Mario Meissl
- Biomedical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Atomic and Molecular Physics, and Optics
- Surfaces, Coatings and Films top 10%
- Mechanics of Materials
- Co-authors
- Byung Jin ChoiC. Grant WillsonMatthew ColburnS. V. SreenivasanJohn G. EkerdtT. C. BaileyTodd BaileySteve Johnson
- Topics
- Nanofabrication and Lithography Techniques (12 papers)Advancements in Photolithography Techniques (11 papers)Force Microscopy Techniques and Applications (7 papers)
- Partner nations
- United StatesJapan
In The Last Decade
Mario Meissl
9 papers receiving 476 citations
Peers
Comparison fields: 5 of 35
- Biomedical Engineering 487
- Electrical and Electronic Engineering 389
- Atomic and Molecular Physics, and Optics 165
- Surfaces, Coatings and Films 42
- Mechanics of Materials 34
Countries citing papers authored by Mario Meissl
This map shows the geographic impact of Mario Meissl's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mario Meissl with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mario Meissl more than expected).
Fields of papers citing papers by Mario Meissl
This network shows the impact of papers produced by Mario Meissl. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mario Meissl. The network helps show where Mario Meissl may publish in the future.
Co-authorship network of co-authors of Mario Meissl
This figure shows the co-authorship network connecting the top 25 collaborators of Mario Meissl. A scholar is included among the top collaborators of Mario Meissl based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Mario Meissl. Mario Meissl is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 2 | |
| 3 | 1 | |
| 4 | 1 | |
| 5 | 10 | |
| 6 | 7 | |
| 7 | 88 | |
| 8 | 1 | |
| 9 | 55 | |
| 10 | 11 | |
| 11 | 46 | |
| 12 | Step and Flash Imprint Lithography: A Technology Review | 1 |
| 13 | 295 |
About Mario Meissl
Mario Meissl is a scholar working on Biomedical Engineering, Atomic and Molecular Physics, and Optics and Electrical and Electronic Engineering, having authored 13 papers that have together received 518 indexed citations. Recurring topics across this work include Nanofabrication and Lithography Techniques (12 papers), Advancements in Photolithography Techniques (11 papers) and Force Microscopy Techniques and Applications (7 papers). The work is most often cited by research in Biomedical Engineering (487 citations), Electrical and Electronic Engineering (389 citations) and Surfaces, Coatings and Films (42 citations). Mario Meissl has collaborated with scholars based in United States and Japan. Frequent co-authors include Byung Jin Choi, C. Grant Willson, Matthew Colburn, S. V. Sreenivasan, John G. Ekerdt, T. C. Bailey, Todd Bailey, S. V. Sreenivasan, Steve Johnson and Kevin J. Nordquist. Their work appears in journals such as Physics of Fluids, IEEE/ASME Transactions on Mechatronics and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.