Roy Knechtel

415 total citations
34 papers, 277 citations indexed

About

Roy Knechtel is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Roy Knechtel has authored 34 papers receiving a total of 277 indexed citations (citations by other indexed papers that have themselves been cited), including 29 papers in Electrical and Electronic Engineering, 8 papers in Mechanics of Materials and 6 papers in Mechanical Engineering. Recurrent topics in Roy Knechtel's work include 3D IC and TSV technologies (21 papers), Advanced MEMS and NEMS Technologies (17 papers) and Electronic Packaging and Soldering Technologies (13 papers). Roy Knechtel is often cited by papers focused on 3D IC and TSV technologies (21 papers), Advanced MEMS and NEMS Technologies (17 papers) and Electronic Packaging and Soldering Technologies (13 papers). Roy Knechtel collaborates with scholars based in Germany, United Kingdom and Lithuania. Roy Knechtel's co-authors include Maik Wiemer, W. Merlijn van Spengen, Ingrid De Wolf, J. Bagdahn, H.‐D. Geiler, Αναστάσιος Πετρόπουλος, Robert E. Ecke, Stefan E. Schulz, Danny Reuter and Thomas Geßner and has published in prestigious journals such as Japanese Journal of Applied Physics, ECS Journal of Solid State Science and Technology and Microsystem Technologies.

In The Last Decade

Roy Knechtel

25 papers receiving 247 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Roy Knechtel Germany	7	227	91	34	29	24	34	277
Tony Rogers United Kingdom	6	249 1.1×	116 1.3×	14 0.4×	16 0.6×	9 0.4×	14	293
Y. Le Tiec France	10	431 1.9×	88 1.0×	23 0.7×	24 0.8×	14 0.6×	23	468
Shari Farrens United States	10	266 1.2×	102 1.1×	11 0.3×	13 0.4×	12 0.5×	27	310
Lars Brusberg Germany	15	582 2.6×	178 2.0×	82 2.4×	10 0.3×	14 0.6×	71	643
N. Bresson France	11	341 1.5×	47 0.5×	7 0.2×	8 0.3×	22 0.9×	36	365
Vasarla Nagendra Sekhar Singapore	11	417 1.8×	80 0.9×	8 0.2×	30 1.0×	51 2.1×	64	456
S. Orain France	10	247 1.1×	55 0.6×	19 0.6×	68 2.3×	55 2.3×	24	352
M. Assous France	14	401 1.8×	68 0.7×	4 0.1×	60 2.1×	20 0.8×	45	433
Scott Pollard United States	14	338 1.5×	84 0.9×	20 0.6×	19 0.7×	26 1.1×	39	380
Jang‐Hi Im United States	9	419 1.8×	106 1.2×	4 0.1×	23 0.8×	32 1.3×	16	448

Countries citing papers authored by Roy Knechtel

Since Specialization

Citations

This map shows the geographic impact of Roy Knechtel's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Roy Knechtel with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Roy Knechtel more than expected).

Fields of papers citing papers by Roy Knechtel

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Roy Knechtel. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Roy Knechtel. The network helps show where Roy Knechtel may publish in the future.

Co-authorship network of co-authors of Roy Knechtel

This figure shows the co-authorship network connecting the top 25 collaborators of Roy Knechtel. A scholar is included among the top collaborators of Roy Knechtel based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Roy Knechtel. Roy Knechtel is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Knechtel, Roy, et al.. (2025). Experimental Study of Lidar System for a Static Object in Adverse Weather Conditions. Journal of Sensor and Actuator Networks. 14(3). 56–56.

Knechtel, Roy, et al.. (2023). Investigation of Anodic Bond Formation Process and Potential Use of the Results. ECS Transactions. 112(3). 207–220.

Knechtel, Roy, et al.. (2021). Heat Conductivity Based Inner Cavity Pressure Monitoring and Hermeticity Monitoring for Glass Frit Wafer Bonded MEMS Devices. ECS Journal of Solid State Science and Technology. 10(8). 84006–84006. 2 indexed citations

Karl, W.J., et al.. (2019). Adhesive wafer bonding for CMOS based lab-on-a-chip devices. Japanese Journal of Applied Physics. 59(SB). SBBD04–SBBD04.

Karl, W.J., et al.. (2019). Adhesive Wafer Bonding for CMOS based Lab-on-a-Chip Devices. 29–29.

Knechtel, Roy, et al.. (2018). Glass Frit Wafer Bonding for Encapsulating Monolithic Integrated CMOS-MEMS Devices. ECS Transactions. 86(5). 111–118. 8 indexed citations

Knechtel, Roy. (2017). International conference on wafer bonding for MEMS technologies and wafer level integration. Microsystem Technologies. 24(1). 771–771.

Knechtel, Roy, et al.. (2016). Glass Frit Wafer Bonding - Sealed Cavity Pressure in Relation to Bonding Process Parameters. ECS Meeting Abstracts. MA2016-02(32). 2101–2101. 1 indexed citations

Reuter, Danny, et al.. (2015). 3D integration approaches for MEMS and CMOS sensors based on a Cu through-silicon-via technology and wafer level bonding. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9517. 951709–951709. 7 indexed citations

10.

Knechtel, Roy, et al.. (2013). MEMS 3-axis inertial sensor process. 1–6. 1 indexed citations

11.

Knechtel, Roy, et al.. (2013). Monitoring Inner Pressure of MEMS Devices Sealed by Wafer Bonding. ECS Transactions. 50(7). 379–386. 1 indexed citations

12.

Geiler, H.‐D., et al.. (2013). Characterization of bonded wafer stacks by use of the photoelastic-analysis-method. Microsystem Technologies. 19(5). 697–703. 5 indexed citations

13.

Knechtel, Roy, et al.. (2011). B4.1 - Acceleration Sensor IP-Blocks for MEMS Foundry Surface Micromachining Process. 271–276. 1 indexed citations

14.

Knechtel, Roy. (2010). Single crystalline silicon based surface micromachining for high precision inertial sensors: technology and design for reliability. Microsystem Technologies. 16(5). 885–893. 5 indexed citations

15.

Allen, Richard A., Paul F. Langer, Frank W. DelRio‬, et al.. (2009). A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES | NIST. 1 indexed citations

16.

Knechtel, Roy, et al.. (2006). Low- and High- Temperature Silicon Wafer Direct Bonding for Micro- Machined Absolute Pressure Sensors. ECS Meeting Abstracts. MA2005-01(11). 497–497. 2 indexed citations

17.

Knechtel, Roy. (2006). Wafer Bonding Technologies in Industrial MEMS Processing - Potentials and Challenges. ECS Transactions. 3(6). 341–354.

18.

Knechtel, Roy, et al.. (2005). Wafer level encapsulation of microsystems using glass frit bonding. Microsystem Technologies. 12(5). 468–472. 64 indexed citations

19.

Knechtel, Roy, et al.. (2005). A test structure for characterization of the interface energy of anodically bonded silicon-glass wafers. Microsystem Technologies. 12(5). 462–467. 9 indexed citations

20.

Knechtel, Roy, et al.. (2003). Silicon wafer bonding for encapsulating surface-micromechanical-systems using intermediate glass layers. Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft). 321–328. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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