Jason D. Reed

671 total citations
29 papers, 524 citations indexed

About

Jason D. Reed is a scholar working on Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics and Automotive Engineering. According to data from OpenAlex, Jason D. Reed has authored 29 papers receiving a total of 524 indexed citations (citations by other indexed papers that have themselves been cited), including 25 papers in Electrical and Electronic Engineering, 9 papers in Atomic and Molecular Physics, and Optics and 5 papers in Automotive Engineering. Recurrent topics in Jason D. Reed's work include 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor Quantum Structures and Devices (7 papers). Jason D. Reed is often cited by papers focused on 3D IC and TSV technologies (13 papers), Electronic Packaging and Soldering Technologies (9 papers) and Semiconductor Quantum Structures and Devices (7 papers). Jason D. Reed collaborates with scholars based in United States, Germany and Ukraine. Jason D. Reed's co-authors include John C. Elfar, Spencer J. Stanbury, D. Temple, Graham Dunn, Paddy Power, Nikola Rahaman, Philippa Garety, Tom Craig, Susannah Colbert and Miriam Fornells‐Ambrojo and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and The British Journal of Psychiatry.

In The Last Decade

Jason D. Reed

26 papers receiving 497 citations

Peers

Jason D. Reed
Hitoshi Ishikawa Japan
Xiaoyan Wu United States
Sejin Choi South Korea
Ming Qiu China
Young-Jun Ko South Korea
Fiona Barry United Kingdom
Xinli Zhu China
Joshua Blair United States
Woojae Han United States
S. Bull United Kingdom
Hitoshi Ishikawa Japan
Jason D. Reed
Citations per year, relative to Jason D. Reed Jason D. Reed (= 1×) peers Hitoshi Ishikawa

Countries citing papers authored by Jason D. Reed

Since Specialization
Citations

This map shows the geographic impact of Jason D. Reed's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jason D. Reed with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jason D. Reed more than expected).

Fields of papers citing papers by Jason D. Reed

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jason D. Reed. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jason D. Reed. The network helps show where Jason D. Reed may publish in the future.

Co-authorship network of co-authors of Jason D. Reed

This figure shows the co-authorship network connecting the top 25 collaborators of Jason D. Reed. A scholar is included among the top collaborators of Jason D. Reed based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jason D. Reed. Jason D. Reed is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lueck, Matthew, Jason D. Reed, Christopher W. Gregory, et al.. (2012). High-Density Large-Area-Array Interconnects Formed by Low-Temperature Cu/Sn–Cu Bonding for Three-Dimensional Integrated Circuits. IEEE Transactions on Electron Devices. 59(7). 1941–1947. 28 indexed citations
2.
Brand, Sebastian, Matthias Petzold, Jason D. Reed, et al.. (2011). High resolution acoustical imaging of high-density-interconnects for 3D-integration. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 37–42. 3 indexed citations
3.
Brand, Sebastian, et al.. (2011). Extending acoustic microscopy for comprehensive failure analysis applications. Journal of Materials Science Materials in Electronics. 22(10). 1580–1593. 25 indexed citations
4.
Brand, Sebastian, Matthias Petzold, Jason D. Reed, et al.. (2011). Acoustic inspection of high-density-interconnects for 3D-integration. Fraunhofer-Publica (Fraunhofer-Gesellschaft). 1076–1079. 4 indexed citations
5.
Huffman, Alan, et al.. (2010). Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive. Additional Conferences (Device Packaging HiTEC HiTEN & CICMT). 2010(DPC). 1726–1742. 1 indexed citations
6.
7.
Reed, Jason D., Matthew Lueck, Chris Gregory, et al.. (2010). Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration. IMAPSource Proceedings. 2010(1). 28–35. 7 indexed citations
8.
9.
Costa, Júlio, et al.. (2008). INTEGRATED MEMS SWITCH TECHNOLOGY ON SOI-CMOS. 18–21. 20 indexed citations
10.
Costa, Júlio, et al.. (2008). Silicon RFCMOS SOI technology with above-IC MEMS integration for front end wireless applications. 204–207. 12 indexed citations
11.
Sun, L., Adam Bartnik, Byung‐Ryool Hyun, et al.. (2008). PbS quantum dot photoluminescence quenching induced by an applied bias. 15. 1–2. 2 indexed citations
12.
Garety, Philippa, Tom Craig, Graham Dunn, et al.. (2005). Specialised care for early psychosis: Symptoms, social functioning and patient satisfaction. The British Journal of Psychiatry. 188(1). 37–45. 160 indexed citations
13.
14.
Reed, Jason D., et al.. (2002). Analysis of parameter sensitivity in a ray-tracing propagation environment. 2. 805–809. 5 indexed citations
15.
Reed, Jason D., et al.. (2002). Flexible manufacturing of multichip modules for flip chip ICs. 1. 130–132. 1 indexed citations
16.
Reed, Jason D., et al.. (1997). <title>Rapid laser prototyping of multichip modules</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 2993. 76–81. 3 indexed citations
17.
Reed, Jason D., et al.. (1995). Size-dependent photoluminescence energy and intensity of selective electron cyclotron resonance-etched strained InGaAs/GaAs quantum boxes. Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena. 13(3). 995–999. 7 indexed citations
18.
Reed, Jason D., et al.. (1993). Sample preparation technique for cross‐sectional transmission electron microscopy of quantum wire structures. Microscopy Research and Technique. 26(2). 157–161. 1 indexed citations
19.
Kukhtarev, N. V., et al.. (1990). Orientational dependence of photorefractive two-beam coupling in InP:Fe. Optics Letters. 15(4). 209–209. 21 indexed citations
20.
Reed, Jason D., et al.. (1990). Net gain in photorefractive InP:Fe at λ=1.32 μm without an applied field. Applied Physics Letters. 57(10). 951–953. 4 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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