Matthias Petzold
- Electrical and Electronic Engineering top 5%
- Biomedical Engineering
- Mechanical Engineering top 10%
- Mechanics of Materials top 5%
- Materials Chemistry
- Co-authors
- Sebastian BrandJ. BagdahnFrank AltmannMichael KrauseD. TempleMaik WiemerDean MaltaChristian Dresbach
- Topics
- Electronic Packaging and Soldering Technologies (60 papers)3D IC and TSV technologies (43 papers)Integrated Circuits and Semiconductor Failure Analysis (33 papers)
- Partner nations
- GermanyUnited StatesAustria
In The Last Decade
Matthias Petzold
110 papers receiving 999 citations
Peers
Comparison fields: 5 of 84
- Electrical and Electronic Engineering 721
- Biomedical Engineering 232
- Mechanical Engineering 215
- Mechanics of Materials 206
- Materials Chemistry 136
Countries citing papers authored by Matthias Petzold
This map shows the geographic impact of Matthias Petzold's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Matthias Petzold with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Matthias Petzold more than expected).
Fields of papers citing papers by Matthias Petzold
This network shows the impact of papers produced by Matthias Petzold. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Matthias Petzold. The network helps show where Matthias Petzold may publish in the future.
Co-authorship network of co-authors of Matthias Petzold
This figure shows the co-authorship network connecting the top 25 collaborators of Matthias Petzold. A scholar is included among the top collaborators of Matthias Petzold based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Matthias Petzold. Matthias Petzold is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | 15 | |
| 3 | 11 | |
| 4 | 12 | |
| 5 | High resolution failure analysis of silver-sintered contact interfaces for power electronics | 2 |
| 6 | 1 | |
| 7 | 1 | |
| 8 | Packaging material issues in high temperature power electronics | 4 |
| 9 | Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation | 0 |
| 10 | 11 | |
| 11 | 1 | |
| 12 | 1 | |
| 13 | 29 | |
| 14 | 3 | |
| 15 | 2 | |
| 16 | 75 | |
| 17 | Advanced failure analysis methods and microstructural investigations of wire bond contacts for current microelectronic system integration | 2 |
| 18 | 9 | |
| 19 | 81 | |
| 20 | 12 |
About Matthias Petzold
Matthias Petzold is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and General Materials Science, having authored 114 papers that have together received 1.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (43 papers) and Integrated Circuits and Semiconductor Failure Analysis (33 papers). The work is most often cited by research in Orthodontics (86 citations), Electrical and Electronic Engineering (721 citations) and Periodontics (48 citations). Matthias Petzold has collaborated with scholars based in Germany, United States and Austria. Frequent co-authors include Sebastian Brand, J. Bagdahn, Frank Altmann, Michael Krause, D. Temple, Maik Wiemer, Dean Malta, Christian Dresbach, Thomas Geßner and Benjamin März. Their work appears in journals such as Applied Physics Letters, Bone and Thin Solid Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.