Andrej Stranz
Impact in
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- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 11
- Advanced MEMS and NEMS Technologies 8
- 3D IC and TSV technologies 6
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- Nanowire Synthesis and Applications 11
- Co-authors
- A. Waag (32 shared papers)Erwin Peiner (31 shared papers)J. Kähler (13 shared papers)Stephan Merzsch (13 shared papers)Nicolas Heuck (7 shared papers)Hutomo Suryo Wasisto (9 shared papers)Erik Uhde (6 shared papers)Tunga Salthammer (6 shared papers)
In The Last Decade
Andrej Stranz
38 papers receiving 811 citations
Peers
Comparison fields: 5 of 45
- Electrical and Electronic Engineering 503
- Nuclear Energy and Engineering 4
- Materials Chemistry 311
- Biomedical Engineering 285
- Atomic and Molecular Physics, and Optics 192
Countries citing papers authored by Andrej Stranz
This map shows the geographic impact of Andrej Stranz's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Andrej Stranz with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Andrej Stranz more than expected).
Fields of papers citing papers by Andrej Stranz
This network shows the impact of papers produced by Andrej Stranz. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Andrej Stranz. The network helps show where Andrej Stranz may publish in the future.
Co-authors
The 25 scholars most cited alongside Andrej Stranz, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 38 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2018 | 73 | |
| 2 | 2012 | 73 | |
| 3 | 2013 | 64 | |
| 4 | 2013 | 62 | |
| 5 | 2009 | 50 | |
| 6 | 2011 | 42 | |
| 7 | 2013 | 38 | |
| 8 | 2011 | 36 | |
| 9 | 2013 | 35 | |
| 10 | 2010 | 34 | |
| 11 | 2013 | 28 | |
| 12 | 2010 | 28 | |
| 13 | 2018 | 28 | |
| 14 | Low-pressure sintering of silver micro- and nanoparticles for a high temperature stable pick & place die attach | 2011 | 26 |
| 15 | 2011 | 21 | |
| 16 | 2013 | 18 | |
| 17 | 2013 | 17 | |
| 18 | 2011 | 16 | |
| 19 | 2010 | 15 | |
| 20 | 2010 | 14 |
About Andrej Stranz
Andrej Stranz is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Atomic and Molecular Physics, and Optics and Mechanical Engineering, having authored 38 papers that have together received 823 indexed citations. Recurring topics across this work include Advanced Thermoelectric Materials and Devices (14 papers), Thermal properties of materials (12 papers), Nanowire Synthesis and Applications (11 papers), Electronic Packaging and Soldering Technologies (11 papers), Mechanical and Optical Resonators (10 papers), Advanced MEMS and NEMS Technologies (8 papers), Thermal Radiation and Cooling Technologies (6 papers) and 3D IC and TSV technologies (6 papers). The work is most often cited by research in Electrical and Electronic Engineering (503 citations), Nuclear Energy and Engineering (4 citations), Materials Chemistry (311 citations), Biomedical Engineering (285 citations) and Atomic and Molecular Physics, and Optics (192 citations). Andrej Stranz has collaborated with scholars based in Germany, Spain and Austria. Frequent co-authors include A. Waag, Erwin Peiner, J. Kähler, Stephan Merzsch, Nicolas Heuck, Hutomo Suryo Wasisto, Erik Uhde, Tunga Salthammer, Alexander Wagner and L. Fonseca. Their work appears in journals such as Journal of Electronic Materials, Microsystem Technologies, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Micromechanics and Microengineering and Journal of Power Sources.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.