Seongguk Kim
- Hardware and Architecture top 10%
- VLSI and Analog Circuit Testing 8
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- 3D IC and TSV technologies 36
- Electromagnetic Compatibility and Noise Suppression 16
- VLSI and FPGA Design Techniques 10
- Advanced Memory and Neural Computing 7
- Electronic Packaging and Soldering Technologies 6
- Low-power high-performance VLSI design 5
- Semiconductor materials and devices 5
- Co-authors
- Joungho KimHyunwook ParkSubin KimDaehwan LhoBoogyo SimGapyeol ParkShinyoung ParkKyungjun Cho
- Cited by
- Hardware and ArchitectureElectrical and Electronic EngineeringIndustrial and Manufacturing Engineering
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (8 papers)IEEE Transactions on Electromagnetic Compatibility (4 papers)IEEE Transactions on Microwave Theory and Techniques (1 paper)
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Seongguk Kim
51 papers receiving 369 citations
Peers
Comparison fields: 5 of 39
- Hardware and Architecture 41
- Electrical and Electronic Engineering 315
- Industrial and Manufacturing Engineering 25
- Computer Networks and Communications 29
- Automotive Engineering 14
Countries citing papers authored by Seongguk Kim
This map shows the geographic impact of Seongguk Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seongguk Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seongguk Kim more than expected).
Fields of papers citing papers by Seongguk Kim
This network shows the impact of papers produced by Seongguk Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seongguk Kim. The network helps show where Seongguk Kim may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Seongguk Kim, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 1 | |
| 2 | 2023 | 1 | |
| 3 | 2023 | 5 | |
| 4 | 2023 | 1 | |
| 5 | 2023 | 2 | |
| 6 | 2023 | 9 | |
| 7 | 2023 | 3 | |
| 8 | 2022 | 9 | |
| 9 | 2022 | 0 | |
| 10 | 2022 | 4 | |
| 11 | 2021 | 5 | |
| 12 | 2021 | 5 | |
| 13 | 2021 | 1 | |
| 14 | 2021 | 1 | |
| 15 | 2020 | 7 | |
| 16 | 2020 | 6 | |
| 17 | 2019 | 16 | |
| 18 | 2019 | 8 | |
| 19 | 2019 | 2 | |
| 20 | 2018 | 1 |
About Seongguk Kim
Seongguk Kim is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Physiology, having authored 57 papers that have together received 375 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (36 papers), Electromagnetic Compatibility and Noise Suppression (16 papers), VLSI and FPGA Design Techniques (10 papers), VLSI and Analog Circuit Testing (8 papers), Advanced Memory and Neural Computing (7 papers), Electronic Packaging and Soldering Technologies (6 papers), Low-power high-performance VLSI design (5 papers) and Semiconductor materials and devices (5 papers). The work is most often cited by research in Hardware and Architecture (41 citations), Electrical and Electronic Engineering (315 citations) and Industrial and Manufacturing Engineering (25 citations). Seongguk Kim has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Joungho Kim, Hyunwook Park, Subin Kim, Daehwan Lho, Boogyo Sim, Gapyeol Park, Shinyoung Park, Kyungjun Cho, Youngwoo Kim and Keunwoo Kim. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Microwave Theory and Techniques and Journal of Biomedical Engineering Research.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.