H.H. Smith

946 total citations
22 papers, 647 citations indexed

About

H.H. Smith is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Astronomy and Astrophysics. According to data from OpenAlex, H.H. Smith has authored 22 papers receiving a total of 647 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 5 papers in Hardware and Architecture and 1 paper in Astronomy and Astrophysics. Recurrent topics in H.H. Smith's work include Low-power high-performance VLSI design (15 papers), Electromagnetic Compatibility and Noise Suppression (14 papers) and 3D IC and TSV technologies (10 papers). H.H. Smith is often cited by papers focused on Low-power high-performance VLSI design (15 papers), Electromagnetic Compatibility and Noise Suppression (14 papers) and 3D IC and TSV technologies (10 papers). H.H. Smith collaborates with scholars based in United States and Germany. H.H. Smith's co-authors include A. Deutsch, G.V. Kopcsay, B. Krauter, C.W. Surovic, P. Coteus, G. Katopis, B.J. Rubin, Dale Becker, P.J. Restle and G.A. Sai-Halasz and has published in prestigious journals such as Proceedings of the IEEE, IEEE Journal of Solid-State Circuits and IEEE Transactions on Microwave Theory and Techniques.

In The Last Decade

H.H. Smith

22 papers receiving 611 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
H.H. Smith United States 10 619 155 66 37 21 22 647
Wayne Dai United States 9 460 0.7× 170 1.1× 35 0.5× 9 0.2× 9 0.4× 31 478
Joseph Kennedy United States 17 720 1.2× 116 0.7× 59 0.9× 138 3.7× 14 0.7× 37 753
C.J. Anderson United States 11 505 0.8× 78 0.5× 36 0.5× 37 1.0× 4 0.2× 27 551
Donald O. Pederson United States 6 223 0.4× 47 0.3× 18 0.3× 58 1.6× 34 1.6× 11 267
C.-S. Yen United States 8 259 0.4× 17 0.1× 20 0.3× 27 0.7× 68 3.2× 17 287
B. Cronquist United States 12 525 0.8× 327 2.1× 55 0.8× 14 0.4× 3 0.1× 33 546
David M. Hiemstra Canada 13 355 0.6× 167 1.1× 46 0.7× 12 0.3× 5 0.2× 81 509
Mizuki Motoyoshi Japan 13 607 1.0× 19 0.1× 25 0.4× 66 1.8× 9 0.4× 108 639
J.-H. Chern United States 8 374 0.6× 102 0.7× 23 0.3× 22 0.6× 1 0.0× 24 414
Qingjian Yu United States 8 240 0.4× 52 0.3× 13 0.2× 26 0.7× 28 1.3× 24 293

Countries citing papers authored by H.H. Smith

Since Specialization
Citations

This map shows the geographic impact of H.H. Smith's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H.H. Smith with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H.H. Smith more than expected).

Fields of papers citing papers by H.H. Smith

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H.H. Smith. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H.H. Smith. The network helps show where H.H. Smith may publish in the future.

Co-authorship network of co-authors of H.H. Smith

This figure shows the co-authorship network connecting the top 25 collaborators of H.H. Smith. A scholar is included among the top collaborators of H.H. Smith based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H.H. Smith. H.H. Smith is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Warnock, J., Seán Carey, H.H. Smith, et al.. (2011). Circuit and Physical Design Implementation of the Microprocessor Chip for the zEnterprise System. IEEE Journal of Solid-State Circuits. 47(1). 151–163. 18 indexed citations
2.
3.
Averill, R. M., Mark Bowen, P. J. Camporese, et al.. (2007). IBM POWER6 microprocessor physical design and design methodology. IBM Journal of Research and Development. 51(6). 685–714. 19 indexed citations
4.
Morsey, J., et al.. (2007). Parallelization of the Reduced-Coupling Technique for a Method-of-Moments-Based Field Solver Used for Product-Level Wide Data-Bus Analysis. The HKU Scholars Hub (University of Hong Kong). 337–340. 1 indexed citations
5.
Deutsch, A., H.H. Smith, B.J. Rubin, B. Krauter, & G.V. Kopcsay. (2006). New Methodology for Combined Simulation of Delta-I Noise Interaction With Interconnect Noise for Wide, On-Chip Data-Buses Using Lossy Transmission-Line Power-Blocks. IEEE Transactions on Advanced Packaging. 29(1). 11–20. 3 indexed citations
6.
Deutsch, A., H.H. Smith, B.J. Rubin, B. Krauter, & G.V. Kopcsay. (2005). Methodology to simulate delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks. Electrical Performance of Electronic Packaging. 295–298. 1 indexed citations
7.
Elfadel, Ibrahim M., A. Deutsch, G.V. Kopcsay, B.J. Rubin, & H.H. Smith. (2005). A CAD methodology and tool for the characterization of wide on-chip buses. IEEE Transactions on Advanced Packaging. 28(1). 63–70. 4 indexed citations
8.
Elfadel, Ibrahim M., A. Deutsch, H.H. Smith, B.J. Rubin, & G.V. Kopcsay. (2004). A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis. IEEE Transactions on Advanced Packaging. 27(1). 71–78. 7 indexed citations
9.
Deutsch, A., H.H. Smith, G.V. Kopcsay, et al.. (2003). Understanding common-mode noise on wide data-buses. 309–312. 6 indexed citations
10.
Kopcsay, G.V., et al.. (2002). A comprehensive 2-D inductance modeling approach for VLSI interconnects: frequency-dependent extraction and compact circuit model synthesis. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 10(6). 695–711. 21 indexed citations
11.
Smith, H.H., et al.. (2002). Analysis and results of net coupling within a high performance microprocessor. Electrical Performance of Electronic Packaging. 36–38. 1 indexed citations
12.
Smith, H.H., et al.. (2002). On-chip coupled noise analysis of a high performance S/390 microprocessor. 817–825. 4 indexed citations
13.
Curran, Brian, Y.H. Chan, P. J. Camporese, et al.. (2002). IBM eServer z900 high-frequency microprocessor technology, circuits, and design methodology. IBM Journal of Research and Development. 46(4.5). 631–644. 11 indexed citations
14.
Deutsch, A., P. Coteus, G.V. Kopcsay, et al.. (2001). On-chip wiring design challenges for gigahertz operation. Proceedings of the IEEE. 89(4). 529–555. 149 indexed citations
15.
Deutsch, A., H.H. Smith, C.W. Surovic, et al.. (1999). Frequency-dependent crosstalk simulation for on-chip interconnections. IEEE Transactions on Advanced Packaging. 22(3). 292–308. 28 indexed citations
16.
Katopis, G., et al.. (1999). MCM technology and design for the S/390 G5 system. IBM Journal of Research and Development. 43(5.6). 621–650. 20 indexed citations
17.
Averill, R. M., Mark Bowen, P. J. Camporese, et al.. (1999). Chip integration methodology for the IBM S/390 G5 and G6 custom microprocessors. IBM Journal of Research and Development. 43(5.6). 681–706. 34 indexed citations
18.
Smith, H.H. & G. Katopis. (1996). Multireflection algorithm for timed statistical coupled noise checking. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 19(3). 503–511. 5 indexed citations
19.
Katopis, G. & H.H. Smith. (1994). Coupled noise predictors for lossy interconnects. IEEE Transactions on Components Packaging and Manufacturing Technology Part B. 17(4). 520–524. 9 indexed citations
20.
Smith, H.H., et al.. (1992). Frequency characterization of a thin linear antenna using diakoptic antenna theory. IEEE Transactions on Antennas and Propagation. 40(3). 245–250. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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