Laura Mirkarimi

1.3k total citations
37 papers, 1.0k citations indexed

About

Laura Mirkarimi is a scholar working on Electrical and Electronic Engineering, Automotive Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, Laura Mirkarimi has authored 37 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 36 papers in Electrical and Electronic Engineering, 7 papers in Automotive Engineering and 7 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in Laura Mirkarimi's work include 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (19 papers) and Photonic and Optical Devices (8 papers). Laura Mirkarimi is often cited by papers focused on 3D IC and TSV technologies (22 papers), Electronic Packaging and Soldering Technologies (19 papers) and Photonic and Optical Devices (8 papers). Laura Mirkarimi collaborates with scholars based in United States and Germany. Laura Mirkarimi's co-authors include Annette Grot, Edmond Chow, M. M. Sigalas, G. Girolami, Guilian Gao, G. G. Fountain, Jeremy Theil, Bongsub Lee, Cyprian Uzoh and P. Mrozek and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Optics Letters.

In The Last Decade

Laura Mirkarimi

35 papers receiving 937 citations

Peers

Countries citing papers authored by Laura Mirkarimi

Since Specialization

Citations

This map shows the geographic impact of Laura Mirkarimi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Laura Mirkarimi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Laura Mirkarimi more than expected).

Fields of papers citing papers by Laura Mirkarimi

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Laura Mirkarimi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Laura Mirkarimi. The network helps show where Laura Mirkarimi may publish in the future.

Co-authorship network of co-authors of Laura Mirkarimi

This figure shows the co-authorship network connecting the top 25 collaborators of Laura Mirkarimi. A scholar is included among the top collaborators of Laura Mirkarimi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Laura Mirkarimi. Laura Mirkarimi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	The Influence of Cu Microstructure on Thermal Budget in Hybrid Bonding 2022 ·2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ·Laura Mirkarimi, Cyprian Uzoh, Dominik Suwito, Bongsub Lee, G. G. Fountain, (unknown), Jeremy Theil, Guilian Gao, (unknown), (unknown), (unknown)	27
2	Low Temperature Hybrid Bonding for Die to Wafer Stacking Applications 2021 ·Guilian Gao, Laura Mirkarimi, G. G. Fountain, Dominik Suwito, Jeremy Theil, (unknown), Cyprian Uzoh, (unknown), Bongsub Lee, (unknown), P. Mrozek	13
3	Die to Wafer Stacking with Low Temperature Hybrid Bonding 2020 ·Guilian Gao, (unknown), Cyprian Uzoh, (unknown), Laura Mirkarimi, Jeremy Theil, Dominik Suwito, (unknown), G. G. Fountain, (unknown), Bongsub Lee	33
4	Die to Wafer Hybrid Bonding: Multi-Die Stacking with Tsv Integration 2020 ·Guilian Gao, Jeremy Theil, G. G. Fountain, (unknown), (unknown), Cyprian Uzoh, Dominik Suwito, Bongsub Lee, (unknown), (unknown), Laura Mirkarimi	13
5	Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study 2019 ·Guilian Gao, P. Mrozek, (unknown), Laura Mirkarimi, G. G. Fountain, Jeremy Theil, (unknown), Cyprian Uzoh, Bongsub Lee, Ping Liu	23
6	Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect 2019 ·Jeremy Theil, Laura Mirkarimi, G. G. Fountain, Guilian Gao, (unknown)	30
7	Scaling Package Interconnects Below 20µm Pitch with Hybrid Bonding 2018 ·Guilian Gao, Laura Mirkarimi, G. G. Fountain, Liang Wang, Cyprian Uzoh, (unknown), (unknown), (unknown), Bongsub Lee, (unknown)	30
8	Mechanical Strength Characterization of Direct Bond Interfaces for 3D-IC and MEMS Applications 2018 ·Bongsub Lee, (unknown), Guilian Gao, G. G. Fountain, Sangil Lee, Liang Wang, (unknown), Cyprian Uzoh, Laura Mirkarimi, (unknown), (unknown), Yuling Niu, Shuai Shao, Jing Wang, Seungbae Park	2
9	Development of Low Temperature Direct Bond Interconnect Technology for Die-To-Wafer and Die-To-Die Applications-Stacking, Yield Improvement, Reliability Assessment 2018 ·Guilian Gao, Laura Mirkarimi, (unknown), (unknown), Jeremy Theil, Cyprian Uzoh, G. G. Fountain, Bongsub Lee, P. Mrozek, Michael Huynh, (unknown)	27
10	Direct Bond Interconnect (DBI®) for Fine-Pitch Bonding in 3D and 2.5D Integrated Circuits 2017 ·Liang Wang, G. G. Fountain, Bongsub Lee, Guilian Gao, Cyprian Uzoh, (unknown), P.M. Enquist, (unknown), Laura Mirkarimi	9
11	Development of Hybrid Bond Interconnect Technology for Die-to-Wafer and Die-to-Die Applications 2017 ·Guilian Gao, G. G. Fountain, Cyprian Uzoh, Bongsub Lee, Laura Mirkarimi, Liang Wang	0
12	Applications of 3D X-Ray Microscopy for Advanced Package Development 2011 ·IMAPSource Proceedings ·(unknown), (unknown), Laura Mirkarimi, (unknown), (unknown), Michael Huynh	9
13	Photonic crystal microcavity sensor for ultracompact monitoring of reaction kinetics and protein concentration 2009 ·Sensors and Actuators B Chemical ·Sanja Zlatanovic, Laura Mirkarimi, M. M. Sigalas, Maggie A. Bynum, Edmond Chow, (unknown), Geoffrey W. Burr, Sadik C. Esener, Annette Grot	86
14	3D interconnects for dense die stack packages 2009 ·Laura Mirkarimi, Michael Huynh, (unknown), (unknown)	2
15	Toward Single Molecule Detection with Photonic Crystal Microcavity Biosensors 2006 ·Laura Mirkarimi, Sanja Zlatanovic, (unknown), Maggie A. Bynum, (unknown), Edmond Chow, Annette Grot	6
16	Ultracompact biochemical sensor built with two-dimensional photonic crystal microcavity 2004 ·Optics Letters ·Edmond Chow, Annette Grot, Laura Mirkarimi, M. M. Sigalas, G. Girolami	364
17	Large-bandwidth ultra-low-loss guiding in bi-periodic photonic crystal waveguides 2004 ·Applied Physics B ·Aliakbar Jafarpour, Edmond Chow, Charles M. Reinke, Jiandong Huang, Ali Adibi, Annette Grot, Laura Mirkarimi, G. Girolami, (unknown), Yong Xu	13
18	Parallel optical interconnect at 10 Gb/s per channel 2004 ·J. Simon, (unknown), (unknown), K. Giboney, (unknown), (unknown), Laura Mirkarimi, Annette Grot, (unknown), A. Tandon, (unknown), (unknown), David W. Dolfi	11
19	Next-generation parallel-optical data links 2002 ·K. Giboney, J. Simon, Laura Mirkarimi, (unknown), (unknown), S. Corzine, (unknown), A. Tandon, Chris Kocot, (unknown), Annette Grot, (unknown), (unknown), David W. Dolfi	8
20	Deuterium in (Ba,Sr)TiO3 thin films: Kinetics and mechanisms of incorporation and removal during annealing 2001 ·Journal of Applied Physics ·Paul C. McIntyre, (unknown), (unknown), (unknown), Stephen R. Gilbert, Laura Mirkarimi, Michelle T. Schulberg	20

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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