Matthew Lueck

759 total citations
52 papers, 604 citations indexed

About

Matthew Lueck is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Automotive Engineering. According to data from OpenAlex, Matthew Lueck has authored 52 papers receiving a total of 604 indexed citations (citations by other indexed papers that have themselves been cited), including 50 papers in Electrical and Electronic Engineering, 13 papers in Atomic and Molecular Physics, and Optics and 9 papers in Automotive Engineering. Recurrent topics in Matthew Lueck's work include 3D IC and TSV technologies (31 papers), Electronic Packaging and Soldering Technologies (23 papers) and Microwave Engineering and Waveguides (9 papers). Matthew Lueck is often cited by papers focused on 3D IC and TSV technologies (31 papers), Electronic Packaging and Soldering Technologies (23 papers) and Microwave Engineering and Waveguides (9 papers). Matthew Lueck collaborates with scholars based in United States and Germany. Matthew Lueck's co-authors include D. Temple, Alan Huffman, Dean Malta, Christopher W. Gregory, Steven A. Ringel, C. Andre, John Lannon, John M. Lannon, Jason D. Reed and Arthur J. Pitera and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Electron Devices and Japanese Journal of Applied Physics.

In The Last Decade

Matthew Lueck

52 papers receiving 582 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Matthew Lueck United States 15 566 179 131 65 56 52 604
J. Cotte United States 15 502 0.9× 155 0.9× 150 1.1× 24 0.4× 32 0.6× 31 591
Wenquan Sui China 9 432 0.8× 184 1.0× 68 0.5× 79 1.2× 16 0.3× 38 560
Vincent Larrey France 10 250 0.4× 72 0.4× 85 0.6× 32 0.5× 54 1.0× 51 330
Muhammad Nawaz Sweden 17 912 1.6× 120 0.7× 43 0.3× 21 0.3× 48 0.9× 93 972
Benjamin Reig France 9 295 0.5× 187 1.0× 142 1.1× 11 0.2× 46 0.8× 31 421
B. Imbert France 10 313 0.6× 237 1.3× 39 0.3× 18 0.3× 35 0.6× 35 434
O. I. Kon’kov Russia 10 365 0.6× 126 0.7× 43 0.3× 83 1.3× 68 1.2× 82 462
S. Akiyama Japan 11 300 0.5× 189 1.1× 54 0.4× 13 0.2× 16 0.3× 26 420
S. Kadomura Japan 11 499 0.9× 34 0.2× 79 0.6× 24 0.4× 170 3.0× 43 542
Jin‐Shown Shie Taiwan 11 374 0.7× 191 1.1× 180 1.4× 8 0.1× 17 0.3× 32 457

Countries citing papers authored by Matthew Lueck

Since Specialization
Citations

This map shows the geographic impact of Matthew Lueck's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Matthew Lueck with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Matthew Lueck more than expected).

Fields of papers citing papers by Matthew Lueck

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Matthew Lueck. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Matthew Lueck. The network helps show where Matthew Lueck may publish in the future.

Co-authorship network of co-authors of Matthew Lueck

This figure shows the co-authorship network connecting the top 25 collaborators of Matthew Lueck. A scholar is included among the top collaborators of Matthew Lueck based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Matthew Lueck. Matthew Lueck is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Malta, Dean, Erik Vick, Matthew Lueck, et al.. (2016). TSV-Last, Heterogeneous 3D Integration of a SiGe BiCMOS Beamformer and Patch Antenna for a W-Band Phased array Radar. 1457–1464. 12 indexed citations
2.
Temple, D., et al.. (2015). Advances in three-dimensional integration technologies in support of infrared focal plane arrays. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9370. 93701L–93701L. 1 indexed citations
3.
Kory, Carol L., et al.. (2014). Microfabricated 94 GHz TWT. 21. 175–176. 3 indexed citations
4.
Temple, D., et al.. (2014). Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 9100. 91000L–91000L. 3 indexed citations
5.
Lueck, Matthew, Chris Gregory, Dean Malta, et al.. (2013). High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch. 1–5. 1 indexed citations
6.
Lueck, Matthew, Dean Malta, Alan Huffman, et al.. (2013). Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs. 317–322. 7 indexed citations
7.
Gregory, Christopher W., Matthew Lueck, Alan Huffman, John M. Lannon, & D. Temple. (2012). High density metal-metal interconnect bonding with pre-applied fluxing underfill. 7. 20–25. 3 indexed citations
8.
Malta, Dean, Christopher W. Gregory, Matthew Lueck, et al.. (2011). Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1815–1821. 29 indexed citations
9.
Brand, Sebastian, Matthias Petzold, Jason D. Reed, et al.. (2011). High resolution acoustical imaging of high-density-interconnects for 3D-integration. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 37–42. 3 indexed citations
10.
Lueck, Matthew, et al.. (2011). Microfabrication of diamond-based slow-wave circuits for mm-wave and THz vacuum electronic sources. Journal of Micromechanics and Microengineering. 21(6). 65022–65022. 22 indexed citations
11.
Huffman, Alan, et al.. (2010). Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1726–1742. 1 indexed citations
12.
Reed, Jason D., Matthew Lueck, Chris Gregory, et al.. (2010). Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration. IMAPSource Proceedings. 2010(1). 28–35. 7 indexed citations
13.
Huffman, Alan, John Lannon, Matthew Lueck, Christopher W. Gregory, & D. Temple. (2009). Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration. Journal of Instrumentation. 4(3). P03006–P03006. 36 indexed citations
14.
Dayton, J. A., et al.. (2009). Applying microfabrication to helical vacuum electron devices for THz applications. 16 indexed citations
15.
Smith, P. E., Matthew Lueck, Steven A. Ringel, & L. J. Brillson. (2008). Atomic diffusion and interface electronic structure at In0.49Ga0.51P∕GaAs heterojunctions. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 26(1). 89–95. 5 indexed citations
16.
Smith, P. E., Matthew Lueck, Steven A. Ringel, & L. J. Brillson. (2007). Atomic diffusion and electronic structure in Al0.52In0.48P∕GaAs heterostructures. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 25(6). 1916–1921. 1 indexed citations
17.
Huffman, Alan, Matthew Lueck, Christopher A. Bower, & D. Temple. (2007). Effects of Assembly Process Parameters on the Structure and Thermal Stability of Sn-Capped Cu Bump Bonds. 1589–1596. 21 indexed citations
18.
Lueck, Matthew, C. Andre, Arthur J. Pitera, et al.. (2006). Dual junction GaInP/GaAs solar cells grown on metamorphic SiGe/Si substrates with high open circuit voltage. IEEE Electron Device Letters. 27(3). 142–144. 107 indexed citations
19.
20.
Ringel, Steven A., C. Andre, Matthew Lueck, et al.. (2004). III-V Multi-Junction Materials and Solar Cells on Engineered SiGe/Si Substrates. MRS Proceedings. 836. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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