H. Grabinski
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing 5
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- Electromagnetic Compatibility and Noise Suppression 31
- Microwave and Dielectric Measurement Techniques 25
- Microwave Engineering and Waveguides 14
- 3D IC and TSV technologies 8
- Electromagnetic Compatibility and Measurements 8
- Low-power high-performance VLSI design 5
-
- Lightning and Electromagnetic Phenomena 6
- Co-authors
- Uwe ArzDylan F. WilliamsDavid K. WalkerT.W. WilliamsHenning BraunischBradley K. AlpertThomas LudwigKye Yak See
- Journals
- IEEE Transactions on Advanced Packaging (5 papers)IEEE Microwave and Wireless Components Letters (1 paper)IEEE Transactions on Microwave Theory and Techniques (1 paper)
- Partner nations
- GermanyUnited StatesSingapore
In The Last Decade
H. Grabinski
43 papers receiving 339 citations
Peers
Comparison fields: 5 of 23
- Hardware and Architecture 51
- Electrical and Electronic Engineering 359
- Astronomy and Astrophysics 26
- Aerospace Engineering 21
- Control and Systems Engineering 10
Countries citing papers authored by H. Grabinski
This map shows the geographic impact of H. Grabinski's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Grabinski with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Grabinski more than expected).
Fields of papers citing papers by H. Grabinski
This network shows the impact of papers produced by H. Grabinski. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Grabinski. The network helps show where H. Grabinski may publish in the future.
Co-authorship network
The 17 scholars most cited alongside H. Grabinski, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 2 | |
| 2 | 2006 | 1 | |
| 3 | 2003 | 2 | |
| 4 | 2003 | 17 | |
| 5 | 2002 | 12 | |
| 6 | 2002 | 8 | |
| 7 | 2002 | 11 | |
| 8 | 2002 | 43 | |
| 9 | 2002 | 1 | |
| 10 | Four-Port Microwave Measurement System Speeds On-Wafer Calibration and Test | NIST | 2001 | 1 |
| 11 | 2001 | 36 | |
| 12 | 2000 | 9 | |
| 13 | 2000 | 2 | |
| 14 | 2000 | 1 | |
| 15 | 1998 | 3 | |
| 16 | 1998 | 10 | |
| 17 | 1997 | 10 | |
| 18 | Theorie und Simulation von Leitbahnen : Signalverhalten auf Leitungssysteme in der Mikroelektronik | 1991 | 2 |
| 19 | 1991 | 9 | |
| 20 | 1989 | 17 |
About H. Grabinski
H. Grabinski is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Astronomy and Astrophysics, Aerospace Engineering and Control and Systems Engineering, having authored 46 papers that have together received 368 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (31 papers), Microwave and Dielectric Measurement Techniques (25 papers), Microwave Engineering and Waveguides (14 papers), 3D IC and TSV technologies (8 papers), Electromagnetic Compatibility and Measurements (8 papers), Lightning and Electromagnetic Phenomena (6 papers), VLSI and Analog Circuit Testing (5 papers) and Low-power high-performance VLSI design (5 papers). The work is most often cited by research in Hardware and Architecture (51 citations), Electrical and Electronic Engineering (359 citations), Astronomy and Astrophysics (26 citations), Aerospace Engineering (21 citations) and Control and Systems Engineering (10 citations). H. Grabinski has collaborated with scholars based in Germany, United States and Singapore. Frequent co-authors include Uwe Arz, Dylan F. Williams, David K. Walker, T.W. Williams, Henning Braunisch, Bradley K. Alpert, Thomas Ludwig, Kye Yak See, Flavio Canavero and Janet E. Rogers. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Microwave and Wireless Components Letters, IEEE Transactions on Microwave Theory and Techniques, Electrical Engineering and IEEE Transactions on Components Packaging and Manufacturing Technology Part B.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.