Haruo Akahoshi

1.4k total citations
60 papers, 1.1k citations indexed

About

Haruo Akahoshi is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Haruo Akahoshi has authored 60 papers receiving a total of 1.1k indexed citations (citations by other indexed papers that have themselves been cited), including 42 papers in Electrical and Electronic Engineering, 16 papers in Mechanical Engineering and 15 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Haruo Akahoshi's work include Electronic Packaging and Soldering Technologies (23 papers), Copper Interconnects and Reliability (15 papers) and Electrodeposition and Electroless Coatings (14 papers). Haruo Akahoshi is often cited by papers focused on Electronic Packaging and Soldering Technologies (23 papers), Copper Interconnects and Reliability (15 papers) and Electrodeposition and Electroless Coatings (14 papers). Haruo Akahoshi collaborates with scholars based in Japan, United States and Australia. Haruo Akahoshi's co-authors include Shinobu Toshima, Kingo Itaya, Kimio Shibayama, Juichi Arai, Jun Nunoshige, Mitsuru Ueda, Hiroshi Nakano, Yuji Shibasaki, Jin Onuki and Yasunori Chonan and has published in prestigious journals such as Journal of Applied Physics, Journal of The Electrochemical Society and Journal of Power Sources.

In The Last Decade

Haruo Akahoshi

59 papers receiving 1.0k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Haruo Akahoshi Japan 16 671 470 281 242 212 60 1.1k
Waldfried Plieth Germany 15 436 0.6× 367 0.8× 128 0.5× 113 0.5× 297 1.4× 41 780
Baohe Yang China 21 725 1.1× 238 0.5× 217 0.8× 190 0.8× 345 1.6× 54 1.0k
Ushula M. Tefashe Canada 21 544 0.8× 206 0.4× 329 1.2× 170 0.7× 313 1.5× 31 1.0k
Guy Deniau France 19 734 1.1× 543 1.2× 250 0.9× 78 0.3× 324 1.5× 45 1.2k
Stephen Percival United States 19 555 0.8× 158 0.3× 434 1.5× 204 0.8× 263 1.2× 47 1.0k
Weiwei Wang China 22 1.7k 2.5× 346 0.7× 118 0.4× 94 0.4× 568 2.7× 61 1.9k
Vibha Saxena India 25 1.0k 1.5× 812 1.7× 97 0.3× 355 1.5× 589 2.8× 73 1.8k
Tatsuo Nishina Japan 18 878 1.3× 94 0.2× 267 1.0× 67 0.3× 432 2.0× 61 1.2k
A. Vadivel Murugan India 21 1.1k 1.7× 686 1.5× 56 0.2× 103 0.4× 524 2.5× 30 1.7k
Toru Inagaki Japan 23 868 1.3× 147 0.3× 254 0.9× 257 1.1× 1.2k 5.5× 77 1.7k

Countries citing papers authored by Haruo Akahoshi

Since Specialization
Citations

This map shows the geographic impact of Haruo Akahoshi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Haruo Akahoshi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Haruo Akahoshi more than expected).

Fields of papers citing papers by Haruo Akahoshi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Haruo Akahoshi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Haruo Akahoshi. The network helps show where Haruo Akahoshi may publish in the future.

Co-authorship network of co-authors of Haruo Akahoshi

This figure shows the co-authorship network connecting the top 25 collaborators of Haruo Akahoshi. A scholar is included among the top collaborators of Haruo Akahoshi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Haruo Akahoshi. Haruo Akahoshi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Okamoto, A., et al.. (2023). Chronopotentiometric Analysis of the Anode Dissolution Process in Dimethyl Sulfone–Aluminum Chloride Electrolytic Solution. Journal of The Electrochemical Society. 170(4). 42503–42503. 3 indexed citations
2.
Okamoto, A., et al.. (2022). Evaluation of Electrochemical Properties of Aluminum Electrolytes with Ammonium Salt Using an Ultramicro Disk Electrode. Journal of The Electrochemical Society. 169(11). 112516–112516. 1 indexed citations
3.
Okamoto, A., et al.. (2022). Effect of Ammonium Salts on the Conductivity and Current Efficiency of Dimethyl Sulfone-Aluminum Chloride Electrolytes. Journal of The Electrochemical Society. 169(4). 42502–42502. 2 indexed citations
4.
Akahoshi, Haruo, et al.. (2020). Development of Thin Electroless Copper Plating Solution Using Glyoxylic Acid as Reducing Agent and its Practical Use. Journal of The Surface Finishing Society of Japan. 71(12). 821–827.
5.
Nunoshige, Jun, Haruo Akahoshi, & Mitsuru Ueda. (2009). Molecular Weight Control of Thermosetting Poly(phenylene ether) Copolymer Produced by Heterogeneous Oxidative Coupling Polymerization. High Performance Polymers. 22(4). 458–467. 12 indexed citations
6.
Kato, Takahiko, Haruo Akahoshi, Masato Nakamura, Tomoaki Hashimoto, & A. Nishimura. (2008). Stress measurement by X-Ray diffraction method for electrodeposited SnCu coating on alloy 42 substrate. 10. 1491–1497. 1 indexed citations
7.
Yamamoto, Kenichi, et al.. (2007). Effect of Ni Plating Condition on Lead-Free Solder Joints Reliability of BGA Using Electroplated Ni/Au under Impact Load. Journal of The Japan Institute of Electronics Packaging. 10(4). 305–313. 3 indexed citations
8.
Nomura, Yutaka, et al.. (2007). Newly Developed Abrasive-free Copper CMP Slurry Based on Electrochemical Analysis. MRS Proceedings. 991. 4 indexed citations
9.
Onuki, Jin, et al.. (2007). Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction. MATERIALS TRANSACTIONS. 48(10). 2703–2707. 9 indexed citations
10.
Onuki, Jin, et al.. (2007). Influence of Grain Size Distributions on the Resistivity of 80 nm Wide Cu Interconnects. MATERIALS TRANSACTIONS. 48(3). 622–624. 6 indexed citations
11.
Chonan, Yasunori, et al.. (2006). Filling 80-nm-Wide and High-Aspect-Ratio Trench with Pulse Wave Copper Electroplating and Observation of the Microstructure. Japanese Journal of Applied Physics. 45(11R). 8604–8604. 5 indexed citations
12.
Onuki, Jin, et al.. (2006). Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects. Japanese Journal of Applied Physics. 45(8L). L852–L852. 18 indexed citations
13.
Onuki, Jin, et al.. (2004). . Materia Japan. 43(1). 3–6. 1 indexed citations
14.
Akahoshi, Haruo, et al.. (2002). Electrochemical and Simulative Studies of Trench Filling Mechanisms in the Copper Damascene Electroplating Process. MATERIALS TRANSACTIONS. 43(7). 1593–1598. 13 indexed citations
15.
Akahoshi, Haruo, et al.. (2002). Development of Formaldehyde Free Electroless Copper Plating Solution.. Journal of The Japan Institute of Electronics Packaging. 5(3). 252–256. 2 indexed citations
16.
Inaba, Ryoji, et al.. (2000). Improved coupling efficiency using /spl Delta/n-controlled polymer waveguides with two-dimensional spot-size transformation. IEEE Photonics Technology Letters. 12(4). 404–406. 3 indexed citations
17.
Akahoshi, Haruo, et al.. (1994). Mechanism of Nodule Formation in Electroless Copper Deposition.. 9(2). 112–118. 2 indexed citations
18.
Akahoshi, Haruo, et al.. (1991). Full additive printed wiring boards by fine AT process.. 6(2). 78–82. 2 indexed citations
19.
Akahoshi, Haruo, et al.. (1987). New Copper Surface Treatment for Polyimide Multilayer Printed Wiring Boards. Circuit World. 14(1). 18–21. 5 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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