Hongjun Ji

4.2k total citations · 2 hit papers
146 papers, 3.3k citations indexed

About

Hongjun Ji is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Hongjun Ji has authored 146 papers receiving a total of 3.3k indexed citations (citations by other indexed papers that have themselves been cited), including 79 papers in Electrical and Electronic Engineering, 77 papers in Mechanical Engineering and 42 papers in Materials Chemistry. Recurrent topics in Hongjun Ji's work include Electronic Packaging and Soldering Technologies (52 papers), Advanced Welding Techniques Analysis (35 papers) and 3D IC and TSV technologies (24 papers). Hongjun Ji is often cited by papers focused on Electronic Packaging and Soldering Technologies (52 papers), Advanced Welding Techniques Analysis (35 papers) and 3D IC and TSV technologies (24 papers). Hongjun Ji collaborates with scholars based in China, South Korea and United States. Hongjun Ji's co-authors include Mingyu Li, Chunqing Wang, Hongtao Chen, Shumin Xiao, Yuhan Wang, Yubin Fan, Geyang Qu, Li Ge, Yuri S. Kivshar and Qinghai Song and has published in prestigious journals such as Science, SHILAP Revista de lepidopterología and Langmuir.

In The Last Decade

Hongjun Ji

140 papers receiving 3.3k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Ultrafast control of vortex microlasers

2020 626 citations Hongjun Ji et al. profile →
Improving the weldability and mechanical property of ultrasonic spot welding of Cu sheets through a surface gradient structure

2025 36 citations Zenglei Ni, А. А. Назаров et al. Journal of Materials Research and Technology profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Hongjun Ji China	30	1.8k	1.4k	785	732	529	146	3.3k
S. Baunack Germany	31	1.5k 0.8×	855 0.6×	836 1.1×	1.0k 1.4×	912 1.7×	108	3.1k
Tsung‐Shune Chin Taiwan	30	1.1k 0.6×	1.8k 1.3×	647 0.8×	1.7k 2.3×	912 1.7×	163	4.0k
Yongho Seo South Korea	38	1.8k 1.0×	697 0.5×	1.1k 1.4×	3.0k 4.0×	686 1.3×	186	4.5k
Barton C. Prorok United States	25	1.1k 0.6×	916 0.7×	798 1.0×	1.2k 1.7×	195 0.4×	108	2.8k
Dongyun Lee South Korea	30	1.2k 0.6×	810 0.6×	576 0.7×	1.2k 1.7×	270 0.5×	140	2.7k
Shijo Nagao Japan	43	3.5k 1.9×	1.5k 1.1×	1.5k 2.0×	1.2k 1.7×	617 1.2×	191	5.0k
Bin Cai China	31	1.1k 0.6×	1.4k 1.0×	571 0.7×	1.5k 2.1×	399 0.8×	167	3.5k
Rishi Maiti India	26	1.0k 0.5×	458 0.3×	713 0.9×	1.2k 1.6×	217 0.4×	77	2.3k
Zhan Jie Wang China	29	851 0.5×	561 0.4×	529 0.7×	1.8k 2.5×	868 1.6×	153	2.5k
Megan J. Cordill Austria	30	1.2k 0.7×	950 0.7×	993 1.3×	1.2k 1.6×	431 0.8×	186	3.4k

Countries citing papers authored by Hongjun Ji

Since Specialization

Citations

This map shows the geographic impact of Hongjun Ji's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hongjun Ji with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hongjun Ji more than expected).

Fields of papers citing papers by Hongjun Ji

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hongjun Ji. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hongjun Ji. The network helps show where Hongjun Ji may publish in the future.

Co-authorship network of co-authors of Hongjun Ji

This figure shows the co-authorship network connecting the top 25 collaborators of Hongjun Ji. A scholar is included among the top collaborators of Hongjun Ji based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hongjun Ji. Hongjun Ji is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Li, Zhan, Zhen Zhang, Yifan Gao, et al.. (2025). Precision printing and control of total internal reflection structural colors: Applications in anti-counterfeiting and color blindness detection. Journal of Colloid and Interface Science. 695. 137726–137726. 1 indexed citations

Ni, Zenglei, et al.. (2025). Improving the weldability and mechanical property of ultrasonic spot welding of Cu sheets through a surface gradient structure. Journal of Materials Research and Technology. 36. 2652–2668. 36 indexed citations breakdown →

Yan, Jihong, Jian Ding, Yifan Gao, et al.. (2025). Bio‐Inspired Structural Color Irises as Physical Unclonable Functions for Anti‐Counterfeiting. Advanced Science. 12(34). e04771–e04771. 1 indexed citations

Bing, Wei, et al.. (2025). Temperature dependence of tensile deformation behaviors in a novel powder metallurgy Ni-based superalloy with high density nanoscale γ′ phase. Materials Science and Engineering A. 943. 148760–148760. 1 indexed citations

Ji, Hongjun, et al.. (2025). Analysis and optimization of dielectric properties of cordierite-based glass composites for advanced LTCC applications. Ceramics International. 51(24). 42453–42464.

Ju, Xiaohui, Hong Gao, Chen Wang, et al.. (2024). Catechol-Ag interlayer constructed nanofiltration membrane for efficient purification of glucose from sugars. Journal of Membrane Science. 716. 123497–123497. 1 indexed citations

Ma, Jingyuan, et al.. (2024). Tailoring nanotwinned Cu interlayers for localizing anisotropic plastic deformation during low energy input ultrasonic welding of robust Cu-Cu joints. Materials & Design. 248. 113459–113459.

Bing, Wei, Hongjun Ji, & Jianzheng Guo. (2023). Effect of heat treatments on the microstructure and mechanical properties of René 104 superalloy manufactured by selective laser melting. Materials Characterization. 200. 112838–112838. 7 indexed citations

Pan, Hao, et al.. (2023). Ultrasound-induced interinhibitive dissolution-precipitation evolution and significantly improved mechanical properties of Kovar/SnSb10 assembly. Journal of Materials Research and Technology. 26. 4151–4167. 2 indexed citations

10.

Zhang, Wenwu, Weiwei Zhao, Hongtao Chen, et al.. (2021). Low energy ultrasonic welding for Cu-Cu joining accelerated via Cu nanoparticles. Journal of Materials Processing Technology. 296. 117210–117210. 16 indexed citations

11.

Zhang, Wenwu, et al.. (2020). Ultrasonic-accelerated metallurgical reaction of Sn/Ni composite solder: Principle, kinetics, microstructure, and joint properties. Ultrasonics Sonochemistry. 66. 105090–105090. 24 indexed citations

12.

Gu, Jiahui, Shaowei Hu, Hongjun Ji, et al.. (2020). Multi-layer silver nanowire/polyethylene terephthalate mesh structure for highly efficient transparent electromagnetic interference shielding. Nanotechnology. 31(18). 185303–185303. 41 indexed citations

13.

Ji, Hongjun, Qunhui Yuan, Xing Ma, et al.. (2019). Nano oxide intermediate layer assisted room temperature sintering of ink-jet printed silver nanoparticles pattern. Nanotechnology. 30(49). 495302–495302. 7 indexed citations

14.

Ji, Hongjun, Ling Zhang, Xuan Luo, et al.. (2019). Highly stretchable patternable conductive circuits and wearable strain sensors based on polydimethylsiloxane and silver nanoparticles. Nanotechnology. 30(18). 185501–185501. 31 indexed citations

15.

Pan, Hao, Hongjun Ji, Shuai Pei, et al.. (2019). Highly Sensitive and Transparent Strain Sensors with an Ordered Array Structure of AgNWs for Wearable Motion and Health Monitoring. Scientific Reports. 9(1). 2403–2403. 56 indexed citations

16.

Gu, Jiahui, Xuelin Wang, Hongtao Chen, et al.. (2018). Conductivity enhancement of silver nanowire networks via simple electrolyte solution treatment and solvent washing. Nanotechnology. 29(26). 265703–265703. 10 indexed citations

17.

Ji, Hongjun, et al.. (2017). Ultra-low temperature sintering of Cu@Ag core-shell nanoparticle paste by ultrasonic in air for high-temperature power device packaging. Ultrasonics Sonochemistry. 41. 375–381. 69 indexed citations

18.

Ji, Hongjun, Xiaoheng Liu, Xin Wang, & Xiaxi Yao. (2011). Self‐assembly and photocatalytic property of amorphous cubic‐like TiO ₂ ‐ZnO hybrid film. Rare Metals. 30(S1). 225–228. 3 indexed citations

19.

Li, Mingyu, et al.. (2009). Irregular Characteristics of Bond Interface Formation in Ultrasonic Wire Wedge Bonding. Journal of Material Science and Technology. 22(4). 483–486. 2 indexed citations

20.

Li, Mingyu, et al.. (2006). Interdiffusion of Al–Ni system enhanced by ultrasonic vibration at ambient temperature. Ultrasonics. 45(1-4). 61–65. 27 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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