H.H. Smith

946 citations

22 papers · 647 indexed · h-index 10

Impact in

Hardware and Architecture top 5%
- VLSI and Analog Circuit Testing
Electrical and Electronic Engineering top 10%
- Low-power high-performance VLSI design
- Electromagnetic Compatibility and Noise Suppression
- VLSI and FPGA Design Techniques
- 3D IC and TSV technologies
- Semiconductor materials and devices
- Advancements in PLL and VCO Technologies

Papers in ⓘ

Electrical and Electronic Engineering 22
- Low-power high-performance VLSI design 15
- Electromagnetic Compatibility and Noise Suppression 14
- 3D IC and TSV technologies 10
- VLSI and FPGA Design Techniques 8
- Integrated Circuits and Semiconductor Failure Analysis 2
- Radio Frequency Integrated Circuit Design 1
Hardware and Architecture 5
- VLSI and Analog Circuit Testing 5

Co-authors: A. Deutsch (12 shared papers)G.V. Kopcsay (10 shared papers)B. Krauter (7 shared papers)C.W. Surovic (5 shared papers)P. Coteus (4 shared papers)G. Katopis (5 shared papers)B.J. Rubin (6 shared papers)P.J. Restle (3 shared papers)
Journals: IEEE Transactions on Advanced Packaging (4 papers)IBM Journal of Research and Development (4 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Proceedings of the IEEE (1 paper)
Partner nations: United States Germany

In The Last Decade

H.H. Smith

22 papers receiving 611 citations

Peers

Countries citing papers authored by H.H. Smith

Since Specialization

Citations

This map shows the geographic impact of H.H. Smith's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H.H. Smith with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H.H. Smith more than expected).

Fields of papers citing papers by H.H. Smith

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H.H. Smith. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H.H. Smith. The network helps show where H.H. Smith may publish in the future.

Co-authors

The 25 scholars most cited alongside H.H. Smith, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with H.H. Smith Line = papers co-authored together H.H. Smith links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 22 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	When are transmission-line effects important for on-chip interconnections? IEEE Transactions on Microwave Theory and Techniques ·A. Deutsch, G.V. Kopcsay, P.J. Restle, H.H. Smith, G. Katopis, Dale Becker, P. Coteus, C.W. Surovic, B.J. Rubin, Rajiv Dunne, Tom Gallo, K.A. Jenkins, Lewis M. Terman, R.H. Dennard, G.A. Sai-Halasz, B. Krauter, D.R. Knebel	1997	291
2	On-chip wiring design challenges for gigahertz operation Proceedings of the IEEE ·A. Deutsch, P. Coteus, G.V. Kopcsay, H.H. Smith, C.W. Surovic, B. Krauter, D. Edelstein, P.L. Restle	2001	149
3	Chip integration methodology for the IBM S/390 G5 and G6 custom microprocessors IBM Journal of Research and Development ·R. M. Averill, K. Barkley, Mark Bowen, P. J. Camporese, A.H. Dansky, R. F. Hatch, D. E. Hoffman, M. Mayo, S. A. McCabe, T. G. McNamara, T. McPherson, G. A. Northrop, L. Sigal, H.H. Smith, Daniel Webber, Paul M. Williams	1999	34
4	Frequency-dependent crosstalk simulation for on-chip interconnections IEEE Transactions on Advanced Packaging ·A. Deutsch, H.H. Smith, C.W. Surovic, G.V. Kopcsay, Daniel Webber, P. Coteus, G. Katopis, Dale Becker, A.H. Dansky, G.A. Sai-Halasz, P.J. Restle	1999	28
5	A comprehensive 2-D inductance modeling approach for VLSI interconnects: frequency-dependent extraction and compact circuit model synthesis IEEE Transactions on Very Large Scale Integration (VLSI) Systems ·G.V. Kopcsay, B. Krauter, D. Widiger, A. Deutsch, B.J. Rubin, H.H. Smith	2002	21
6	MCM technology and design for the S/390 G5 system IBM Journal of Research and Development ·G. Katopis, Dale Becker, T. R. Mazzawy, H.H. Smith, C. K. Vakirtzis, S. Kuppinger, B. Singh, Pao‐Chun Lin, J. Bartells, G. V. Kihlmire, P. Venkatachalam, H. Stoller, Jason Frankel	1999	20
7	IBM POWER6 microprocessor physical design and design methodology IBM Journal of Research and Development ·Rob Berridge, R. M. Averill, A. E. Barish, Mark Bowen, P. J. Camporese, J. DiLullo, PETER DUDLEY, Joachim Keinert, Daniel W. Lewis, Rolf Morel, T. Rosser, Nicole Schwartz, P. Shephard, H.H. Smith, Donald E. Thomas, P.J. Restle, J. R. Ripley, Steve Runyon, Paul M. Williams	2007	19
8	Circuit and Physical Design Implementation of the Microprocessor Chip for the zEnterprise System IEEE Journal of Solid-State Circuits ·J. Warnock, Yiu-Hing Chan, Seán Carey, Huajun Wen, P. J. Meaney, G. Gerwig, H.H. Smith, Y.H. Chan, John D. Davis, P. Bunce, Antonio Pelella, D. Rodko, Pradip Patel, Thomas Strach, D. W. Malone, Frank Malgioglio, José Neves, David L. Rude, W. Huott	2011	18
9	IBM eServer z900 high-frequency microprocessor technology, circuits, and design methodology IBM Journal of Research and Development ·Brian Curran, Y.H. Chan, P. T. Wu, P. J. Camporese, G. A. Northrop, R. F. Hatch, Lisa Lacey, J.P. Eckhardt, David Hui, H.H. Smith	2002	11
10	Coupled noise predictors for lossy interconnects IEEE Transactions on Components Packaging and Manufacturing Technology Part B ·G. Katopis, H.H. Smith	1994	9
11	A multiconductor transmission line methodology for global on-chip interconnect modeling and analysis IEEE Transactions on Advanced Packaging ·Ibrahim M. Elfadel, A. Deutsch, H.H. Smith, B.J. Rubin, G.V. Kopcsay	2004	7
12	Multi-line crosstalk and common-mode noise analysis A. Deutsch, H.H. Smith, G.V. Kopcsay, B. Krauter, C.W. Surovic, P. Coteus	2002	7
13	Understanding common-mode noise on wide data-buses A. Deutsch, H.H. Smith, G.V. Kopcsay, B. Krauter, C.W. Surovic, Ibrahim M. Elfadel, D. Widiger	2003	6
14	Effect of noise on timing or data-pattern dependent delay variation when transmission-line effects are taken into account for on-chip wiring A. Deutsch, H.H. Smith, C. K. Vakirtzis, Joseph Kozhaya, L. Greenberg	2007	5
15	Multireflection algorithm for timed statistical coupled noise checking IEEE Transactions on Components Packaging and Manufacturing Technology Part B ·H.H. Smith, G. Katopis	1996	5
16	On-chip coupled noise analysis of a high performance S/390 microprocessor A.H. Dansky, H.H. Smith, Paul M. Williams	2002	4
17	A CAD methodology and tool for the characterization of wide on-chip buses IEEE Transactions on Advanced Packaging ·Ibrahim M. Elfadel, A. Deutsch, G.V. Kopcsay, B.J. Rubin, H.H. Smith	2005	4
18	Frequency characterization of a thin linear antenna using diakoptic antenna theory IEEE Transactions on Antennas and Propagation ·Edip Niver, H.H. Smith, G. M. Whitman	1992	3
19	New Methodology for Combined Simulation of Delta-I Noise Interaction With Interconnect Noise for Wide, On-Chip Data-Buses Using Lossy Transmission-Line Power-Blocks IEEE Transactions on Advanced Packaging ·A. Deutsch, H.H. Smith, B.J. Rubin, B. Krauter, G.V. Kopcsay	2006	3
20	Analysis and results of net coupling within a high performance microprocessor Electrical Performance of Electronic Packaging ·A.H. Dansky, H.H. Smith, Paul M. Williams	2002	1

About H.H. Smith

H.H. Smith is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Astronomy and Astrophysics, Atomic and Molecular Physics, and Optics and Aerospace Engineering, having authored 22 papers that have together received 647 indexed citations. Recurring topics across this work include Low-power high-performance VLSI design (15 papers), Electromagnetic Compatibility and Noise Suppression (14 papers), 3D IC and TSV technologies (10 papers), VLSI and FPGA Design Techniques (8 papers), VLSI and Analog Circuit Testing (5 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), Analog and Mixed-Signal Circuit Design (1 paper) and Radio Frequency Integrated Circuit Design (1 paper). The work is most often cited by research in Hardware and Architecture (155 citations), Electrical and Electronic Engineering (619 citations), Computer Networks and Communications (66 citations), Astronomy and Astrophysics (21 citations) and Electronic, Optical and Magnetic Materials (20 citations). H.H. Smith has collaborated with scholars based in United States and Germany. Frequent co-authors include A. Deutsch, G.V. Kopcsay, B. Krauter, C.W. Surovic, P. Coteus, G. Katopis, B.J. Rubin, P.J. Restle, Dale Becker and G.A. Sai-Halasz. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE Journal of Solid-State Circuits and Proceedings of the IEEE.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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