L.L. Wai

760 total citations
22 papers, 605 citations indexed

About

L.L. Wai is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, L.L. Wai has authored 22 papers receiving a total of 605 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Electrical and Electronic Engineering, 11 papers in Aerospace Engineering and 2 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in L.L. Wai's work include Microwave Engineering and Waveguides (11 papers), Electromagnetic Compatibility and Noise Suppression (11 papers) and 3D IC and TSV technologies (7 papers). L.L. Wai is often cited by papers focused on Microwave Engineering and Waveguides (11 papers), Electromagnetic Compatibility and Noise Suppression (11 papers) and 3D IC and TSV technologies (7 papers). L.L. Wai collaborates with scholars based in Singapore, South Korea and United States. L.L. Wai's co-authors include K.M. Chua, Y.P. Zhang, A.C.W. Lu, M. Sun, B. K. Lok, Duixian Liu, Wenhui Fan, B. Gaucher, D. Liu and Mengtao Sun and has published in prestigious journals such as IEEE Transactions on Antennas and Propagation, Electronics Letters and IEEE Antennas and Wireless Propagation Letters.

In The Last Decade

L.L. Wai

22 papers receiving 584 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
L.L. Wai Singapore 8 580 405 31 23 23 22 605
Javad Soleiman Meiguni United States 11 279 0.5× 204 0.5× 29 0.9× 10 0.4× 16 0.7× 37 326
Kai Xu Wang China 11 605 1.0× 626 1.5× 47 1.5× 10 0.4× 25 1.1× 38 675
M. Goldfarb United States 10 435 0.8× 151 0.4× 32 1.0× 12 0.5× 40 1.7× 21 455
Yingsong Zhang China 10 451 0.8× 471 1.2× 16 0.5× 10 0.4× 13 0.6× 23 514
Kai Fong Lee United States 9 397 0.7× 439 1.1× 13 0.4× 15 0.7× 27 1.2× 16 472
J.A. Navarro United States 11 384 0.7× 342 0.8× 13 0.4× 12 0.5× 28 1.2× 27 423
Julius A. Kaiser United States 4 253 0.4× 294 0.7× 22 0.7× 19 0.8× 20 0.9× 15 345
S. Holzwarth Germany 11 237 0.4× 305 0.8× 18 0.6× 15 0.7× 9 0.4× 43 367
Bee-Yen Toh United Kingdom 5 406 0.7× 463 1.1× 39 1.3× 11 0.5× 29 1.3× 10 504
Jung‐Woo Baik South Korea 10 460 0.8× 468 1.2× 23 0.7× 4 0.2× 19 0.8× 25 501

Countries citing papers authored by L.L. Wai

Since Specialization
Citations

This map shows the geographic impact of L.L. Wai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.L. Wai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.L. Wai more than expected).

Fields of papers citing papers by L.L. Wai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by L.L. Wai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.L. Wai. The network helps show where L.L. Wai may publish in the future.

Co-authorship network of co-authors of L.L. Wai

This figure shows the co-authorship network connecting the top 25 collaborators of L.L. Wai. A scholar is included among the top collaborators of L.L. Wai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with L.L. Wai. L.L. Wai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Y.P., M. Sun, K.M. Chua, L.L. Wai, & Duixian Liu. (2009). Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios. IEEE Transactions on Antennas and Propagation. 57(10). 2842–2852. 149 indexed citations
2.
Wai, L.L., et al.. (2008). Parametric Analysis of Embedded EBG Structures for Noise Suppression Applications. 265–270. 1 indexed citations
3.
Sun, M., Y.P. Zhang, K.M. Chua, et al.. (2008). Integration of Yagi Antenna in LTCC Package for Differential 60-GHz Radio. IEEE Transactions on Antennas and Propagation. 56(8). 2780–2783. 70 indexed citations
4.
Lu, A.C.W., L.L. Wai, J. Park, et al.. (2008). Miniaturization of electromagnetic bandgap structures for noise suppression. 570–573. 1 indexed citations
5.
Zhang, Y.P., et al.. (2008). Integration of slot antenna in LTCC package for 60 GHz radios. Electronics Letters. 44(5). 330–331. 54 indexed citations
6.
Fan, Wenhui, et al.. (2007). Evaluation of Printed Heating Element for Micro-System Applications. 518–521. 1 indexed citations
7.
Sun, M., et al.. (2007). Antenna-in-Package in LTCC for 60-GHz Radio. 279–282. 39 indexed citations
8.
Park, Jong‐Bae, A.C.W. Lu, L.L. Wai, et al.. (2006). The scalable modeling of multi-layer embedded capacitor based on LTCC substrate. 4 pp.–4 pp.. 2 indexed citations
9.
Wai, L.L., et al.. (2006). Processing and electrical characterization of co-sintered composite glass ceramics. 655–658. 2 indexed citations
10.
Lu, A.C.W., et al.. (2006). Hybrid analytical modeling method for split power bus in multilayered package. IEEE Transactions on Electromagnetic Compatibility. 48(1). 82–94. 31 indexed citations
11.
Park, Junyong, A.C.W. Lu, K.M. Chua, et al.. (2006). Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications. IEEE Microwave and Wireless Components Letters. 16(9). 481–483. 50 indexed citations
12.
13.
Lu, A.C.W., et al.. (2005). Integrated antenna module for broadband wireless applications. 3. 240–243. 5 indexed citations
14.
Fan, Wenhui, A.C.W. Lu, L.L. Wai, & B. K. Lok. (2004). Mixed-mode S-parameter characterization of differential structures. 533–537. 118 indexed citations
15.
16.
17.
Kim, Joungho, A.C.W. Lu, L.L. Wai, et al.. (2004). Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package. 25. 215–220 vol.1. 4 indexed citations
18.
Lu, A.C.W., et al.. (2003). Modeling and characterization of wire bonding for RF applications. 905–909. 7 indexed citations
19.
Lu, A.C.W., et al.. (2003). Design optimization of wire bonding for high frequency applications. 18. 422–427. 2 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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