Daehwan Lho
- Electrical and Electronic Engineering
- Hardware and Architecture top 10%
- Mechanical Engineering
- Artificial Intelligence
- Control and Systems Engineering
- Co-authors
- Hyunwook ParkJoungho KimShinyoung ParkSeongguk KimGapyeol ParkJunyong ParkSubin KimKyungjun Cho
- Topics
- 3D IC and TSV technologies (20 papers)Electromagnetic Compatibility and Noise Suppression (11 papers)Energy Harvesting in Wireless Networks (5 papers)
- Cited by
- Electrical and Electronic EngineeringHardware and ArchitectureIndustrial and Manufacturing Engineering
- Journals
- IEEE Transactions on Electromagnetic CompatibilityIEEE Transactions on Components Packaging and Manufacturing TechnologyNonlinear Theory and Its Applications IEICE
- Partner nations
- South KoreaUnited StatesJapan
In The Last Decade
Daehwan Lho
39 papers receiving 331 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 282
- Hardware and Architecture 32
- Mechanical Engineering 31
- Artificial Intelligence 26
- Control and Systems Engineering 22
Countries citing papers authored by Daehwan Lho
This map shows the geographic impact of Daehwan Lho's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daehwan Lho with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daehwan Lho more than expected).
Fields of papers citing papers by Daehwan Lho
This network shows the impact of papers produced by Daehwan Lho. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daehwan Lho. The network helps show where Daehwan Lho may publish in the future.
Co-authorship network of co-authors of Daehwan Lho
This figure shows the co-authorship network connecting the top 25 collaborators of Daehwan Lho. A scholar is included among the top collaborators of Daehwan Lho based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daehwan Lho. Daehwan Lho is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 3 | |
| 2 | 1 | |
| 3 | 0 | |
| 4 | 4 | |
| 5 | 3 | |
| 6 | 5 | |
| 7 | 1 | |
| 8 | 5 | |
| 9 | 27 | |
| 10 | 3 | |
| 11 | 1 | |
| 12 | 28 | |
| 13 | 7 | |
| 14 | 16 | |
| 15 | 1 | |
| 16 | 2 | |
| 17 | 4 | |
| 18 | 5 | |
| 19 | 14 | |
| 20 | 17 |
About Daehwan Lho
Daehwan Lho is a scholar working on Hardware and Architecture, Electrical and Electronic Engineering and Media Technology, having authored 42 papers that have together received 337 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (20 papers), Electromagnetic Compatibility and Noise Suppression (11 papers) and Energy Harvesting in Wireless Networks (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (282 citations), Hardware and Architecture (32 citations) and Industrial and Manufacturing Engineering (18 citations). Daehwan Lho has collaborated with scholars based in South Korea, United States and Japan. Frequent co-authors include Hyunwook Park, Joungho Kim, Shinyoung Park, Seongguk Kim, Gapyeol Park, Junyong Park, Subin Kim, Kyungjun Cho, Youngwoo Kim and Boogyo Sim. Their work appears in journals such as IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Components Packaging and Manufacturing Technology and Nonlinear Theory and Its Applications IEICE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.