Y. S. Lai

60.5k total citations
28 papers, 449 citations indexed

About

Y. S. Lai is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Y. S. Lai has authored 28 papers receiving a total of 449 indexed citations (citations by other indexed papers that have themselves been cited), including 19 papers in Electrical and Electronic Engineering, 8 papers in Mechanical Engineering and 6 papers in Mechanics of Materials. Recurrent topics in Y. S. Lai's work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Mechanical Behavior of Composites (5 papers). Y. S. Lai is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (10 papers) and Mechanical Behavior of Composites (5 papers). Y. S. Lai collaborates with scholars based in Taiwan, United States and Singapore. Y. S. Lai's co-authors include C. R. Kao, S.K.W. Seah, Chang-Lin Yeh, E.H. Wong, J.F.J.M. Caers, W.D. van Driel, M. Leoni, Xiujuan Zhao, Cheryl Selvanayagam and Bernd K. Appelt and has published in prestigious journals such as Journal of Applied Physics, Journal of Alloys and Compounds and Journal of High Energy Physics.

In The Last Decade

Y. S. Lai

26 papers receiving 436 citations

Peers

Y. S. Lai

EEE

NHEP

Xiaoyun Le China

Kazuto Takao Japan

C. Hernandez France

Y. Tachi Japan

Holger Witte United States

Vignesh Kannan United States

R. P. Fetherston United States

Jürgen Reiter Germany

Andrew Seltzman United States

Xiaoyun Le China

Y. S. Lai

125 ×0.3

EEE

51 ×0.3

89 ×1.0

99 ×1.3

41 ×1.0

NHEP

Citations per year, relative to Y. S. Lai Y. S. Lai (= 1×) peers Xiaoyun Le

Countries citing papers authored by Y. S. Lai

Since Specialization

Citations

This map shows the geographic impact of Y. S. Lai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Y. S. Lai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Y. S. Lai more than expected).

Fields of papers citing papers by Y. S. Lai

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Y. S. Lai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Y. S. Lai. The network helps show where Y. S. Lai may publish in the future.

Co-authorship network of co-authors of Y. S. Lai

This figure shows the co-authorship network connecting the top 25 collaborators of Y. S. Lai. A scholar is included among the top collaborators of Y. S. Lai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Y. S. Lai. Y. S. Lai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Zhang, Yan, Guangyu Xu, Yi Xu, et al.. (2025). Rotation manipulating photonic spin Hall effect based on Au- ReS 2 -graphene heterostructure. Surfaces and Interfaces. 74. 107684–107684.

Li, Wei, et al.. (2025). Three-dimensional finite element analysis of teeth displacement patterns under four anchorage designs for maxillary molar distalization using clear aligners: a real-case based simulation study. BMC Oral Health. 25(1). 1019–1019.

Lai, Y. S., James Declan Mulligan, Mateusz Andrzej Ploskon, & Felix Ringer. (2022). The information content of jet quenching and machine learning assisted observable design. Journal of High Energy Physics. 2022(10). 14 indexed citations

Lucchini, M. T., et al.. (2020). New perspectives on segmented crystal calorimeters for future colliders. Journal of Instrumentation. 15(11). P11005–P11005. 20 indexed citations

Wong, E.H., S.K.W. Seah, J.F.J.M. Caers, & Y. S. Lai. (2013). Frequency-dependent strain–life characteristics of Sn1.0Ag0.1Cu solder on cupper pad at high cyclic frequency. International Journal of Fatigue. 59. 43–49. 4 indexed citations

Appelt, Bernd K., et al.. (2011). Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding. 1481–1488. 43 indexed citations

Lai, Y. S.. (2011). Direct jet reconstruction in and Cu + Cu collisions at PHENIX. Nuclear Physics A. 855(1). 295–298. 5 indexed citations

Deng, Wenjun, et al.. (2011). Electromigration-induced accelerated consumption of Cu pad in flip chip Sn2.6Ag solder joints. 114–117. 5 indexed citations

Wang, Yi-Wun, et al.. (2010). Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints. Journal of Electronic Materials. 39(8). 1289–1294. 7 indexed citations

10.

Lin, Yan‐Cheng, Jia-Hong Ke, H. Y. Chuang, Y. S. Lai, & C. R. Kao. (2010). Electromigration in flip chip solder joints under extra high current density. Journal of Applied Physics. 107(7). 23 indexed citations

11.

Jian, Sheng‐Rui, J.S.C. Jang, Ying-Yen Liao, et al.. (2010). Cross-sectional transmission electron microscopy studies for deformation behaviors of AlN thin films under Berkovich nanoindentation. Journal of Alloys and Compounds. 504. S395–S398. 11 indexed citations

12.

Lai, Y. S.. (2009). Probing medium-induced energy loss with direct jet reconstruction in p+p and Cu+Cu collisions at PHENIX. Nuclear Physics A. 830(1-4). 251c–254c. 14 indexed citations

13.

Wong, E.H., et al.. (2009). Advances in the drop-impact reliability of solder joints for mobile applications. Microelectronics Reliability. 49(2). 139–149. 51 indexed citations

14.

Chang, Chia-Wei, Yan‐Cheng Lin, Y. S. Lai, & C. R. Kao. (2009). Fundamental Study of the Intermixing of 95Pb-5Sn High-Lead Solder Bumps and 37Pb-63Sn Pre-Solder on Chip-Carrier Substrates. Journal of Electronic Materials. 38(11). 2234–2241. 5 indexed citations

15.

Wong, E.H., Cheryl Selvanayagam, S.K.W. Seah, et al.. (2008). Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling. Journal of Electronic Materials. 37(6). 829–836. 64 indexed citations

16.

Seah, S.K.W., E.H. Wong, Cheryl Selvanayagam, et al.. (2008). A Comprehensive Test Method for Bridging the Gap between Product and Board Level Drop Tests. 1102–1107. 2 indexed citations

17.

Wong, E.H., et al.. (2008). Recent advances in drop-impact reliability. 1–9. 11 indexed citations

18.

Wong, E.H., R. Rajoo, S.K.W. Seah, et al.. (2008). Correlation studies for component level ball impact shear test and board level drop test. Microelectronics Reliability. 48(7). 1069–1078. 28 indexed citations

19.

Selvanayagam, Cheryl, E.H. Wong, S.K.W. Seah, et al.. (2007). Constitutive Properties of Bulk Solder at `Drop-Impact' Strain Rates. 8. 360–364. 2 indexed citations

20.

Lin, Y. L., Y. S. Lai, Cheng‐Hsien Tsai, & C. R. Kao. (2006). Effect of surface finish on the failure mechanisms of flip-chip solder joints under electromigration. Journal of Electronic Materials. 35(12). 2147–2153. 30 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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