Seongguk Kim

569 total citations
57 papers, 375 citations indexed

About

Seongguk Kim is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture and Computer Networks and Communications. According to data from OpenAlex, Seongguk Kim has authored 57 papers receiving a total of 375 indexed citations (citations by other indexed papers that have themselves been cited), including 50 papers in Electrical and Electronic Engineering, 12 papers in Hardware and Architecture and 4 papers in Computer Networks and Communications. Recurrent topics in Seongguk Kim's work include 3D IC and TSV technologies (36 papers), Electromagnetic Compatibility and Noise Suppression (16 papers) and VLSI and FPGA Design Techniques (10 papers). Seongguk Kim is often cited by papers focused on 3D IC and TSV technologies (36 papers), Electromagnetic Compatibility and Noise Suppression (16 papers) and VLSI and FPGA Design Techniques (10 papers). Seongguk Kim collaborates with scholars based in South Korea, United States and Japan. Seongguk Kim's co-authors include Joungho Kim, Hyunwook Park, Subin Kim, Daehwan Lho, Gapyeol Park, Boogyo Sim, Shinyoung Park, Kyungjun Cho, Keunwoo Kim and Youngwoo Kim and has published in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques, IEEE Transactions on Electromagnetic Compatibility and IEEE Transactions on Components Packaging and Manufacturing Technology.

In The Last Decade

Seongguk Kim

51 papers receiving 369 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Seongguk Kim South Korea 10 315 41 33 30 29 57 375
Gapyeol Park South Korea 13 336 1.1× 40 1.0× 29 0.9× 25 0.8× 20 0.7× 41 389
Daehwan Lho South Korea 11 282 0.9× 32 0.8× 31 0.9× 26 0.9× 18 0.6× 42 337
Yitao Ma Japan 11 248 0.8× 37 0.9× 21 0.6× 52 1.7× 20 0.7× 36 396
Kyungjun Cho South Korea 16 531 1.7× 76 1.9× 22 0.7× 25 0.8× 31 1.1× 50 586
Boogyo Sim South Korea 10 306 1.0× 23 0.6× 51 1.5× 14 0.5× 11 0.4× 53 352
Taiki Kimura Japan 9 197 0.6× 19 0.5× 14 0.4× 58 1.9× 15 0.5× 32 276
Jun Peng China 20 934 3.0× 14 0.3× 44 1.3× 45 1.5× 27 0.9× 62 1.1k
Liang Deng China 11 216 0.7× 53 1.3× 28 0.8× 13 0.4× 27 0.9× 43 376
Jinwoo Kim United States 12 443 1.4× 121 3.0× 19 0.6× 23 0.8× 99 3.4× 63 530
Martin Lefebvre Belgium 9 196 0.6× 45 1.1× 23 0.7× 45 1.5× 19 0.7× 26 248

Countries citing papers authored by Seongguk Kim

Since Specialization
Citations

This map shows the geographic impact of Seongguk Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Seongguk Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Seongguk Kim more than expected).

Fields of papers citing papers by Seongguk Kim

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Seongguk Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Seongguk Kim. The network helps show where Seongguk Kim may publish in the future.

Co-authorship network of co-authors of Seongguk Kim

This figure shows the co-authorship network connecting the top 25 collaborators of Seongguk Kim. A scholar is included among the top collaborators of Seongguk Kim based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Seongguk Kim. Seongguk Kim is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Kim, Seongguk, Jiwon Yoon, Keunwoo Kim, et al.. (2023). Signal Integrity Analysis of High-speed PCIe Channel with Board-to-Board Interconnect for High-Performance Server. 1–3. 1 indexed citations
2.
Park, Joonsang, et al.. (2023). Thermal Analysis of High Bandwidth Memory (HBM)-GPU Module considering Power Consumption. 1–3. 5 indexed citations
3.
Yoon, Jiwon, Hyunwook Park, Hyunwoo Kim, et al.. (2023). Design and Analysis of Redistribution Layer Interposer Channel Considering Signal Integrity for High Bandwidth Memory Module. 1–3. 2 indexed citations
4.
Park, Joonsang, Seongguk Kim, Haeyeon Kim, et al.. (2023). Design and Analysis of an Irregular-Shaped Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer. 1–3. 1 indexed citations
5.
6.
Park, Hyunwook, Seongguk Kim, Boogyo Sim, et al.. (2023). Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module. IEEE Transactions on Components Packaging and Manufacturing Technology. 13(11). 1804–1816. 9 indexed citations
7.
Park, Hyunwook, Seongguk Kim, Daehwan Lho, et al.. (2022). Scalable Transformer Network-based Reinforcement Learning Method for PSIJ Optimization in HBM. 1–3. 4 indexed citations
8.
Kim, Tae‐Wook, Seongsoo Lee, Boogyo Sim, et al.. (2022). Analysis of Repetitive Bending on Flexible Wireless Power Transfer (WPT) PCB Coils for Flexible Wearable Devices. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(11). 1748–1756. 9 indexed citations
9.
Sim, Boogyo, Keunwoo Kim, Hyunwook Park, et al.. (2022). Intra-pair Skew Impact Analysis of High-speed Cables for HDMI Interface. 1–3.
10.
Kim, Hyunwoong, Jong-Wook Kim, Keunwoo Kim, et al.. (2021). Modeling and Signal Integrity Analysis of Mounting Pad with Layer-cutting to reduce Impedance Mismatch for Dual-In-Line Memory Module (DIMM). mtt 35. 1–3. 5 indexed citations
11.
12.
Lho, Daehwan, Hyunwook Park, Gapyeol Park, et al.. (2021). Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs. 1–3. 1 indexed citations
13.
Kim, Haeyeon, Hyunwook Park, Minsu Kim, et al.. (2021). Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port. 1–3. 5 indexed citations
14.
Kim, Minsu, Hyunwook Park, Seongguk Kim, et al.. (2021). Imitation Learning for Simultaneous Escape Routing. 1–3. 1 indexed citations
15.
Kim, Keunwoo, Hyunwook Park, Daehwan Lho, et al.. (2020). Deep Reinforcement Learning-based Through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk. 1–3. 7 indexed citations
16.
Kim, Minsu, Hyunwook Park, Seongguk Kim, et al.. (2020). Reinforcement Learning-based Auto-router considering Signal Integrity. 1–3. 6 indexed citations
17.
18.
Park, Junyong, Seongguk Kim, Hyunwook Park, et al.. (2019). Electrical Performance Comparison between Coaxial and Non-coaxial Silicone Rubber Socket. 293–296. 2 indexed citations
19.
Kim, Seongguk, Kyungjun Cho, Shinyoung Park, et al.. (2019). Impact of On-Chip Interconnection in a Large-Scale Memristor Crossbar Array for Neural Network Accelerator and Neuromorphic Chip. 1–3. 8 indexed citations
20.
Kim, Seongguk, Donghyun Kim, Seohyun Kim, et al.. (2018). Potential Effects of Micro-Current Stimulation for Reduction of Abdominal Fat and Weight Loss: Clinical Study. Journal of Biomedical Engineering Research. 39(6). 284–296. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

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2026