Di Xu
- Electrical and Electronic Engineering top 10%
- Materials Chemistry top 10%
- Mechanical Engineering top 10%
- Electronic, Optical and Magnetic Materials top 10%
- Biomedical Engineering
- Topics
- Electronic Packaging and Soldering Technologies (13 papers)Copper Interconnects and Reliability (9 papers)3D IC and TSV technologies (8 papers)
- Partner nations
- ChinaUnited StatesCanada
In The Last Decade
Di Xu
42 papers receiving 899 citations
Peers
Comparison fields: 5 of 68
- Electrical and Electronic Engineering 490
- Materials Chemistry 467
- Mechanical Engineering 203
- Electronic, Optical and Magnetic Materials 202
- Biomedical Engineering 122
Countries citing papers authored by Di Xu
This map shows the geographic impact of Di Xu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Di Xu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Di Xu more than expected).
Fields of papers citing papers by Di Xu
This network shows the impact of papers produced by Di Xu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Di Xu. The network helps show where Di Xu may publish in the future.
Co-authorship network of co-authors of Di Xu
This figure shows the co-authorship network connecting the top 25 collaborators of Di Xu. A scholar is included among the top collaborators of Di Xu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Di Xu. Di Xu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 11 | |
| 2 | 7 | |
| 3 | 7 | |
| 4 | 6 | |
| 5 | 44 | |
| 6 | 4 | |
| 7 | 13 | |
| 8 | 4 | |
| 9 | 1 | |
| 10 | 34 | |
| 11 | 2 | |
| 12 | 31 | |
| 13 | 2 | |
| 14 | 16 | |
| 15 | 28 | |
| 16 | 81 | |
| 17 | 139 | |
| 18 | 56 | |
| 19 | 29 | |
| 20 | 91 |
About Di Xu
Di Xu is a scholar working on Acoustics and Ultrasonics, Polymers and Plastics and Electronic, Optical and Magnetic Materials, having authored 43 papers that have together received 916 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (13 papers), Copper Interconnects and Reliability (9 papers) and 3D IC and TSV technologies (8 papers). The work is most often cited by research in Ceramics and Composites (73 citations), Electronic, Optical and Magnetic Materials (202 citations) and Materials Chemistry (467 citations). Di Xu has collaborated with scholars based in China, United States and Canada. Frequent co-authors include K. N. Tu, Vidvuds Ozoliņš, M. Mayer, Yajuan Hao, Hua Zhang, Qing Wang, Guoqiang Jin, Xiang‐Yun Guo, Xiangfeng Duan and Donghua Wang. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Journal of The Electrochemical Society.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.