Mingyu Li

7.3k total citations · 1 hit paper
302 papers, 5.8k citations indexed

About

Mingyu Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Mingyu Li has authored 302 papers receiving a total of 5.8k indexed citations (citations by other indexed papers that have themselves been cited), including 192 papers in Electrical and Electronic Engineering, 154 papers in Mechanical Engineering and 51 papers in Materials Chemistry. Recurrent topics in Mingyu Li's work include Electronic Packaging and Soldering Technologies (148 papers), 3D IC and TSV technologies (89 papers) and Aluminum Alloys Composites Properties (54 papers). Mingyu Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (148 papers), 3D IC and TSV technologies (89 papers) and Aluminum Alloys Composites Properties (54 papers). Mingyu Li collaborates with scholars based in China, South Korea and United States. Mingyu Li's co-authors include Hongjun Ji, Chunqing Wang, Hongtao Chen, Yong Xiao, Hongtao Chen, Jongmyung Kim, Zhihao Zhang, Ming Yang, Weiwei Zhao and Jingdong Liu and has published in prestigious journals such as Nature, Advanced Materials and Angewandte Chemie International Edition.

In The Last Decade

Mingyu Li

277 papers receiving 5.7k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Ab initio characterization of protein molecular dynamics with AI2BMD

2024 63 citations Mingyu Li et al. profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Mingyu Li China	43	3.6k	2.8k	1.1k	997	633	302	5.8k
Peng Peng China	43	2.1k 0.6×	2.5k 0.9×	1.8k 1.5×	1.3k 1.3×	264 0.4×	189	5.8k
Jianfeng Li China	31	1.8k 0.5×	2.1k 0.7×	773 0.7×	552 0.6×	798 1.3×	218	4.3k
Song Zhang China	31	1.6k 0.5×	1.1k 0.4×	2.4k 2.1×	1.2k 1.2×	526 0.8×	350	5.3k
Guo‐Quan Lu United States	46	6.2k 1.7×	3.2k 1.2×	1.5k 1.3×	524 0.5×	147 0.2×	330	7.8k
Zhihao Zhang China	41	2.6k 0.7×	1.5k 0.5×	1.8k 1.6×	1.1k 1.1×	276 0.4×	354	6.6k
Guifu Ding China	35	2.3k 0.6×	1.7k 0.6×	838 0.7×	1.9k 1.9×	212 0.3×	327	4.7k
Yusheng Li China	45	2.2k 0.6×	2.9k 1.1×	3.7k 3.2×	748 0.8×	947 1.5×	198	6.5k
Hu Li China	34	1.3k 0.4×	876 0.3×	1.5k 1.3×	1.3k 1.4×	309 0.5×	258	4.6k
Lijun Liu China	35	2.3k 0.7×	1.0k 0.4×	1.8k 1.6×	603 0.6×	244 0.4×	261	4.3k
Shuye Zhang China	30	1.4k 0.4×	1.2k 0.4×	628 0.6×	704 0.7×	275 0.4×	157	3.0k

Countries citing papers authored by Mingyu Li

Since Specialization

Citations

This map shows the geographic impact of Mingyu Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mingyu Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mingyu Li more than expected).

Fields of papers citing papers by Mingyu Li

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Mingyu Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mingyu Li. The network helps show where Mingyu Li may publish in the future.

Co-authorship network of co-authors of Mingyu Li

This figure shows the co-authorship network connecting the top 25 collaborators of Mingyu Li. A scholar is included among the top collaborators of Mingyu Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Mingyu Li. Mingyu Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Wu, Hong, Mingyu Li, & Zhang Li. (2025). Comparing physician and large language model responses to influenza patient questions in the online health community. International Journal of Medical Informatics. 197. 105836–105836.

Li, Mingyu, et al.. (2025). Preparation, Characterization, and In Vivo Evaluation of an Oral Triptolide Nanomatrix System for Rheumatoid Arthritis Therapy. Pharmaceutics. 17(12). 1567–1567.

Li, Mingyu, et al.. (2024). Investigation of the mechanical strength and pore characteristics of undisturbed loess exposed to acid solutions. Results in Engineering. 24. 103043–103043. 4 indexed citations

Hu, Shaowei, et al.. (2024). Enhanced thermal stability of joints formed by Ag-Cu supersaturated solid-solution nanoparticles paste by in-situ Cu nanoprecipitates. Journal of Material Science and Technology. 213. 69–79. 5 indexed citations

Zhu, Wenbo, Shaowei Hu, Peng Cui, et al.. (2023). Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics. Materials Letters. 357. 135675–135675. 6 indexed citations

Liu, Hao, et al.. (2023). Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives. Microelectronics Reliability. 151. 115236–115236. 9 indexed citations

Zhu, Wenbo, et al.. (2023). Ultra-efficient localized induction heating by dual-ferrite synchronous magnetic field focusing. Applied Energy. 348. 121535–121535. 4 indexed citations

Wang, Jintao, Xinjie Wang, Jianqiang Wang, et al.. (2023). Solidification behavior of Sn crystals − Under different temperature gradients. Materials Today Communications. 38. 107776–107776.

Zhou, Qihang, et al.. (2023). Microstructure evolution and fracture mechanism of sintered nano-Ag joints on bare copper during high temperature aging. 1–4.

10.

Wu, Wanbao, Yihong Liang, Deping Li, et al.. (2022). A Competitive Solvation of Ternary Eutectic Electrolytes Tailoring the Electrode/Electrolyte Interphase for Lithium Metal Batteries. ACS Nano. 16(9). 14558–14568. 51 indexed citations

11.

Ji, Hongjun, Qunhui Yuan, Xing Ma, et al.. (2019). Nano oxide intermediate layer assisted room temperature sintering of ink-jet printed silver nanoparticles pattern. Nanotechnology. 30(49). 495302–495302. 7 indexed citations

12.

Su, Yue, et al.. (2019). Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications. Microelectronic Engineering. 214. 60–67. 14 indexed citations

13.

Zhang, Zhihao, et al.. (2019). Growth evolution and formation mechanism of η′-Cu6Sn5 whiskers on η-Cu6Sn5 intermetallics during room-temperature ageing. Acta Materialia. 183. 340–349. 23 indexed citations

14.

Hang, Chunjin, et al.. (2018). Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging. Scientific Reports. 8(1). 17422–17422. 14 indexed citations

15.

Sun, Siyu, Qiang Guo, Hongtao Chen, Mingyu Li, & Chunqing Wang. (2017). Solderless bonding with nanoporous copper as interlayer for high-temperature applications. Microelectronics Reliability. 80. 198–204. 11 indexed citations

16.

Guo, Qiang, Siyu Sun, Zhihao Zhang, Hongtao Chen, & Mingyu Li. (2017). Microstructure evolution and mechanical strength evaluation in Ag/Sn/Cu TLP bonding interconnection during aging test. Microelectronics Reliability. 80. 144–148. 16 indexed citations

17.

Chen, Hongtao, et al.. (2017). Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions. Materials & Design. 131. 196–203. 36 indexed citations

18.

Chen, Hongtao, et al.. (2016). Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures. Materials & Design. 108. 383–390. 63 indexed citations

19.

Chen, Hongtao, et al.. (2009). Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5Ag0.75Cu and Sn63Pb37 Solder Joints on Au/Ni Metallization. Journal of Material Science and Technology. 23(1). 68–72. 3 indexed citations

20.

Chen, Hongtao, et al.. (2009). Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability. Journal of Material Science and Technology. 21(3). 419–422. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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