv Dunne, Tom Gallo, R.H. Dennard, H.L. Bertoni and G. Katopis. Their work appears in journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Antennas and Propagation, IEEE Transactions on Advanced Packaging, Textile Research Journal and IBM Journal of Research and Development.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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