Junghwan Bang

595 total citations
51 papers, 478 citations indexed

About

Junghwan Bang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Junghwan Bang has authored 51 papers receiving a total of 478 indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 33 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Junghwan Bang's work include Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (33 papers) and Advanced Welding Techniques Analysis (18 papers). Junghwan Bang is often cited by papers focused on Electronic Packaging and Soldering Technologies (42 papers), 3D IC and TSV technologies (33 papers) and Advanced Welding Techniques Analysis (18 papers). Junghwan Bang collaborates with scholars based in South Korea, Japan and China. Junghwan Bang's co-authors include Chang‐Woo Lee, Yong-Ho Ko, Jeong‐Won Yoon, Taek‐Soo Kim, Seung‐Boo Jung, Ming Yang, Sehoon Yoo, Mingyu Li, Hiroshi Nishikawa and Min‐Su Kim and has published in prestigious journals such as Scientific Reports, Small and Journal of Alloys and Compounds.

In The Last Decade

Junghwan Bang

47 papers receiving 463 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Junghwan Bang South Korea 12 422 300 47 40 31 51 478
Mohd Izrul Izwan Ramli Malaysia 11 336 0.8× 258 0.9× 34 0.7× 43 1.1× 7 0.2× 54 396
Weimin Long China 12 487 1.2× 437 1.5× 101 2.1× 87 2.2× 27 0.9× 32 635
Artur Kudyba Poland 12 97 0.2× 298 1.0× 107 2.3× 72 1.8× 26 0.8× 46 408
Kyung Deuk Min South Korea 13 311 0.7× 226 0.8× 34 0.7× 17 0.4× 25 0.8× 42 375
J. K. Shang United States 13 306 0.7× 219 0.7× 151 3.2× 51 1.3× 14 0.5× 27 482
A.A. Ibrahiem Egypt 14 323 0.8× 289 1.0× 91 1.9× 106 2.6× 40 1.3× 27 439
Yongtao Jiu China 11 145 0.3× 252 0.8× 130 2.8× 66 1.6× 22 0.7× 31 349
Ning-Cheng Lee Taiwan 11 548 1.3× 348 1.2× 25 0.5× 59 1.5× 16 0.5× 76 576
Shirin Dehgahi Canada 11 148 0.4× 321 1.1× 181 3.9× 34 0.8× 19 0.6× 24 475
Klaus-Juergen Wolter Germany 12 318 0.8× 164 0.5× 75 1.6× 32 0.8× 62 2.0× 48 393

Countries citing papers authored by Junghwan Bang

Since Specialization
Citations

This map shows the geographic impact of Junghwan Bang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Junghwan Bang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Junghwan Bang more than expected).

Fields of papers citing papers by Junghwan Bang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Junghwan Bang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Junghwan Bang. The network helps show where Junghwan Bang may publish in the future.

Co-authorship network of co-authors of Junghwan Bang

This figure shows the co-authorship network connecting the top 25 collaborators of Junghwan Bang. A scholar is included among the top collaborators of Junghwan Bang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Junghwan Bang. Junghwan Bang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Byun, Dongjin, et al.. (2025). Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally strong?. Microelectronics Reliability. 167. 115676–115676. 1 indexed citations
2.
Jeong, Jong‐Min, Dongjin Kim, Jung Soo Kim, et al.. (2024). Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer. Journal of Materials Science Materials in Electronics. 35(4). 5 indexed citations
3.
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5.
Byun, Dongjin, et al.. (2023). Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding. Journal of Welding and Joining. 41(4). 291–298. 1 indexed citations
6.
Kim, Shin‐Il, et al.. (2023). Thermal reliability of Cu sintering joints for high-temperature die attach. Microelectronics Reliability. 147. 115002–115002. 11 indexed citations
7.
8.
Lee, Junho, Chan Bin Mo, Kyoung Ryeol Park, et al.. (2023). Mechanical properties of TiC reinforced MgO–ZrO2 composites via spark plasma sintering. Ceramics International. 49(11). 17255–17260. 12 indexed citations
9.
Kim, Shin‐Il, et al.. (2023). Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach. Journal of Materials Science Materials in Electronics. 34(19). 4 indexed citations
10.
Jeong, Jong‐Min, et al.. (2023). Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation. Scientific Reports. 13(1). 14354–14354. 5 indexed citations
11.
Byun, Dongjin, et al.. (2022). Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints. Journal of Electronic Materials. 51(12). 7326–7336. 8 indexed citations
12.
Bang, Junghwan, et al.. (2021). Enhanced Thermo–Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores. Materials. 14(9). 2284–2284. 5 indexed citations
13.
Kim, Jung Soo, Dae Young Park, Junghwan Bang, et al.. (2021). Effective (Pd,Ni)Sn4 diffusion barrier to suppress brittle fracture at Sn-58Bi-xAg solder joint with Ni(P)/Pd(P)/Au metallization pad. Microelectronics Reliability. 129. 114472–114472. 5 indexed citations
14.
15.
Ko, Yong-Ho, et al.. (2019). Improving Joint Reliability of Lead-free Solder on Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder. Journal of the Microelectronics and Packaging Society. 26(3). 43–49. 2 indexed citations
16.
Bang, Junghwan, et al.. (2019). Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate. Microelectronics Reliability. 99. 62–73. 25 indexed citations
17.
Ko, Yong-Ho, et al.. (2018). A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy. Journal of Welding and Joining. 36(3). 78–82. 2 indexed citations
18.
Bang, Junghwan, et al.. (2016). Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint. Journal of Welding and Joining. 34(1). 26–34. 11 indexed citations
19.
Ko, Yong-Ho, et al.. (2014). Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging. Journal of Welding and Joining. 32(3). 19–26. 2 indexed citations
20.
Ko, Young‐Ho, Junghwan Bang, Jeonghan Kim, & Chang‐Woo Lee. (2013). Evaluation of Property and Reliability of Sn3.5Ag and Sn0.7Cu Pb-free Solder Joint by Complex Vibration for Application of Automobile Electric Module. Journal of Welding and Joining. 31(1). 6–10. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026