Ying-Lang Wang

903 total citations
79 papers, 754 citations indexed

About

Ying-Lang Wang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering. According to data from OpenAlex, Ying-Lang Wang has authored 79 papers receiving a total of 754 indexed citations (citations by other indexed papers that have themselves been cited), including 70 papers in Electrical and Electronic Engineering, 44 papers in Electronic, Optical and Magnetic Materials and 18 papers in Biomedical Engineering. Recurrent topics in Ying-Lang Wang's work include Copper Interconnects and Reliability (42 papers), Semiconductor materials and devices (35 papers) and Electrodeposition and Electroless Coatings (21 papers). Ying-Lang Wang is often cited by papers focused on Copper Interconnects and Reliability (42 papers), Semiconductor materials and devices (35 papers) and Electrodeposition and Electroless Coatings (21 papers). Ying-Lang Wang collaborates with scholars based in Taiwan, United States and China. Ying-Lang Wang's co-authors include Shih-Chieh Chang, Wen-Hsi Lee, Ting‐Chang Chang, Kuan‐Chang Chang, Yong-En Syu, Tsung‐Ming Tsai, Tzeng‐Feng Liu, Simon M. Sze, Ming‐Jinn Tsai and Yi-Lung Cheng and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Journal of Alloys and Compounds.

In The Last Decade

Ying-Lang Wang

73 papers receiving 726 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Ying-Lang Wang Taiwan 15 651 225 210 123 98 79 754
Peng Hu China 14 269 0.4× 175 0.8× 113 0.5× 131 1.1× 63 0.6× 47 567
Dooho Choi South Korea 20 918 1.4× 529 2.4× 297 1.4× 119 1.0× 88 0.9× 53 1.2k
Ladislav Klimša Czechia 16 254 0.4× 382 1.7× 94 0.4× 77 0.6× 85 0.9× 44 602
M.M.R. Howlader Japan 19 844 1.3× 98 0.4× 140 0.7× 293 2.4× 65 0.7× 31 999
Andreas Rüdiger Germany 18 338 0.5× 474 2.1× 153 0.7× 198 1.6× 125 1.3× 36 740
J.S. Bow United States 11 432 0.7× 318 1.4× 97 0.5× 93 0.8× 119 1.2× 24 716
Sakari Sintonen Finland 15 485 0.7× 425 1.9× 171 0.8× 112 0.9× 29 0.3× 35 758
Pei‐I Wang United States 14 367 0.6× 229 1.0× 212 1.0× 211 1.7× 365 3.7× 41 997
Yuehua Dai China 12 398 0.6× 303 1.3× 102 0.5× 71 0.6× 108 1.1× 66 702
Jarkko Puustinen Finland 14 336 0.5× 275 1.2× 129 0.6× 224 1.8× 158 1.6× 34 688

Countries citing papers authored by Ying-Lang Wang

Since Specialization
Citations

This map shows the geographic impact of Ying-Lang Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ying-Lang Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ying-Lang Wang more than expected).

Fields of papers citing papers by Ying-Lang Wang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Ying-Lang Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ying-Lang Wang. The network helps show where Ying-Lang Wang may publish in the future.

Co-authorship network of co-authors of Ying-Lang Wang

This figure shows the co-authorship network connecting the top 25 collaborators of Ying-Lang Wang. A scholar is included among the top collaborators of Ying-Lang Wang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ying-Lang Wang. Ying-Lang Wang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lin, Yujie, et al.. (2015). Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing. Metallurgical and Materials Transactions A. 46(5). 1834–1837. 6 indexed citations
2.
Lin, Chih‐Yang, Kuan‐Chang Chang, Ting‐Chang Chang, et al.. (2015). Effects of Varied Negative Stop Voltages on Current Self-Compliance in Indium Tin Oxide Resistance Random Access Memory. IEEE Electron Device Letters. 36(6). 564–566. 42 indexed citations
3.
4.
Chang, Ting‐Chang, Yichun Wu, Yuting Chen, et al.. (2013). Impact of Electroforming Current on Self-Compliance Resistive Switching in an ${\rm ITO}/{\rm Gd{:}SiO}_{\rm x}/{\rm TiN}$ Structure. IEEE Electron Device Letters. 34(7). 858–860. 14 indexed citations
5.
Feng, Shien‐Ping, et al.. (2013). Effect of polyimide baking on bump resistance in flip-chip solder joints. Microelectronics Reliability. 54(3). 629–632. 8 indexed citations
6.
Lee, Wen-Hsi, et al.. (2011). Effect of Annealing on the Microstructure and Electrical Property of RuN Thin Films. Journal of The Electrochemical Society. 158(3). H338–H338. 14 indexed citations
7.
Wang, Ying-Lang, et al.. (2010). 銅の電気めっき槽中を流れるカソード電流によるビス(3‐ナトリウムスルホプロピルジスルフィド)の分解. Journal of The Electrochemical Society. 157(1). 131–135. 3 indexed citations
8.
Lee, Wen-Hsi, et al.. (2010). Effect of Under-Layer Treatment of Ta/TaN Barrier Film on Corrosion Between Cu Seed and Ta in Chemical-Mechanical-Polishing Slurry. Journal of Nanoscience and Nanotechnology. 10(7). 4196–4203. 1 indexed citations
9.
Liu, Chuan‐Pu, et al.. (2008). Direct Alpha Ta Formation on TaN by Resputtering for Low Resistive Diffusion Barriers. Journal of Nanoscience and Nanotechnology. 8(5). 2582–2587. 5 indexed citations
10.
Lee, Wen-Hsi, et al.. (2008). Investigation of Copper Scratches and Void Defects after Chemical Mechanical Polishing. Japanese Journal of Applied Physics. 47(9R). 7073–7073. 5 indexed citations
11.
Wang, Ying-Lang, et al.. (2008). Competitive Adsorption Between Bis(3-sodiumsulfopropyl disulfide) and Polyalkylene Glycols on Copper Electroplating. Journal of The Electrochemical Society. 155(9). H669–H669. 14 indexed citations
12.
Cheng, Yi-Lung & Ying-Lang Wang. (2008). Effect of Interfacial Condition on Electromigration for Narrow and Wide Copper Interconnects. Journal of Nanoscience and Nanotechnology. 8(5). 2494–2499. 4 indexed citations
13.
Wang, Ying-Lang, et al.. (2007). Substrate Effect on Plasma Clean Efficiency in Plasma Enhanced Chemical Vapor Deposition System. Active and Passive Electronic Components. 2007. 1–5. 3 indexed citations
14.
Chen, Sheng-Wen, et al.. (2007). The effect of oxygen content on bonding configuration and properties of low-k organosilicate glass dielectric film. Journal of Physics and Chemistry of Solids. 69(2-3). 513–517. 6 indexed citations
15.
Wang, Ying-Lang, et al.. (2007). Mechanism of the metal–insulator–metal capacitance drift for advanced mixed-signal copper process device. Journal of Physics and Chemistry of Solids. 69(2-3). 747–751. 2 indexed citations
16.
17.
Wu, Jun, et al.. (2005). Precipitates formation and its impact on the structure of plasma-deposited fluorinated silicon oxide films. Surface and Coatings Technology. 200(10). 3303–3308. 3 indexed citations
18.
Chang, Shih-Chieh & Ying-Lang Wang. (2004). Effects of applied voltages on planarization efficiency of Cu electropolishing. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 22(6). 2754–2757. 10 indexed citations
19.
Shieh, Jia‐Min, et al.. (2004). Reduction of Etch Pits of Electropolished Cu by Additives. Journal of The Electrochemical Society. 151(7). C459–C459. 14 indexed citations
20.
Chang, Shih-Chieh, Jia‐Min Shieh, Bau‐Tong Dai, Ming‐Shiann Feng, & Ying-Lang Wang. (2003). Improving the quality of electroplated copper films by rapid thermal annealing. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 21(2). 858–861. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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