Dean Malta

1.1k citations

51 papers · 852 indexed · h-index 17

Impact in

Electrical and Electronic Engineering top 5%
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- Microwave Engineering and Waveguides
Materials Chemistry top 10%
- Diamond and Carbon-based Materials Research

Papers in

Electrical and Electronic Engineering 44
- 3D IC and TSV technologies 21
- Semiconductor materials and devices 11
- Electronic Packaging and Soldering Technologies 9
- Microwave Engineering and Waveguides 7
- Advanced Semiconductor Detectors and Materials 7
- CCD and CMOS Imaging Sensors 5
Atomic and Molecular Physics, and Optics 11
- Gyrotron and Vacuum Electronics Research 6

Co-authors: Bradley A. Fox Jesko A. von Windheim D. Temple R Glass Matthew Lueck K. Das V. Venkatesan Brian R. Stoner
Journals: Diamond and Related Materials (3 papers)Applied Physics Letters (2 papers)Journal of Applied Physics (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)Journal of Astronomical Telescopes Instruments and Systems (1 paper)
Partner nations: United States Germany Japan

In The Last Decade

Dean Malta

50 papers receiving 816 citations

Peers

Countries citing papers authored by Dean Malta

Since Specialization

Citations

This map shows the geographic impact of Dean Malta's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dean Malta with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dean Malta more than expected).

Fields of papers citing papers by Dean Malta

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Dean Malta. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dean Malta. The network helps show where Dean Malta may publish in the future.

Co-authorship network

The 25 scholars most cited alongside Dean Malta, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Dean Malta Line = papers co-authored together Dean Malta links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	TSV-Last, Heterogeneous 3D Integration of a SiGe BiCMOS Beamformer and Patch Antenna for a W-Band Phased array Radar Dean Malta, Erik Vick, Matthew Lueck, Alan Huffman, David Corbella, Marcela Daza, Md. Rasel Ahmed, Prashant Mata, Д. С. Полетаев, A Duinat-Pascal, Adam Young, 亚森江, Jonathan Hacker	2016	12
2	Advances in three-dimensional integration technologies in support of infrared focal plane arrays Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·D. Temple, Erik Vick, Dean Malta, Matthew Lueck, M. R. Skokan, S. Pitrova, M. Muzilla	2015	1
3	Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·D. Temple, Erik Vick, Matthew Lueck, Dean Malta, M. R. Skokan, S. Pitrova, M. Muzilla	2014	3
4	Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE ·Matthew Lueck, John Lannon, Chris Gregory, Dean Malta, Alan Huffman, D. Temple	2014	3
5	Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization IEEE Transactions on Components Packaging and Manufacturing Technology ·John Lannon, F. Fantasia, Alan Huffman, Isidor Marí, Dean Malta, Chris Gregory, D. Temple	2013	10
6	Characterization and modeling of copper TSVs for silicon interposers Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Dean Malta, Chris Gregory, Matthew Lueck, John Lannon, Jay Lewis, D. Temple, P Weinert, Markus Engblom, Matthias Petzold	2013	8
7	Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs Matthew Lueck, Dean Malta, Alan Huffman, Chris Gregory, Isidor Marí, John Lannon, D. Temple	2013	7
8	Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Dean Malta, Christopher W. Gregory, Matthew Lueck, D. Temple, Michael Krause, Frank Altmann, Matthias Petzold, М. В. Жуйкова, Frederique Marie Brigitte Sylvie Grassi	2011	29
9	Microfabrication of diamond-based slow-wave circuits for mm-wave and THz vacuum electronic sources Journal of Micromechanics and Microengineering ·Matthew Lueck, Dean Malta, Kristin H. Gilchrist, Carol L. Kory, C. Flesch, Болтаев	2011	22
10	Extending acoustic microscopy for comprehensive failure analysis applications Journal of Materials Science Materials in Electronics ·Sebastian Brand, T. J. Peck, Melis Suskun, D. Temple, Dean Malta, Jason D. Reed, Matthias Petzold	2011	25
11	Optimization of chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D integration Dean Malta, Christopher W. Gregory, D. Temple, Chen Wang, Thomas J. Richardson, Yun Zhang	2009	12
12	Applying microfabrication to helical vacuum electron devices for THz applications J. A. Dayton, Carol L. Kory, Irina Simon, Dean Malta, Matthew Lueck, Kristin H. Gilchrist	2009	16
13	Assembly and preliminary testing of the prototype 650 GHz BWO J. A. Dayton, Irina Simon, Carol L. Kory, Dean Malta, Matthew Lueck, Anisa Kurnia Dewi, M Greisel, C.E. Holland, 商建英	2008	1
14	High Density, Vertical Interconnects for 3-D Integration of Silicon Integrated Circuits Christopher A. Bower, Dean Malta, D. Temple, James E. Robinson, 保三斉藤, M. R. Skokan, Карина Терешкина	2006	36
15	High Density 3-D Integration Technology for Massively Parallel Signal Processing in Advanced Infrared Focal Plane Array Sensors D. Temple, Christopher A. Bower, Dean Malta, James E. Robinson, 保三斉藤, M. R. Skokan, Карина Терешкина	2006	23
16	Impurity-characterization agreement in type-IIb single-crystal diamond by high-temperature Hall-effect, capacitance-voltage, and secondary-ion mass-spectroscopy measurements Physical review. B, Condensed matter ·José Ángel Unanue, Dean Malta, Bradley A. Fox, Jesko A. von Windheim, J. P. Fleurial, D. Irvine, Jan W. Vandersande	1994	4
17	Diamond Field-Effect Transistors MRS Proceedings ·D.L. Dreifus, A.J. Tessmer, 健二郎松本, Santanu Kumar Tripathi, Dean Malta, Yuan Ren, Brian R. Stoner	1994	4
18	Epitaxial nucleation, growth and characterization of highly oriented, (100)-textured diamond films on silicon Diamond and Related Materials ·Bradley A. Fox, Brian R. Stoner, Dean Malta, Penny Ellis, R Glass, Ade Irvan Y. Muskanan	1994	43
19	Evaluation of ohmic contacts formed by B+ implantation and Ti-Au metallization on diamond Journal of Applied Physics ·V. Venkatesan, Dean Malta, K. Das, A. M. Belu	1993	42
20	Selected-area homoepitaxial growth and overgrowth on Si patterned diamond substrates R. A. Rudder, J. B. Posthill, G. Hudson, Dean Malta, R. E. Thomas, R. J. Markunas, T. P. Humphreys, R. J. Nemanich	1991	0

About Dean Malta

Dean Malta is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Mechanics of Materials, Aerospace Engineering and Materials Chemistry, having authored 51 papers that have together received 852 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (21 papers), Diamond and Carbon-based Materials Research (13 papers), Semiconductor materials and devices (11 papers), Electronic Packaging and Soldering Technologies (9 papers), Microwave Engineering and Waveguides (7 papers), Advanced Semiconductor Detectors and Materials (7 papers), Gyrotron and Vacuum Electronics Research (6 papers) and CCD and CMOS Imaging Sensors (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (667 citations), Materials Chemistry (387 citations), Mechanics of Materials (166 citations), Atomic and Molecular Physics, and Optics (205 citations) and Ceramics and Composites (34 citations). Dean Malta has collaborated with scholars based in United States, Germany and Japan. Frequent co-authors include Bradley A. Fox, Jesko A. von Windheim, D. Temple, R Glass, Matthew Lueck, K. Das, V. Venkatesan, Brian R. Stoner, D. Henshall and St.G. Müller. Their work appears in journals such as Diamond and Related Materials, Applied Physics Letters, Journal of Applied Physics, IEEE Transactions on Components Packaging and Manufacturing Technology and Journal of Astronomical Telescopes Instruments and Systems.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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