Bau‐Tong Dai
- Electrical and Electronic Engineering top 5%
- Materials Chemistry top 5%
- Biomedical Engineering top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Atomic and Molecular Physics, and Optics
- Co-authors
- Jia‐Min ShiehMing‐Shiann FengShih-Chieh ChangChing‐Fa YehChien-Wei LiuWei‐Tsu TsengFu‐Hsiang KoT. L. Chu
- Topics
- Copper Interconnects and Reliability (27 papers)Semiconductor materials and devices (25 papers)Electrodeposition and Electroless Coatings (15 papers)
- Cited by
- Electronic, Optical and Magnetic MaterialsMaterials ChemistryElectrical and Electronic Engineering
- Partner nations
- TaiwanUnited StatesJapan
In The Last Decade
Bau‐Tong Dai
85 papers receiving 1.3k citations
Peers
Comparison fields: 5 of 60
- Electrical and Electronic Engineering 938
- Materials Chemistry 774
- Biomedical Engineering 473
- Electronic, Optical and Magnetic Materials 349
- Atomic and Molecular Physics, and Optics 155
Countries citing papers authored by Bau‐Tong Dai
This map shows the geographic impact of Bau‐Tong Dai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bau‐Tong Dai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bau‐Tong Dai more than expected).
Fields of papers citing papers by Bau‐Tong Dai
This network shows the impact of papers produced by Bau‐Tong Dai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bau‐Tong Dai. The network helps show where Bau‐Tong Dai may publish in the future.
Co-authorship network of co-authors of Bau‐Tong Dai
This figure shows the co-authorship network connecting the top 25 collaborators of Bau‐Tong Dai. A scholar is included among the top collaborators of Bau‐Tong Dai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Bau‐Tong Dai. Bau‐Tong Dai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 22 | |
| 2 | 1 | |
| 3 | 49 | |
| 4 | 19 | |
| 5 | 2 | |
| 6 | 30 | |
| 7 | 64 | |
| 8 | 1 | |
| 9 | 16 | |
| 10 | 14 | |
| 11 | 2 | |
| 12 | 60 | |
| 13 | 58 | |
| 14 | 34 | |
| 15 | 12 | |
| 16 | 52 | |
| 17 | 3 | |
| 18 | 2 | |
| 19 | 5 | |
| 20 | 3 |
About Bau‐Tong Dai
Bau‐Tong Dai is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Materials Chemistry, having authored 85 papers that have together received 1.4k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (27 papers), Semiconductor materials and devices (25 papers) and Electrodeposition and Electroless Coatings (15 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (349 citations), Materials Chemistry (774 citations) and Electrical and Electronic Engineering (938 citations). Bau‐Tong Dai has collaborated with scholars based in Taiwan, United States and Japan. Frequent co-authors include Jia‐Min Shieh, Ming‐Shiann Feng, Shih-Chieh Chang, Ching‐Fa Yeh, Chien-Wei Liu, Wei‐Tsu Tseng, Fu‐Hsiang Ko, T. L. Chu, Ci‐Ling Pan and Yu‐Jen Hsiao. Their work appears in journals such as Applied Physics Letters, Journal of The Electrochemical Society and Applied Surface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.