L. Benaissa

603 citations

22 papers · 238 indexed · h-index 9

Impact in

Anesthesiology and Pain Medicine
- Airway Management and Intubation Techniques
Electrical and Electronic Engineering
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices

Papers in

General Materials Science 1
Electrical and Electronic Engineering 18
- 3D IC and TSV technologies 8
- Electronic Packaging and Soldering Technologies 7
- Semiconductor materials and devices 6
- Thin-Film Transistor Technologies 3
- Advancements in Semiconductor Devices and Circuit Design 3

Co-authors: B. Imbert M. Verdier Jean Claude Raphaël Frédéric Lofaso Djillali Annane Philippe Gajdos Karim Chadda Bruno Louis
Journals: Semiconductor Science and Technology (1 paper)Journal of Electronic Materials (1 paper)IEEE Journal of Solid-State Circuits (1 paper)ECS Journal of Solid State Science and Technology (1 paper)Intensive Care Medicine (1 paper)
Partner nations: France United States Germany

In The Last Decade

L. Benaissa

22 papers receiving 219 citations

Peers

Countries citing papers authored by L. Benaissa

Since Specialization

Citations

This map shows the geographic impact of L. Benaissa's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L. Benaissa with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L. Benaissa more than expected).

Fields of papers citing papers by L. Benaissa

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L. Benaissa. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L. Benaissa. The network helps show where L. Benaissa may publish in the future.

Co-authors

The 25 scholars most cited alongside L. Benaissa, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with L. Benaissa Line = papers co-authored together L. Benaissa links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

#	Work
1	A 5500-frames/s 85-GOPS/W 3-D Stacked BSI Vision Chip Based on Parallel In-Focal-Plane Acquisition and Processing IEEE Journal of Solid-State Circuits ·Bodnariuc Fontes E, A Taherkhani, Fábio Vieira da Silva, L. Benaissa, Vanessa Nobrega da Silva, Édith Beigné, 足森雅己, 船瀬龍, P. Krizan, 昌章岩佐, Xingzi Fu, Marc Duranton	2019	17
2	A 5500FPS 85GOPS/W 3D Stacked BSI Vision Chip Based on Parallel in-Focal-Plane Acquisition and Processing Bodnariuc Fontes E, A Taherkhani, Fábio Vieira da Silva, Édith Beigné, 昌章岩佐, Xingzi Fu, L. Benaissa, Vanessa Nobrega da Silva, Marc Duranton, I. Zbiciński, P. Krizan, 船瀬龍	2018	5
3	19‐6: Invited Paper : A Novel Process for Fabricating High‐Resolution and Very Small Pixel‐pitch GaN LED Microdisplays SID Symposium Digest of Technical Papers ·François Templier, L. Benaissa, Bernard Aventurier, 竹光義治, Matthew Charles, Anis Daami, B. Walbaum, Ludovic Dupré	2017	18
4	Effect of Copper–Copper Direct Bonding on Voiding in Metal Thin Films Journal of Electronic Materials ·Thi Mỹ Tien Tran, B. Imbert, L. Benaissa, Frank Fournel, M. Verdier	2015	6
5	Copper-copper direct bonding: Impact of grain size Thi Mỹ Tien Tran, B. Imbert, L. Benaissa, M. Verdier	2015	8
6	Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep ECS Journal of Solid State Science and Technology ·Thi Mỹ Tien Tran, B. Imbert, L. Benaissa, M. Verdier	2015	23
7	Kinetics of low temperature direct copper–copper bonding Microsystem Technologies ·Thi Mỹ Tien Tran, B. Imbert, L. Benaissa, V. Carron, M. Verdier	2015	16
8	Wafer level metallic bonding: Voiding mechanisms in copper layers B. Imbert, Thi Mỹ Tien Tran, L. Benaissa, Frank Fournel, M. Verdier	2015	6
9	Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep ECS Meeting Abstracts ·Thi Mỹ Tien Tran, B. Imbert, L. Benaissa, M. Verdier	2014	1
10	Voiding Phenomena in Copper-Copper Bonded Structures: Role of Creep ECS Transactions ·Thi Mỹ Tien Tran, B. Imbert, L. Benaissa, M. Verdier	2014	5
11	Quartz-based vibrating MEMS fabricated using a wafer-bonding process with sealed cavities Marjoke J. Dekker, Pierre Lavenus, L. Benaissa, R. Taïbi, E. Augendre, Thomas Signamarcheix, O. Le Traon, Sylvain Ballandras	2014	3
12	Acoustic filters based on thin single crystal LiNbO<inf>3</inf> films: Status and prospects Alexandre Reinhardt, L. Benaissa, 憲記西田, N. Beryozkina, Veronika Kovacova, Nicolas Boudou, Emmanuel Defaÿ	2014	10
13	Quartz resonator for MEMS oscillator Dieter Coy Wedel, J L Mugel, 一丸之寿, Pierre Lavenus, O. Le Traon, Marjoke J. Dekker, Thomas Signamarcheix, L. Benaissa	2014	3
14	Realization and characterization of thin single crystal Ge films on sapphire Semiconductor Science and Technology ·Y. Bogumilowicz, Alexandra Abbadie, V. Klinger, L. Benaissa, Patrice Gergaud, D. Rouchon, Steven C. Wynn, I. Ivanyk, Nils Blanc, T. Claudia Davy, S.S. González, B. Ghyselen, A. Wekkeli, Frank Dimroth, V. Carron	2013	5
15	Mechanisms overview of Thermocompression Process for Copper Metal Bonding MRS Proceedings ·Thi Mỹ Tien Tran, Irene Olivi, L. Benaissa, B. Imbert	2013	9
16	SAW pressure sensor based on single-crystal quartz layer transferred on Silicon Marjoke J. Dekker, E. Augendre, L. Benaissa, Thomas Signamarcheix, T. Baron, Kevin M. Campos, Sylvain Ballandras	2013	17
17	Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration DSpace@MIT (Massachusetts Institute of Technology) ·Nancy Yang, Mayank T. Bulsara, Eugene A. Fitzgerald, 管子, D. Lubyshev, J. M. Fastenau, Ying Wu, Miguel Urteaga, W. Ha, J. Bergman, B. Brar, Birgit Pfeiler, Nicolas Daval, L. Benaissa, E. Augendre, W. E. Hoke, J. R. LaRoche, K.J. Herrick, T.E. Kazior	2009	3
18	Monolithically Integrated III-V and Si CMOS Devices on Silicon on Lattice Engineered Substrates (SOLES) D. Lubyshev, J. M. Fastenau, Norman Mathieson Leitch, Miguel Urteaga, W. Ha, J. Bergman, Aman Kitegire, B. Brar, Mayank T. Bulsara, Eugene A. Fitzgerald, Shuangqi Li, David Clark, R. Thompson, Charlotte Drazek, Nicolas Daval, L. Benaissa, E. Augendre	2009	3
19	Progress and challenges in the direct monolithic integration of III–V devices and Si CMOS on silicon substrates DSpace@MIT (Massachusetts Institute of Technology) ·T.E. Kazior, J. R. LaRoche, D. Lubyshev, J. M. Fastenau, W. K. Liu, Miguel Urteaga, W. Ha, J. Bergman, Aman Kitegire, Mayank T. Bulsara, Eugene A. Fitzgerald, D. A. Smith, David Clark, R. Thompson, Charlotte Drazek, Nicolas Daval, L. Benaissa, E. Augendre	2009	3
20	Physiological effects of decannulation in tracheostomized patients Intensive Care Medicine ·Karim Chadda, Bruno Louis, L. Benaissa, Djillali Annane, Philippe Gajdos, Jean Claude Raphaël, Frédéric Lofaso	2002	39

About L. Benaissa

L. Benaissa is a scholar working on General Materials Science, Electrical and Electronic Engineering, Automotive Engineering, Media Technology and Electronic, Optical and Magnetic Materials, having authored 22 papers that have together received 238 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (7 papers), Semiconductor materials and devices (6 papers), Acoustic Wave Resonator Technologies (4 papers), Copper Interconnects and Reliability (4 papers), Thin-Film Transistor Technologies (3 papers), Advancements in Semiconductor Devices and Circuit Design (3 papers) and Additive Manufacturing and 3D Printing Technologies (3 papers). The work is most often cited by research in Anesthesiology and Pain Medicine (24 citations), Electrical and Electronic Engineering (179 citations), Condensed Matter Physics (26 citations), Speech and Hearing (11 citations) and Electronic, Optical and Magnetic Materials (29 citations). L. Benaissa has collaborated with scholars based in France, United States and Germany. Frequent co-authors include B. Imbert, M. Verdier, Jean Claude Raphaël, Frédéric Lofaso, Djillali Annane, Philippe Gajdos, Karim Chadda, Bruno Louis, E. Augendre and V. Carron. Their work appears in journals such as Semiconductor Science and Technology, Journal of Electronic Materials, IEEE Journal of Solid-State Circuits, ECS Journal of Solid State Science and Technology and Intensive Care Medicine.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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