Daniel F. Baldwin

2.7k total citations · 1 hit paper
48 papers, 2.0k citations indexed

About

Daniel F. Baldwin is a scholar working on Electrical and Electronic Engineering, Polymers and Plastics and Mechanical Engineering. According to data from OpenAlex, Daniel F. Baldwin has authored 48 papers receiving a total of 2.0k indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 12 papers in Polymers and Plastics and 12 papers in Mechanical Engineering. Recurrent topics in Daniel F. Baldwin's work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (15 papers) and Polymer Foaming and Composites (11 papers). Daniel F. Baldwin is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (15 papers) and Polymer Foaming and Composites (11 papers). Daniel F. Baldwin collaborates with scholars based in United States, Canada and Norway. Daniel F. Baldwin's co-authors include Nam P. Suh, Chul B. Park, Róbert Langer, David Mooney, Joseph P. Vacanti, Myung Jin Yim, Sangil Lee, Sang-Il Lee, Chun‐Ho Kim and R.N. Master and has published in prestigious journals such as Journal of Applied Physics, Biomaterials and Nanotechnology.

In The Last Decade

Daniel F. Baldwin

47 papers receiving 1.9k citations

Hit Papers

align trajectories sort by overperformance

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Novel approach to fabricate porous sponges of poly(d,l-lactic-co-glycolic acid) without the use of organic solvents

1996 792 citations David Mooney, Daniel F. Baldwin et al. Biomaterials profile →

Author Peers

Peers are selected by citation overlap in the author's most active subfields. citations · hero ref

Author						Papers	Cites
Daniel F. Baldwin	1.0k	939	864	301	275	48	2.0k
Michael Jaffé	594 0.6×	780 0.8×	1.1k 1.3×	54 0.2×	140 0.5×	77	2.0k
Vincenzo La Carrubba	359 0.4×	950 1.0×	1.0k 1.2×	37 0.1×	533 1.9×	142	2.3k
Valerio Brucato	908 0.9×	994 1.1×	855 1.0×	32 0.1×	72 0.3×	128	2.3k
L. James Lee	676 0.7×	420 0.4×	516 0.6×	72 0.2×	79 0.3×	27	1.3k
Kathleen S. Toohey	1.5k 1.4×	413 0.4×	624 0.7×	74 0.2×	135 0.5×	19	2.1k
Mohammad Vatankhah‐Varnosfaderani	611 0.6×	518 0.6×	896 1.0×	21 0.1×	173 0.6×	25	2.1k
W.L. Cheung	499 0.5×	637 0.7×	1.1k 1.2×	29 0.1×	46 0.2×	43	2.0k
Tiejun Wang	503 0.5×	178 0.2×	994 1.2×	36 0.1×	144 0.5×	30	1.7k
Shuo Chen	1.7k 1.7×	733 0.8×	1.6k 1.8×	142 0.5×	226 0.8×	40	2.7k
Abu Bin Ihsan	1.0k 1.0×	1.1k 1.1×	1.8k 2.0×	13 0.0×	134 0.5×	29	3.4k

Countries citing papers authored by Daniel F. Baldwin

Since Specialization

Citations

This map shows the geographic impact of Daniel F. Baldwin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel F. Baldwin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel F. Baldwin more than expected).

Fields of papers citing papers by Daniel F. Baldwin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daniel F. Baldwin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel F. Baldwin. The network helps show where Daniel F. Baldwin may publish in the future.

Co-authorship network of co-authors of Daniel F. Baldwin

This figure shows the co-authorship network connecting the top 25 collaborators of Daniel F. Baldwin. A scholar is included among the top collaborators of Daniel F. Baldwin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daniel F. Baldwin. Daniel F. Baldwin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Mueller, Mark, Andrew Szentgyorgyi, Sagi Ben-Ami, et al.. (2024). Design and fabrication of composite structures in the GMT-Consortium Large Earth Finder (G-CLEF). 176–176. 1 indexed citations

Zlotnik, Anatoly, Aleksandr Rudkevich, Pablo A. Ruiz, et al.. (2018). Economic Optimization of Intra-Day Gas Pipeline Flow Schedules using Transient Flow Models. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information). 4 indexed citations

Baldwin, Daniel F., et al.. (2016). Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid. Microelectronics Reliability. 65. 217–224. 3 indexed citations

Baldwin, Daniel F., et al.. (2013). Extrusion temperature: a critical control point in pet food processing.. 21(5). 30–32. 2 indexed citations

Baldwin, Daniel F., et al.. (2010). Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects. IEEE Transactions on Electronics Packaging Manufacturing. 33(2). 129–134. 14 indexed citations

Lee, Sangil, et al.. (2010). Sensitivity analysis of Pb free reflow profile parameters toward flip chip on silicon assembly yield, reliability and intermetallic compound characteristics. 31. 1132–1138. 5 indexed citations

Baldwin, Daniel F., et al.. (2009). Adhesion mechanisms of nanoparticle silver to substrate materials: identification. Nanotechnology. 21(5). 55204–55204. 97 indexed citations

Lee, Sangil, Myung Jin Yim, & Daniel F. Baldwin. (2009). Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill. Journal of Electronic Packaging. 131(3). 11 indexed citations

Kim, Chun‐Ho, et al.. (2008). Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials. Journal of Applied Physics. 104(3). 16 indexed citations

10.

Lee, Sang-Il, Myung Jin Yim, R.N. Master, C.P. Wong, & Daniel F. Baldwin. (2008). Void Formation Study of Flip Chip in Package Using No-Flow Underfill. IEEE Transactions on Electronics Packaging Manufacturing. 31(4). 297–305. 19 indexed citations

11.

Lee, Sangil, Daniel F. Baldwin, R.N. Master, & S Parthasarathy. (2007). Assembly Yields Characterization of High IO Density, Fine Pitch Flip Chip in Package Using No-Flow Underfill. 35–41. 4 indexed citations

12.

Baldwin, Daniel F., et al.. (1998). Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling. 101–106. 2 indexed citations

13.

Baldwin, Daniel F., et al.. (1997). Manufacturability of Underfill Processing for Low Cost Flip Chip. 21–31. 2 indexed citations

14.

Baldwin, Daniel F., et al.. (1996). Thermal Management in Direct Chip Attach Assemblies. 29–37. 1 indexed citations

15.

Park, Chul B., Daniel F. Baldwin, & Nam P. Suh. (1996). Axiomatic design of a microcellular filament extrusion system. Research in Engineering Design. 8(3). 166–177. 16 indexed citations

16.

Mooney, David, Daniel F. Baldwin, Nam P. Suh, Joseph P. Vacanti, & Róbert Langer. (1996). Novel approach to fabricate porous sponges of poly(d,l-lactic-co-glycolic acid) without the use of organic solvents. Biomaterials. 17(14). 1417–1422. 792 indexed citations breakdown →

17.

Baldwin, Daniel F., et al.. (1995). The Role of Gas Dissolution and Induced Crystallization During Microcellular Polymer Processing: A Study of Poly (Ethylene Terephthalate) and Carbon Dioxide Systems. Journal of Engineering Materials and Technology. 117(1). 62–74. 70 indexed citations

18.

Baldwin, Daniel F., et al.. (1994). Microcellular Plastics Processing Technology (1). Seikei-Kakou. 6(3). 187–194. 3 indexed citations

19.

Baldwin, Daniel F., Derrick Tate, Chul B. Park, Wonmo Sung, & Nam P. Suh. (1994). Microcellular Plastics Processing Technology (2). Seikei-Kakou. 6(4). 245–256. 3 indexed citations

20.

Baldwin, Daniel F., et al.. (1994). Cell Size Effect on the Mechanical and Viscoelastic Behavior of Microcellular Plastics. Seikei-Kakou. 6(12). 863–868. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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