Yulong Li
- Mechanical Engineering top 0.5%
- Electrical and Electronic Engineering top 2%
- Materials Chemistry top 5%
- Aerospace Engineering top 2%
- Mechanics of Materials top 2%
- Topics
- Electronic Packaging and Soldering Technologies (59 papers)Intermetallics and Advanced Alloy Properties (40 papers)3D IC and TSV technologies (38 papers)
- Partner nations
- ChinaUnited StatesSingapore
In The Last Decade
Yulong Li
302 papers receiving 4.6k citations
Hit Papers
Peers
Comparison fields: 5 of 145
- Mechanical Engineering 2.4k
- Electrical and Electronic Engineering 2.0k
- Materials Chemistry 885
- Aerospace Engineering 525
- Mechanics of Materials 438
Countries citing papers authored by Yulong Li
This map shows the geographic impact of Yulong Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yulong Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yulong Li more than expected).
Fields of papers citing papers by Yulong Li
This network shows the impact of papers produced by Yulong Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yulong Li. The network helps show where Yulong Li may publish in the future.
Co-authorship network of co-authors of Yulong Li
This figure shows the co-authorship network connecting the top 25 collaborators of Yulong Li. A scholar is included among the top collaborators of Yulong Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yulong Li. Yulong Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 11 | |
| 2 | 1 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 0 | |
| 7 | 4 | |
| 8 | 1 | |
| 9 | 0 | |
| 10 | 2 | |
| 11 | 3 | |
| 12 | 10 | |
| 13 | 9 | |
| 14 | 2 | |
| 15 | 11 | |
| 16 | 4 | |
| 17 | 13 | |
| 18 | 14 | |
| 19 | 2 | |
| 20 | 6 |
About Yulong Li
Yulong Li is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Ceramics and Composites, having authored 326 papers that have together received 4.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (59 papers), Intermetallics and Advanced Alloy Properties (40 papers) and 3D IC and TSV technologies (38 papers). The work is most often cited by research in Mechanical Engineering (2.4k citations), Electrical and Electronic Engineering (2.0k citations) and General Materials Science (100 citations). Yulong Li has collaborated with scholars based in China, United States and Singapore. Frequent co-authors include Xiaowu Hu, Jin Yang, Xiongxin Jiang, Zhixian Min, Hua Zhang, Zhishui Yu, Tao Xu, Xuewen Li, Y. Zhou and Ming Yan. Their work appears in journals such as Nature Communications, ACS Nano and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.