Dale Becker
Impact in
- Hardware and Architecture top 5%
- VLSI and Analog Circuit Testing
-
- Electromagnetic Compatibility and Noise Suppression
- Low-power high-performance VLSI design
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- VLSI and FPGA Design Techniques
- Electromagnetic Simulation and Numerical Methods
- Microwave Engineering and Waveguides
Papers in
-
- VLSI and Analog Circuit Testing 13
-
- Electromagnetic Compatibility and Noise Suppression 70
- 3D IC and TSV technologies 40
- Low-power high-performance VLSI design 25
- Electronic Packaging and Soldering Technologies 15
- Electrostatic Discharge in Electronics 14
- VLSI and FPGA Design Techniques 13
- Advancements in PLL and VCO Technologies 8
- Co-authors
- G. KatopisR. MittraB.D. McCredieP.H. HarmsJose A. HejaseA. DeutschG.V. KopcsayMadhavan Swaminathan
- Journals
- IBM Journal of Research and Development (6 papers)IEEE Transactions on Advanced Packaging (4 papers)IEEE Transactions on Microwave Theory and Techniques (3 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Electromagnetic Compatibility (2 papers)
- Partner nations
- United StatesGermanyItaly
In The Last Decade
Dale Becker
96 papers receiving 1.2k citations
Peers
Comparison fields: 5 of 70
- Hardware and Architecture 156
- Electrical and Electronic Engineering 1.1k
- Ecology 102
- Astronomy and Astrophysics 62
- Statistics, Probability and Uncertainty 27
Countries citing papers authored by Dale Becker
This map shows the geographic impact of Dale Becker's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dale Becker with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dale Becker more than expected).
Fields of papers citing papers by Dale Becker
This network shows the impact of papers produced by Dale Becker. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dale Becker. The network helps show where Dale Becker may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Dale Becker, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2022 | 1 | |
| 2 | 2021 | 2 | |
| 3 | 2021 | 2 | |
| 4 | 2019 | 13 | |
| 5 | 2018 | 3 | |
| 6 | 2017 | 1 | |
| 7 | 2017 | 8 | |
| 8 | 2016 | 110 | |
| 9 | Effects of Mesh Planes on Signal Integrity in Glass Ceramic Packages for High-Performance Servers | 2013 | 1 |
| 10 | 2008 | 3 | |
| 11 | 2006 | 1 | |
| 12 | 2003 | 3 | |
| 13 | 2003 | 11 | |
| 14 | 2002 | 1 | |
| 15 | 2002 | 3 | |
| 16 | 2001 | 14 | |
| 17 | 1999 | 28 | |
| 18 | 1998 | 2 | |
| 19 | 1996 | 61 | |
| 20 | 1992 | 1 |
About Dale Becker
Dale Becker is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Statistics, Probability and Uncertainty, Computer Networks and Communications and Astronomy and Astrophysics, having authored 103 papers that have together received 1.3k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (70 papers), 3D IC and TSV technologies (40 papers), Low-power high-performance VLSI design (25 papers), Electronic Packaging and Soldering Technologies (15 papers), Electrostatic Discharge in Electronics (14 papers), VLSI and FPGA Design Techniques (13 papers), VLSI and Analog Circuit Testing (13 papers) and Advancements in PLL and VCO Technologies (8 papers). The work is most often cited by research in Hardware and Architecture (156 citations), Electrical and Electronic Engineering (1.1k citations), Ecology (102 citations), Astronomy and Astrophysics (62 citations) and Statistics, Probability and Uncertainty (27 citations). Dale Becker has collaborated with scholars based in United States, Germany and Italy. Frequent co-authors include G. Katopis, R. Mittra, B.D. McCredie, P.H. Harms, Jose A. Hejase, A. Deutsch, G.V. Kopcsay, Madhavan Swaminathan, C.W. Surovic and B.J. Rubin. Their work appears in journals such as IBM Journal of Research and Development, IEEE Transactions on Advanced Packaging, IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Transactions on Electromagnetic Compatibility.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.