Mingyu Li
Impact in
- Mechanical Engineering top 0.5%
- Aluminum Alloys Composites Properties
- Advanced Welding Techniques Analysis
- Intermetallics and Advanced Alloy Properties
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Nanomaterials and Printing Technologies
Papers in
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- Electronic Packaging and Soldering Technologies 148
- 3D IC and TSV technologies 89
- Nanomaterials and Printing Technologies 25
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- Aluminum Alloys Composites Properties 54
- Advanced Welding Techniques Analysis 53
- Intermetallics and Advanced Alloy Properties 29
- Co-authors
- Hongjun Ji (93 shared papers)Chunqing Wang (38 shared papers)Hongtao Chen (45 shared papers)Yong Xiao (16 shared papers)Hongtao Chen (22 shared papers)Jongmyung Kim (21 shared papers)Zhihao Zhang (14 shared papers)Ming Yang (12 shared papers)
- Journals
- Journal of Materials Science Materials in Electronics (21 papers)Journal of Alloys and Compounds (15 papers)Journal of Electronic Materials (13 papers)Materials Letters (13 papers)Journal of Materials Processing Technology (11 papers)
- Partner nations
- ChinaSouth KoreaUnited States
In The Last Decade
Mingyu Li
277 papers receiving 5.7k citations
Mingyu Li's Hit Papers
Peers
Comparison fields: 5 of 139
- Mechanical Engineering 2.8k
- Electrical and Electronic Engineering 3.6k
- Ceramics and Composites 337
- General Materials Science 90
- Electronic, Optical and Magnetic Materials 530
Countries citing papers authored by Mingyu Li
This map shows the geographic impact of Mingyu Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mingyu Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mingyu Li more than expected).
Fields of papers citing papers by Mingyu Li
This network shows the impact of papers produced by Mingyu Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mingyu Li. The network helps show where Mingyu Li may publish in the future.
Co-authors
The 25 scholars most cited alongside Mingyu Li, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 302 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 177 | |
| 2 | 2015 | 159 | |
| 3 | 2013 | 142 | |
| 4 | 2023 | 127 | |
| 5 | 2014 | 118 | |
| 6 | 2018 | 111 | |
| 7 | 2016 | 98 | |
| 8 | 2015 | 91 | |
| 9 | 2016 | 88 | |
| 10 | 2019 | 86 | |
| 11 | 2017 | 80 | |
| 12 | 2023 | 79 | |
| 13 | 2020 | 79 | |
| 14 | 2016 | 76 | |
| 15 | 2013 | 76 | |
| 16 | 2013 | 74 | |
| 17 | 2012 | 73 | |
| 18 | 2020 | 73 | |
| 19 | 2017 | 69 | |
| 20 | 2019 | 66 |
About Mingyu Li
Mingyu Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry, Aerospace Engineering and Biomedical Engineering, having authored 302 papers that have together received 5.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (148 papers), 3D IC and TSV technologies (89 papers), Aluminum Alloys Composites Properties (54 papers), Advanced Welding Techniques Analysis (53 papers), Aluminum Alloy Microstructure Properties (35 papers), Advanced Sensor and Energy Harvesting Materials (30 papers), Intermetallics and Advanced Alloy Properties (29 papers) and Nanomaterials and Printing Technologies (25 papers). The work is most often cited by research in Mechanical Engineering (2.8k citations), Electrical and Electronic Engineering (3.6k citations), Ceramics and Composites (337 citations), General Materials Science (90 citations) and Electronic, Optical and Magnetic Materials (530 citations). Mingyu Li has collaborated with scholars based in China, South Korea and United States. Frequent co-authors include Hongjun Ji, Chunqing Wang, Hongtao Chen, Yong Xiao, Hongtao Chen, Jongmyung Kim, Zhihao Zhang, Ming Yang, Weiwei Zhao and Xiaomeng Zhu. Their work appears in journals such as Journal of Materials Science Materials in Electronics, Journal of Alloys and Compounds, Journal of Electronic Materials, Materials Letters and Journal of Materials Processing Technology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.