Daniel F. Baldwin

2.7k total citations · 1 hit paper
48 papers, 2.0k citations indexed

About

Daniel F. Baldwin is a scholar working on Electrical and Electronic Engineering, Polymers and Plastics and Mechanical Engineering. According to data from OpenAlex, Daniel F. Baldwin has authored 48 papers receiving a total of 2.0k indexed citations (citations by other indexed papers that have themselves been cited), including 26 papers in Electrical and Electronic Engineering, 12 papers in Polymers and Plastics and 12 papers in Mechanical Engineering. Recurrent topics in Daniel F. Baldwin's work include Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (15 papers) and Polymer Foaming and Composites (11 papers). Daniel F. Baldwin is often cited by papers focused on Electronic Packaging and Soldering Technologies (24 papers), 3D IC and TSV technologies (15 papers) and Polymer Foaming and Composites (11 papers). Daniel F. Baldwin collaborates with scholars based in United States, Canada and United Kingdom. Daniel F. Baldwin's co-authors include Nam P. Suh, Chul B. Park, Joseph P. Vacanti, Róbert Langer, David Mooney, Myung Jin Yim, Sangil Lee, Sang-Il Lee, Chun‐Ho Kim and R.N. Master and has published in prestigious journals such as Journal of Applied Physics, Biomaterials and Nanotechnology.

In The Last Decade

Daniel F. Baldwin

47 papers receiving 1.9k citations

Hit Papers

align trajectories

What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

Novel approach to fabricate porous sponges of poly(d,l-lactic-co-glycolic acid) without the use of organic solvents

1996 792 citations David Mooney, Daniel F. Baldwin et al. Biomaterials profile →

Peers

Countries citing papers authored by Daniel F. Baldwin

Since Specialization

Citations

This map shows the geographic impact of Daniel F. Baldwin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daniel F. Baldwin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daniel F. Baldwin more than expected).

Fields of papers citing papers by Daniel F. Baldwin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Daniel F. Baldwin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daniel F. Baldwin. The network helps show where Daniel F. Baldwin may publish in the future.

Co-authorship network of co-authors of Daniel F. Baldwin

This figure shows the co-authorship network connecting the top 25 collaborators of Daniel F. Baldwin. A scholar is included among the top collaborators of Daniel F. Baldwin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daniel F. Baldwin. Daniel F. Baldwin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Design and fabrication of composite structures in the GMT-Consortium Large Earth Finder (G-CLEF) 2024 ·Mark Mueller, Andrew Szentgyorgyi, Sagi Ben-Ami, Daniel F. Baldwin, Patricia Brennan, (unknown), Michael Eisenhower, Colby Jurgenson, K. G. McCracken, William Podgorski, Matthew R. Smith	1
2	Enhancing Student Classroom Engagement Through Social Networking Technology 2020 ·Papers on Engineering Education Repository (American Society for Engineering Education) ·(unknown), Daniel F. Baldwin, (unknown), (unknown), (unknown)	0
3	Economic Optimization of Intra-Day Gas Pipeline Flow Schedules using Transient Flow Models 2018 ·OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information) ·Anatoly Zlotnik, Aleksandr Rudkevich, (unknown), Pablo A. Ruiz, Michael C. Caramanis, Richard G. Carter, Scott Backhaus, Richard D. Tabors, Daniel F. Baldwin	4
4	Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid 2016 ·Microelectronics Reliability ·(unknown), (unknown), Daniel F. Baldwin	3
5	Extrusion temperature: a critical control point in pet food processing. 2013 ·(unknown), Daniel F. Baldwin	2
6	Advanced Package Prototyping Using Nano-Particle Silver Printed Interconnects 2010 ·IEEE Transactions on Electronics Packaging Manufacturing ·(unknown), Daniel F. Baldwin	14
7	Sensitivity analysis of Pb free reflow profile parameters toward flip chip on silicon assembly yield, reliability and intermetallic compound characteristics 2010 ·(unknown), Sangil Lee, B.J. Lewis, (unknown), Daniel F. Baldwin, (unknown), (unknown), John L. Evans	5
8	Adhesion mechanisms of nanoparticle silver to substrate materials: identification 2009 ·Nanotechnology ·(unknown), Daniel F. Baldwin	97
9	Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill 2009 ·Journal of Electronic Packaging ·Sangil Lee, Myung Jin Yim, Daniel F. Baldwin	11
10	Void Formation Study of Flip Chip in Package Using No-Flow Underfill 2008 ·IEEE Transactions on Electronics Packaging Manufacturing ·Sang-Il Lee, Myung Jin Yim, R.N. Master, C.P. Wong, Daniel F. Baldwin	19
11	Experimental evaluation of wetting dynamics models for Sn63Pb37 and SnAg4.0Cu0.5 solder materials 2008 ·Journal of Applied Physics ·Chun‐Ho Kim, (unknown), Daniel F. Baldwin	16
12	Preliminary in Process Stress Analysis of Flip Chip Assemblies During Thermal Cycling 1998 ·(unknown), Daniel F. Baldwin	2
13	Manufacturability of Underfill Processing for Low Cost Flip Chip 1997 ·Daniel F. Baldwin, (unknown)	2
14	Thermal Management in Direct Chip Attach Assemblies 1996 ·Daniel F. Baldwin, (unknown), Suresh K. Sitaraman	1
15	Novel approach to fabricate porous sponges of poly(d,l-lactic-co-glycolic acid) without the use of organic solvents breakdown → 1996 ·Biomaterials ·David Mooney, Daniel F. Baldwin, Nam P. Suh, Joseph P. Vacanti, Róbert Langer	792
16	Axiomatic design of a microcellular filament extrusion system 1996 ·Research in Engineering Design ·Chul B. Park, Daniel F. Baldwin, Nam P. Suh	16
17	The Role of Gas Dissolution and Induced Crystallization During Microcellular Polymer Processing: A Study of Poly (Ethylene Terephthalate) and Carbon Dioxide Systems 1995 ·Journal of Engineering Materials and Technology ·Daniel F. Baldwin, (unknown), Nam P. Suh	70
18	Microcellular Plastics Processing Technology (1) 1994 ·Seikei-Kakou ·Daniel F. Baldwin, Derrick Tate, Chul B. Park, (unknown), Nam P. Suh, (unknown)	3
19	Microcellular Plastics Processing Technology (2) 1994 ·Seikei-Kakou ·Daniel F. Baldwin, Derrick Tate, Chul B. Park, Wonmo Sung, Nam P. Suh	3
20	Cell Size Effect on the Mechanical and Viscoelastic Behavior of Microcellular Plastics 1994 ·Seikei-Kakou ·(unknown), Daniel F. Baldwin, Nam P. Suh	4

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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