Karsten Guth

428 total citations
29 papers, 343 citations indexed

About

Karsten Guth is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Condensed Matter Physics. According to data from OpenAlex, Karsten Guth has authored 29 papers receiving a total of 343 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 12 papers in Mechanical Engineering and 9 papers in Condensed Matter Physics. Recurrent topics in Karsten Guth's work include Electronic Packaging and Soldering Technologies (17 papers), Physics of Superconductivity and Magnetism (9 papers) and Magnetic properties of thin films (7 papers). Karsten Guth is often cited by papers focused on Electronic Packaging and Soldering Technologies (17 papers), Physics of Superconductivity and Magnetism (9 papers) and Magnetic properties of thin films (7 papers). Karsten Guth collaborates with scholars based in Germany, Canada and Spain. Karsten Guth's co-authors include Nicolas Heuck, Ch. Jooss, N. Oeschler, Yimei Zhu, Marco Beleggia, H.C. Freyhardt, Christian Jooß, Walter Sextro, Marvin A. Schofield and Peter Mahnke and has published in prestigious journals such as Physical Review Letters, Physical review. B, Condensed matter and The European Physical Journal B.

In The Last Decade

Karsten Guth

29 papers receiving 305 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
Karsten Guth Germany	11	230	112	107	63	45	29	343
M. Ishiko Japan	11	352 1.5×	115 1.0×	29 0.3×	86 1.4×	21 0.5×	31	384
Richard Beaupre United States	10	293 1.3×	36 0.3×	66 0.6×	56 0.9×	9 0.2×	16	341
G.J. Riedel Switzerland	12	369 1.6×	215 1.9×	30 0.3×	22 0.3×	24 0.5×	24	446
V. Banu Spain	12	509 2.2×	39 0.3×	93 0.9×	41 0.7×	10 0.2×	55	536
Chengzhan Li China	12	399 1.7×	35 0.3×	78 0.7×	72 1.1×	6 0.1×	71	490
Olga V. Emelyanova Russia	9	105 0.5×	77 0.7×	42 0.4×	59 0.9×	13 0.3×	23	292
Ryan Davies United States	13	362 1.6×	136 1.2×	33 0.3×	112 1.8×	15 0.3×	17	508
Tatsuhiko Fujihira Japan	11	1.0k 4.5×	142 1.3×	33 0.3×	72 1.1×	13 0.3×	32	1.1k
Leonid Fursin United States	16	701 3.0×	42 0.4×	31 0.3×	40 0.6×	20 0.4×	58	736
J. D. Blevins United States	13	271 1.2×	184 1.6×	31 0.3×	201 3.2×	48 1.1×	17	471

Countries citing papers authored by Karsten Guth

Since Specialization

Citations

This map shows the geographic impact of Karsten Guth's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Karsten Guth with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Karsten Guth more than expected).

Fields of papers citing papers by Karsten Guth

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Karsten Guth. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Karsten Guth. The network helps show where Karsten Guth may publish in the future.

Co-authorship network of co-authors of Karsten Guth

This figure shows the co-authorship network connecting the top 25 collaborators of Karsten Guth. A scholar is included among the top collaborators of Karsten Guth based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Karsten Guth. Karsten Guth is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Schulze, H., et al.. (2016). Reliability aspects of copper metallization and interconnect technology for power devices. Microelectronics Reliability. 64. 393–402. 15 indexed citations

Hunstig, Matthias, et al.. (2016). Wear optimized consumables for copper wire bonding in industrial mass production. 1–7. 3 indexed citations

Unger, Andreas, et al.. (2016). Micro wear modeling in copper wire wedge bonding. 21–24. 6 indexed citations

Dohnke, Karl Otto, Karsten Guth, & Nicolas Heuck. (2016). History and Recent Developments of Packaging Technology for SiC Power Devices. Materials science forum. 858. 1043–1048. 6 indexed citations

Unger, Andreas, et al.. (2016). Validated simulation of the ultrasonic wire bonding process. 251–254. 4 indexed citations

Meyer, Tobias, et al.. (2016). Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation. 447. 622–628. 2 indexed citations

Meyer, Tobias, et al.. (2015). Modeling and simulation of the ultrasonic wire bonding process. 238. 1–4. 8 indexed citations

Guth, Karsten, et al.. (2015). End-of-life investigation on the .XT interconnect technology. 1–8. 12 indexed citations

Unger, Andreas, Walter Sextro, Tobias Meyer, et al.. (2014). Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding. 141. 1–11. 9 indexed citations

10.

Heuck, Nicolas, et al.. (2014). Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling. 1–6. 27 indexed citations

11.

Unger, Andreas, et al.. (2014). Experimental and Numerical Simulation Study of Pre-deformed Heavy Copper Wire Wedge Bonds. IMAPSource Proceedings. 2014(1). 289–294. 8 indexed citations

12.

Schaper, Mirko, et al.. (2014). Microstructural investigations of aluminum and copper wire bonds. IMAPSource Proceedings. 2014(1). 845–849. 3 indexed citations

13.

Guth, Karsten, et al.. (2012). New assembly and interconnect technologies for power modules. 1–5. 46 indexed citations

14.

Lutz, Josef, et al.. (2010). First power cycling results of improved packaging technologies for hybrid electrical vehicle applications. 1–5. 12 indexed citations

15.

Guth, Karsten & Peter Mahnke. (2006). Improving the thermal reliability of large area solder joints in IGBT power modules. 1–6. 16 indexed citations

16.

Schofield, Marvin A., Marco Beleggia, Yimei Zhu, Karsten Guth, & Christian Jooß. (2004). Direct Evidence for Negative Grain Boundary Potential in Ca-Doped and UndopedYBa2Cu3O7−x. Physical Review Letters. 92(19). 195502–195502. 45 indexed citations

17.

Jooss, Ch., Karsten Guth, M. A. Schofield, Marco Beleggia, & Yimei Zhu. (2004). Direct measurements of electrostatic potentials at grain boundaries: mechanism for current improvement in high-Tc superconductors. Physica C Superconductivity. 408-410. 443–444. 6 indexed citations

18.

Guth, Karsten, et al.. (2004). Inhomogeneous current distribution in wide high-temperature superconducting small-angle grain boundaries. The European Physical Journal B. 42(2). 239–245. 4 indexed citations

19.

Guth, Karsten, et al.. (2003). Improved grain boundary currents in textured YBa₂Cu₃Othin films on bicrystalline Ni substrates. Superconductor Science and Technology. 17(1). 65–70. 4 indexed citations

20.

Guth, Karsten, Hans‐Ulrich Krebs, H.C. Freyhardt, & Ch. Jooss. (2001). Modification of transport properties in low-angle grain boundaries via calcium doping ofYBa2Cu3Oδthin films. Physical review. B, Condensed matter. 64(14). 29 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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