V. Terzieva

600 total citations
21 papers, 275 citations indexed

About

V. Terzieva is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, V. Terzieva has authored 21 papers receiving a total of 275 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 7 papers in Electronic, Optical and Magnetic Materials and 5 papers in Biomedical Engineering. Recurrent topics in V. Terzieva's work include Semiconductor materials and devices (12 papers), Copper Interconnects and Reliability (7 papers) and Advanced Surface Polishing Techniques (4 papers). V. Terzieva is often cited by papers focused on Semiconductor materials and devices (12 papers), Copper Interconnects and Reliability (7 papers) and Advanced Surface Polishing Techniques (4 papers). V. Terzieva collaborates with scholars based in Belgium, Bulgaria and United States. V. Terzieva's co-authors include Marc Meuris, Laurent Souriau, Jean‐Pierre Célis, Jan Fransaer, Matty Caymax, Francesca Clemente, Roger Loo, Trudo Clarysse, Wilfried Vandervorst and Erik Rosseel and has published in prestigious journals such as Journal of The Electrochemical Society, Thin Solid Films and Colloids and Surfaces A Physicochemical and Engineering Aspects.

In The Last Decade

V. Terzieva

20 papers receiving 266 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
V. Terzieva Belgium	10	248	103	69	67	57	21	275
S. Piotrowicz France	12	458 1.8×	42 0.4×	111 1.6×	70 1.0×	33 0.6×	53	525
G. J. Norga Belgium	11	289 1.2×	335 3.3×	78 1.1×	88 1.3×	89 1.6×	41	430
H. Shobha United States	12	332 1.3×	79 0.8×	61 0.9×	226 3.4×	56 1.0×	51	379
Julia Kitzmann Germany	8	217 0.9×	336 3.3×	72 1.0×	36 0.5×	121 2.1×	12	378
Koji Aizawa Japan	8	311 1.3×	302 2.9×	28 0.4×	101 1.5×	86 1.5×	26	411
Tien‐Tung Luong Taiwan	11	188 0.8×	183 1.8×	39 0.6×	95 1.4×	63 1.1×	17	339
Igor Bejenari Germany	6	90 0.4×	295 2.9×	59 0.9×	44 0.7×	75 1.3×	11	336
P. Leszczyński Poland	6	162 0.7×	264 2.6×	59 0.9×	30 0.4×	34 0.6×	6	318
Umesh Palnitkar Taiwan	8	127 0.5×	351 3.4×	44 0.6×	36 0.5×	51 0.9×	21	373
Minsoo Kang South Korea	8	123 0.5×	186 1.8×	73 1.1×	33 0.5×	37 0.6×	11	269

Countries citing papers authored by V. Terzieva

Since Specialization

Citations

This map shows the geographic impact of V. Terzieva's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Terzieva with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Terzieva more than expected).

Fields of papers citing papers by V. Terzieva

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by V. Terzieva. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Terzieva. The network helps show where V. Terzieva may publish in the future.

Co-authorship network of co-authors of V. Terzieva

This figure shows the co-authorship network connecting the top 25 collaborators of V. Terzieva. A scholar is included among the top collaborators of V. Terzieva based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with V. Terzieva. V. Terzieva is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Souriau, Laurent, E. Augendre, Roger Loo, et al.. (2009). High-Hole-Mobility Silicon Germanium on Insulator Substrates with High Crystalline Quality Obtained by the Germanium Condensation Technique. Journal of The Electrochemical Society. 156(3). H208–H208. 27 indexed citations

Souriau, Laurent, V. Terzieva, Francesca Clemente, et al.. (2008). High Ge content SGOI substrates obtained by the Ge condensation technique: A template for growth of strained epitaxial Ge. Thin Solid Films. 517(1). 23–26. 23 indexed citations

Terzieva, V., Laurent Souriau, Matty Caymax, et al.. (2008). Benefits and side effects of high temperature anneal used to reduce threading dislocation defects in epitaxial Ge layers on Si substrates. Thin Solid Films. 517(1). 172–177. 30 indexed citations

Souriau, Laurent, Tuan Nguyen, E. Augendre, et al.. (2008). High Hole Mobility SGOI Substrates Obtained by the Germanium Condensation Technique. ECS Transactions. 16(10). 79–89. 1 indexed citations

Brunco, D.P., Brice De Jaeger, Geert Eneman, et al.. (2007). Germanium: The Past and Possibly a Future Material for Microelectronics. ECS Transactions. 11(4). 479–493. 31 indexed citations

Souriau, Laurent, V. Terzieva, Marc Meuris, & Matty Caymax. (2007). A Wet Etching Technique to Reveal Threading Dislocations in Thin Germanium Layers. Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena. 134. 83–86. 9 indexed citations

Kaczer, B., Paul Zimmerman, Karl Opsomer, et al.. (2006). Ge deep sub-micron HiK/MG pFETs with superior drive compared to Si HiK/MG state-of-the-art reference. Semiconductor Science and Technology. 22(1). S221–S226. 12 indexed citations

Terzieva, V., Matty Caymax, Laurent Souriau, et al.. (2006). The Challenges of Ge-Condensation Technique. ECS Transactions. 3(7). 1023–1031. 4 indexed citations

Terzieva, V., Laurent Souriau, Francesca Clemente, et al.. (2006). Ge substrates made by Ge-condensation technique: Challenges and current understanding. Materials Science in Semiconductor Processing. 9(4-5). 449–453. 15 indexed citations

10.

Terzieva, V., et al.. (2005). Corrosion and Inhibition of WN[sub X]C[sub Y] Barrier during Chemical Mechanical Planarization. Journal of The Electrochemical Society. 152(12). B512–B512. 1 indexed citations

11.

Armini, Silvia, V. Terzieva, S. Vanhaelemeersch, & Karen Maex. (2004). Composite nanoparticles for defectivity reduction during CMP. 1 indexed citations

12.

Terzieva, V., et al.. (2004). Corrosion of Narrow Copper Damascene Interconnects. Journal of The Electrochemical Society. 151(12). B636–B636. 14 indexed citations

13.

Clarysse, Trudo, et al.. (2004). Surface and grain boundary scattering studied in beveled polycrystalline thin copper films. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 22(4). 1830–1833. 43 indexed citations

14.

Brongersma, Sywert, Kris Vanstreels, Wen‐Wei Wu, et al.. (2004). Copper grain growth in reduced dimensions. 14. 48–50. 5 indexed citations

15.

Brongersma, Sywert, Kris Vanstreels, Wen‐Wei Wu, et al.. (2004). Influence of copper purity on microstructure and electromigration. 45–47. 5 indexed citations

16.

Das, Abhishek, Quoc Toan Le, Yuki Furukawa, et al.. (2003). Characterisation of JSR’s spin-on hardmask FF-02. Microelectronic Engineering. 70(2-4). 308–313. 2 indexed citations

17.

Schuhmacher, Jörg, et al.. (2002). Galvanic corrosion testing of WCxNy barrier metal in H202 based slurries. 95–101.

18.

Terzieva, V., et al.. (2002). New Slurry Formulation for Copper-CMP Process in a Damascene Integration Scheme. MRS Proceedings. 732. 1 indexed citations

19.

Terzieva, V., et al.. (1999). Application of drop-weight interfacial tensiometry to the quantitative analysis of Cu/SiO2 composite coatings. Colloids and Surfaces A Physicochemical and Engineering Aspects. 155(2-3). 155–159. 1 indexed citations

20.

Terzieva, V., et al.. (1998). Indirect atomic absorption spectroscopic determination of SiO 2 in copper composite coatings. Fresenius Journal of Analytical Chemistry. 360(6). 734–736. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact