Dale Becker

1.8k total citations
103 papers, 1.3k citations indexed

About

Dale Becker is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Computer Networks and Communications. According to data from OpenAlex, Dale Becker has authored 103 papers receiving a total of 1.3k indexed citations (citations by other indexed papers that have themselves been cited), including 93 papers in Electrical and Electronic Engineering, 19 papers in Hardware and Architecture and 8 papers in Computer Networks and Communications. Recurrent topics in Dale Becker's work include Electromagnetic Compatibility and Noise Suppression (70 papers), 3D IC and TSV technologies (40 papers) and Low-power high-performance VLSI design (25 papers). Dale Becker is often cited by papers focused on Electromagnetic Compatibility and Noise Suppression (70 papers), 3D IC and TSV technologies (40 papers) and Low-power high-performance VLSI design (25 papers). Dale Becker collaborates with scholars based in United States, Germany and Italy. Dale Becker's co-authors include G. Katopis, R. Mittra, B.D. McCredie, P.H. Harms, Jose A. Hejase, A. Deutsch, G.V. Kopcsay, Madhavan Swaminathan, C.W. Surovic and B.J. Rubin and has published in prestigious journals such as IEEE Access, Biological Conservation and IEEE Transactions on Microwave Theory and Techniques.

In The Last Decade

Dale Becker

96 papers receiving 1.2k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Dale Becker United States 17 1.1k 156 102 77 69 103 1.3k
Hui Wu United States 20 1.2k 1.1× 310 2.0× 8 0.1× 405 5.3× 55 0.8× 169 1.7k
Dariusz Makowski Poland 12 301 0.3× 68 0.4× 8 0.1× 100 1.3× 148 2.1× 125 556
Xiong Xu China 16 620 0.6× 25 0.2× 4 0.0× 78 1.0× 178 2.6× 89 932
Carles Ferrer Spain 12 229 0.2× 77 0.5× 9 0.1× 69 0.9× 177 2.6× 73 560
Andy Lambrechts Belgium 15 239 0.2× 211 1.4× 34 0.3× 186 2.4× 121 1.8× 64 938
L.D. Smith United States 18 997 0.9× 102 0.7× 55 0.7× 171 2.5× 48 1.2k
Byungjoon Lee South Korea 14 287 0.3× 24 0.2× 8 0.1× 159 2.1× 55 0.8× 62 641
Robert Twiggs United States 12 218 0.2× 31 0.2× 6 0.1× 94 1.2× 654 9.5× 41 792

Countries citing papers authored by Dale Becker

Since Specialization
Citations

This map shows the geographic impact of Dale Becker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dale Becker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dale Becker more than expected).

Fields of papers citing papers by Dale Becker

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dale Becker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dale Becker. The network helps show where Dale Becker may publish in the future.

Co-authorship network of co-authors of Dale Becker

This figure shows the co-authorship network connecting the top 25 collaborators of Dale Becker. A scholar is included among the top collaborators of Dale Becker based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Dale Becker. Dale Becker is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Ding, Yifan, et al.. (2022). Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs. 244–249. 1 indexed citations
2.
Becker, Dale, et al.. (2021). Package Power Distribution Current Density in Applications with Large Transient Currents. 1312–1316. 2 indexed citations
3.
Torun, Hakki Mert, Junyan Tang, Yanyan Zhang, et al.. (2021). Parallel Bayesian Active Learning using Dropout for Optimizing High-Speed Channel Equalization. 1–3. 2 indexed citations
4.
Connor, Samuel, Dale Becker, Matteo Cocchini, et al.. (2019). Physics-Based Circuit Modeling Methodology for System Power Integrity Analysis and Design. IEEE Transactions on Electromagnetic Compatibility. 62(4). 1266–1277. 13 indexed citations
5.
Yu, Huan, et al.. (2018). Polynomial Chaos modeling for jitter estimation in high-speed links. 3. 1–10. 3 indexed citations
6.
Tang, Junyan, Jose A. Hejase, Daniel Dreps, et al.. (2017). DC blocking capacitor interfacing for high speed communication buses. 1–3. 1 indexed citations
7.
Chun, Sungjun, Jose A. Hejase, Junyan Tang, et al.. (2017). Package and Printed Circuit Board Design of a 19.2 Gb/s Data Link for High-Performance Computing. 1701–1707. 8 indexed citations
8.
9.
Choi, Jinwoo, et al.. (2013). Effects of Mesh Planes on Signal Integrity in Glass Ceramic Packages for High-Performance Servers. 24(2). 35–50. 1 indexed citations
10.
11.
Harrer, H., G. Katopis, & Dale Becker. (2006). Feature - From chips to systems via packaging - A comparison of IBM's mainframe servers. IEEE Circuits and Systems Magazine. 6(4). 32–41. 1 indexed citations
12.
Stievano, Igor Simone, et al.. (2003). Behavioral modeling of IC ports including temperature effects. Electrical Performance of Electronic Packaging. 333–336. 3 indexed citations
13.
14.
Deutsch, A., H. Smith, C.W. Surovic, et al.. (2002). Frequency-dependent crosstalk modeling for on-chip interconnections. 35–38. 1 indexed citations
15.
Chen, Zhaoqing, et al.. (2002). Triangle impulse response (TIR) calculation for lossy transmission line simulation. 251–254. 3 indexed citations
16.
McAllister, M., et al.. (2001). Mid-frequency delta-I noise analysis of complex computer system boards with multiprocessor modules and verification by measurements. IEEE Transactions on Advanced Packaging. 24(3). 294–303. 14 indexed citations
17.
Deutsch, A., H.H. Smith, C.W. Surovic, et al.. (1999). Frequency-dependent crosstalk simulation for on-chip interconnections. IEEE Transactions on Advanced Packaging. 22(3). 292–308. 28 indexed citations
18.
Becker, Dale, et al.. (1998). Measurement of human surface sebum levels. Journal of Dermatological Science. 16. S214–S214. 2 indexed citations
19.
McCredie, B.D. & Dale Becker. (1996). Modeling, measurement, and simulation of simultaneous switching noise. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 19(3). 461–472. 61 indexed citations
20.
Becker, Dale, et al.. (1992). Modeling of On-Board and On-Chip Interconnected Digital Devices. International Symposium on Electromagnetic Compatibility. 1–6. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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