M. Thoben

688 total citations
26 papers, 559 citations indexed

About

M. Thoben is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering. According to data from OpenAlex, M. Thoben has authored 26 papers receiving a total of 559 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 3 papers in Automotive Engineering. Recurrent topics in M. Thoben's work include Silicon Carbide Semiconductor Technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). M. Thoben is often cited by papers focused on Silicon Carbide Semiconductor Technologies (16 papers), Electronic Packaging and Soldering Technologies (8 papers) and Electromagnetic Compatibility and Noise Suppression (4 papers). M. Thoben collaborates with scholars based in Germany, Austria and Romania. M. Thoben's co-authors include Josef Lutz, Oliver Schilling, G. Khatibi, Jürgen Wilde, Zhilin Cheng, M. Lederer, W. Blum, Wang Guo-zhong, Karl‐Friedrich Becker and Christian Herold and has published in prestigious journals such as SAE technical papers on CD-ROM/SAE technical paper series, Microelectronics Reliability and IEEE Transactions on Advanced Packaging.

In The Last Decade

M. Thoben

26 papers receiving 539 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
M. Thoben Germany	13	520	167	75	40	31	26	559
Max Poech Germany	7	589 1.1×	106 0.6×	29 0.4×	16 0.4×	39 1.3×	10	626
Erping Deng China	18	671 1.3×	202 1.2×	31 0.4×	71 1.8×	20 0.6×	59	746
Kristian Bonderup Pedersen Denmark	14	470 0.9×	95 0.6×	28 0.4×	27 0.7×	29 0.9×	24	504
Joshua Major United States	12	227 0.4×	120 0.7×	27 0.4×	63 1.6×	50 1.6×	29	317
N. Seliger Germany	12	541 1.0×	89 0.5×	29 0.4×	26 0.7×	86 2.8×	51	586
Michael D. Glover United States	12	726 1.4×	209 1.3×	16 0.2×	53 1.3×	32 1.0×	34	773
Ravi Kumar India	10	176 0.3×	92 0.6×	35 0.5×	36 0.9×	24 0.8×	41	303
Boon Long Lau Singapore	12	262 0.5×	290 1.7×	23 0.3×	75 1.9×	21 0.7×	60	508
Haksun Lee South Korea	7	349 0.7×	139 0.8×	15 0.2×	86 2.1×	34 1.1×	20	454
Borong Hu United Kingdom	9	338 0.7×	84 0.5×	13 0.2×	22 0.6×	20 0.6×	38	384

Countries citing papers authored by M. Thoben

Since Specialization

Citations

This map shows the geographic impact of M. Thoben's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. Thoben with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. Thoben more than expected).

Fields of papers citing papers by M. Thoben

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by M. Thoben. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. Thoben. The network helps show where M. Thoben may publish in the future.

Co-authorship network of co-authors of M. Thoben

This figure shows the co-authorship network connecting the top 25 collaborators of M. Thoben. A scholar is included among the top collaborators of M. Thoben based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with M. Thoben. M. Thoben is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Thoben, M., et al.. (2018). Benefits of new CoolSiCTM MOSFET in HybridPACKTM Drive package for electrical drive train applications.. 1–9. 14 indexed citations

Thoben, M., et al.. (2018). Automotive Qualification Routines for Power Electronics Components in Electrified Powertrains. 1–6. 4 indexed citations

Thiele, J.-U., et al.. (2016). Comparison of EMI behavior in inverter and buck-converter operation of power modules by considering the diode reverse recovery effects. 1–6. 1 indexed citations

Heuck, Nicolas, et al.. (2014). Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling. 1–6. 27 indexed citations

Thoben, M., et al.. (2014). Lifetime modeling and simulation of power modules for hybrid electrical/electrical vehicles. Microelectronics Reliability. 54(9-10). 1806–1812. 25 indexed citations

Lederer, M., et al.. (2013). Simulation of stress concentrations in wire-bonds using a novel strain gradient theory. 23. 1–6. 2 indexed citations

Paul, Igor L., et al.. (2013). Influence of wirebond shape on its lifetime with application to frame connections. 1–5. 9 indexed citations

Lederer, M., et al.. (2012). Thermo-mechanical analysis of bonding wires in IGBT modules under operating conditions. Microelectronics Reliability. 52(9-10). 2353–2357. 70 indexed citations

Lederer, M., et al.. (2012). Electro-thermal analysis of in situ vibration measurements on IGBT modules under operation conditions. 1–6. 4 indexed citations

10.

Schilling, Oliver, et al.. (2012). Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules. Microelectronics Reliability. 52(9-10). 2347–2352. 68 indexed citations

11.

Lederer, M., et al.. (2012). In situ vibration measurements on power modules under operating conditions. 1/5–5/5. 4 indexed citations

12.

Thoben, M., et al.. (2011). Lifetime calculation for power modules, application and theory of models and counting methods. European Conference on Power Electronics and Applications. 1–8. 45 indexed citations

13.

Herold, Christian, et al.. (2011). Thermal impedance spectroscopy of power modules. Microelectronics Reliability. 51(9-11). 1679–1683. 36 indexed citations

14.

Lutz, Josef, et al.. (2010). First power cycling results of improved packaging technologies for hybrid electrical vehicle applications. 1–5. 12 indexed citations

15.

Ahmed, Sara, et al.. (2007). Design Considerations for Power Electronics in HEV Applications. SAE technical papers on CD-ROM/SAE technical paper series. 1. 3 indexed citations

16.

Lutz, Josef, et al.. (2005). Double-sided low-temperature joining technique for power cycling capability at high temperature. 10 pp.–P.10. 42 indexed citations

17.

Thoben, M., et al.. (2003). An integrated design approach for the hardware optimization of electrical power modules for automotive electrotraction. 170–178. 2 indexed citations

18.

Thoben, M., et al.. (2001). Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size. Microelectronics Reliability. 41(9-10). 1719–1723. 6 indexed citations

19.

Wilde, Jürgen, Karl‐Friedrich Becker, M. Thoben, et al.. (2000). Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder. IEEE Transactions on Advanced Packaging. 23(3). 408–414. 95 indexed citations

20.

Thoben, M., et al.. (1998). Integration of Liquid Cooling, Thermal and Thermomechanical Design for the Lifetime Prediction of Electrical Power Modules. SAE technical papers on CD-ROM/SAE technical paper series. 1. 6 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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