Alessandro Sitta

416 total citations
43 papers, 219 citations indexed

About

Alessandro Sitta is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Alessandro Sitta has authored 43 papers receiving a total of 219 indexed citations (citations by other indexed papers that have themselves been cited), including 39 papers in Electrical and Electronic Engineering, 10 papers in Mechanical Engineering and 7 papers in Mechanics of Materials. Recurrent topics in Alessandro Sitta's work include Silicon Carbide Semiconductor Technologies (25 papers), Electronic Packaging and Soldering Technologies (21 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). Alessandro Sitta is often cited by papers focused on Silicon Carbide Semiconductor Technologies (25 papers), Electronic Packaging and Soldering Technologies (21 papers) and Electromagnetic Compatibility and Noise Suppression (8 papers). Alessandro Sitta collaborates with scholars based in Italy, Czechia and Switzerland. Alessandro Sitta's co-authors include Michele Calabretta, Gaetano Sequenzia, Salvatore Massimo Oliveri, Giuseppe D’Arrigo, Angelo Messina, Giuseppe Mirone, S. Russo, Fabrizio Roccaforte, Vincenzo Vinciguerra and C. Moïse and has published in prestigious journals such as IEEE Access, Surface and Coatings Technology and Materials & Design.

In The Last Decade

Alessandro Sitta

38 papers receiving 210 citations

Peers

Alessandro Sitta

EEE

Michele Calabretta Italy

Asier Matallana Spain

Nicolas Heuck Germany

Hai Ren China

Mohd. Amir Eleffendi United Kingdom

Asger Bjørn Jørgensen Denmark

Stefan Mollov France

M. Thoben Germany

Enea Bianda Switzerland

Reinhold Bayerer Germany

Michele Calabretta Italy

Alessandro Sitta

257 ×1.4

EEE

106 ×1.5

31 ×1.3

28 ×1.2

28 ×1.4

Citations per year, relative to Alessandro Sitta Alessandro Sitta (= 1×) peers Michele Calabretta

Countries citing papers authored by Alessandro Sitta

Since Specialization

Citations

This map shows the geographic impact of Alessandro Sitta's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Alessandro Sitta with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Alessandro Sitta more than expected).

Fields of papers citing papers by Alessandro Sitta

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Alessandro Sitta. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Alessandro Sitta. The network helps show where Alessandro Sitta may publish in the future.

Co-authorship network of co-authors of Alessandro Sitta

This figure shows the co-authorship network connecting the top 25 collaborators of Alessandro Sitta. A scholar is included among the top collaborators of Alessandro Sitta based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Alessandro Sitta. Alessandro Sitta is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sitta, Alessandro, et al.. (2025). Reliability assessment of SiC power MOSFETs in dynamic reverse bias test. Microelectronics Reliability. 171. 115770–115770.

Messina, Angelo, et al.. (2024). Assessing the Stress Induced by Novel Packaging in GaN HEMT Devices via Raman Spectroscopy. Applied Sciences. 14(10). 4230–4230. 1 indexed citations

Sitta, Alessandro, et al.. (2024). Development of a Computational Fluid Dynamics Model to Evaluate the Thermal Resistance of a SiC Power Module Under Several Operating Condition. 1–7.

Sitta, Alessandro, et al.. (2023). TIMs for transfer molded power modules: Characterization, reliability, and modeling. Microelectronics Reliability. 148. 115162–115162. 2 indexed citations

Pino, Carmelo, Alessandro Sitta, Angelo Messina, et al.. (2023). Intelligent Traction Inverter in Next Generation Electric Vehicles: The Health Monitoring of Silicon-Carbide Power Modules. IEEE Transactions on Intelligent Vehicles. 8(12). 4734–4753. 3 indexed citations

Calabretta, Michele, Alessandro Sitta, Francesco Rundo, & Gaetano Sequenzia. (2023). Warpage modeling for semiconductor power module manufacturing flow improvement. Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture. 238(4). 538–548. 2 indexed citations

Sitta, Alessandro, et al.. (2023). Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications. 1–6. 1 indexed citations

Calabretta, Michele & Alessandro Sitta. (2022). A novel integrated approach to optimize copper wire bonding processes and manufacturing. International Journal on Interactive Design and Manufacturing (IJIDeM). 16(1). 371–379. 3 indexed citations

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2022). Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis. Engineering Fracture Mechanics. 266. 108339–108339. 8 indexed citations

10.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling. Applied Sciences. 11(15). 7012–7012. 22 indexed citations

11.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Structural characterization of semiconductor multi-layer pad. Proceedings of the Institution of Mechanical Engineers Part C Journal of Mechanical Engineering Science. 235(24). 7734–7742. 2 indexed citations

12.

Sitta, Alessandro, et al.. (2021). Integrated Electromagnetic-Thermal Approach to Simulate a GaN-Based Monolithic Half-Bridge for Automotive DC-DC Converter. Applied Sciences. 11(18). 8302–8302. 4 indexed citations

13.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Warpage Behavior on Silicon Semiconductor Device: The Impact of Thick Copper Metallization. Applied Sciences. 11(11). 5140–5140. 8 indexed citations

14.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Silicon Carbide Multi-Chip Power Module for Traction Inverter Applications: Thermal Characterization and Modeling. IEEE Access. 9. 76307–76314. 16 indexed citations

15.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2021). Power Semiconductor Devices and Packages: Solder Mechanical Characterization and Lifetime Prediction. IEEE Access. 9. 22859–22867. 13 indexed citations

16.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2020). Experimental characterization and modeling of power module warpage during assembly process. International Journal on Interactive Design and Manufacturing (IJIDeM). 15(1). 113–115. 3 indexed citations

17.

Calabretta, Michele, Alessandro Sitta, Salvatore Massimo Oliveri, & Gaetano Sequenzia. (2020). An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization. International Journal on Interactive Design and Manufacturing (IJIDeM). 15(1). 117–119. 3 indexed citations

18.

Sitta, Alessandro, et al.. (2020). Analysis of warpage behavior of electrochemical deposited thick copper on silicon. 1–4. 2 indexed citations

19.

Mirone, Giuseppe, Alessandro Sitta, Giuseppe D’Arrigo, & Michele Calabretta. (2019). Material Characterization and Warpage Modeling for Power Devices Active Metal Brazed Substrates. IEEE Transactions on Device and Materials Reliability. 19(3). 537–542. 22 indexed citations

20.

Russo, S., et al.. (2019). Thermal Analysis Approach for Predicting Power Device Lifetime. IEEE Transactions on Device and Materials Reliability. 19(1). 159–163. 15 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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