Sungjun Chun
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- Electromagnetic Compatibility and Noise Suppression 26
- 3D IC and TSV technologies 15
- Electronic Packaging and Soldering Technologies 7
- Advancements in PLL and VCO Technologies 6
- Electrostatic Discharge in Electronics 5
- Semiconductor Lasers and Optical Devices 3
- Microwave Engineering and Waveguides 3
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- VLSI and Analog Circuit Testing 4
- Co-authors
- Madhavan SwaminathanL.D. SmithM.K. IyerDaniel DrepsZhaoqing ChenDale BeckerRobert AndersonRao Tummala
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)IBM Journal of Research and Development (1 paper)Electrical Performance of Electronic Packaging (1 paper)
- Partner nations
- United StatesSingaporeIndia
In The Last Decade
Sungjun Chun
27 papers receiving 353 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 363
- Aerospace Engineering 85
- Hardware and Architecture 20
- Astronomy and Astrophysics 34
- Architecture 2
Countries citing papers authored by Sungjun Chun
This map shows the geographic impact of Sungjun Chun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sungjun Chun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sungjun Chun more than expected).
Fields of papers citing papers by Sungjun Chun
This network shows the impact of papers produced by Sungjun Chun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sungjun Chun. The network helps show where Sungjun Chun may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Sungjun Chun, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 0 | |
| 2 | 2023 | 1 | |
| 3 | 2022 | 0 | |
| 4 | 2020 | 2 | |
| 5 | 2019 | 3 | |
| 6 | 2018 | 1 | |
| 7 | 2017 | 8 | |
| 8 | 2017 | 4 | |
| 9 | 2010 | 1 | |
| 10 | 2010 | 2 | |
| 11 | 2008 | 3 | |
| 12 | 2007 | 3 | |
| 13 | 2005 | 3 | |
| 14 | 2003 | 3 | |
| 15 | 2003 | 9 | |
| 16 | 2003 | 17 | |
| 17 | 2003 | 4 | |
| 18 | 2002 | 7 | |
| 19 | 2001 | 90 | |
| 20 | 2000 | 118 |
About Sungjun Chun
Sungjun Chun is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering, Statistics, Probability and Uncertainty, Astronomy and Astrophysics and Computer Networks and Communications, having authored 30 papers that have together received 378 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (26 papers), 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (7 papers), Advancements in PLL and VCO Technologies (6 papers), Electrostatic Discharge in Electronics (5 papers), VLSI and Analog Circuit Testing (4 papers), Semiconductor Lasers and Optical Devices (3 papers) and Microwave Engineering and Waveguides (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (363 citations), Aerospace Engineering (85 citations), Hardware and Architecture (20 citations), Astronomy and Astrophysics (34 citations) and Architecture (2 citations). Sungjun Chun has collaborated with scholars based in United States, Singapore and India. Frequent co-authors include Madhavan Swaminathan, L.D. Smith, M.K. Iyer, Daniel Dreps, Zhaoqing Chen, Dale Becker, Robert Anderson, Rao Tummala, G. Edward White and Jose A. Hejase. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, Electrical Performance of Electronic Packaging and IEEE International Symposium on Electromagnetic Compatibility.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.