C. Witt

1.0k total citations
31 papers, 775 citations indexed

About

C. Witt is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, C. Witt has authored 31 papers receiving a total of 775 indexed citations (citations by other indexed papers that have themselves been cited), including 22 papers in Electrical and Electronic Engineering, 22 papers in Electronic, Optical and Magnetic Materials and 8 papers in Materials Chemistry. Recurrent topics in C. Witt's work include Copper Interconnects and Reliability (22 papers), Semiconductor materials and devices (10 papers) and Electronic Packaging and Soldering Technologies (9 papers). C. Witt is often cited by papers focused on Copper Interconnects and Reliability (22 papers), Semiconductor materials and devices (10 papers) and Electronic Packaging and Soldering Technologies (9 papers). C. Witt collaborates with scholars based in United States, Germany and Australia. C. Witt's co-authors include Daniel Wheeler, T. P. Moffat, D. Josell, D. Josell, Thomas P. Moffat, Stephan Krämer, Joachim Mayer, M. Rühle, A. Weickenmeier and Cynthia A. Volkert and has published in prestigious journals such as Angewandte Chemie International Edition, ACS Nano and Applied Physics Letters.

In The Last Decade

C. Witt

29 papers receiving 740 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
C. Witt United States 15 571 369 232 123 91 31 775
M. Sardar India 14 301 0.5× 360 1.0× 631 2.7× 98 0.8× 130 1.4× 44 952
G. Reza Yazdi Sweden 20 636 1.1× 243 0.7× 830 3.6× 135 1.1× 322 3.5× 49 1.2k
H. Schlörb Germany 19 418 0.7× 272 0.7× 550 2.4× 411 3.3× 104 1.1× 44 932
G. G. Siu Hong Kong 13 252 0.4× 166 0.4× 413 1.8× 88 0.7× 149 1.6× 31 570
Fang Lu China 14 443 0.8× 271 0.7× 333 1.4× 136 1.1× 134 1.5× 43 761
M. Herranen Sweden 12 313 0.5× 93 0.3× 265 1.1× 35 0.3× 61 0.7× 15 613
Youwen Yang China 13 332 0.6× 182 0.5× 419 1.8× 75 0.6× 172 1.9× 39 690
Jun Yu China 17 253 0.4× 152 0.4× 674 2.9× 42 0.3× 161 1.8× 51 1.0k
M. Kamruddin India 19 395 0.7× 287 0.8× 582 2.5× 43 0.3× 176 1.9× 37 859
B. Y. Zong Singapore 13 287 0.5× 273 0.7× 614 2.6× 272 2.2× 182 2.0× 39 945

Countries citing papers authored by C. Witt

Since Specialization
Citations

This map shows the geographic impact of C. Witt's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C. Witt with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C. Witt more than expected).

Fields of papers citing papers by C. Witt

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by C. Witt. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C. Witt. The network helps show where C. Witt may publish in the future.

Co-authorship network of co-authors of C. Witt

This figure shows the co-authorship network connecting the top 25 collaborators of C. Witt. A scholar is included among the top collaborators of C. Witt based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with C. Witt. C. Witt is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hu, Xin, C. Witt, Reika Katsumata, et al.. (2025). Wet/Dry Bottlebrush Pressure Sensitive Adhesives via a Dangling Defect-Driven Design. ACS Applied Materials & Interfaces. 17(20). 30140–30148.
2.
Witt, C., Rida Fatima, Dong‐Po Song, et al.. (2024). Opportunities in Bottlebrush Block Copolymers for Advanced Materials. ACS Nano. 19(2). 1884–1910. 15 indexed citations
3.
Witt, C., et al.. (2024). Bottlebrush Networks: A Primer for Advanced Architectures. Angewandte Chemie. 136(22). 2 indexed citations
4.
Witt, C., et al.. (2024). Bottlebrush Networks: A Primer for Advanced Architectures. Angewandte Chemie International Edition. 63(22). e202318220–e202318220. 16 indexed citations
5.
Chubb, Laura, et al.. (2022). Compressive properties and failure behavior of photocast hydroxyapatite gyroid scaffolds vary with porosity. Journal of Biomaterials Applications. 37(1). 55–76. 12 indexed citations
6.
Witt, C.. (2020). Electromigration Void Behavior Revisited. 14. 130–132. 1 indexed citations
7.
Witt, C., Kong Boon Yeap, A. Leśniewska, et al.. (2018). Testing The Limits of TaN Barrier Scaling. 54–56. 31 indexed citations
8.
Witt, C., et al.. (2017). Resistance contributions to copper interconnects. 1–3. 2 indexed citations
9.
Witt, C., et al.. (2016). Electromigration: Void Dynamics. IEEE Transactions on Device and Materials Reliability. 16(4). 446–451. 10 indexed citations
10.
Murray, Conal E., E. Todd Ryan, Paul R. Besser, et al.. (2010). Evolution of stress gradients in Cu films and features induced by capping layers. Microelectronic Engineering. 92. 95–100. 4 indexed citations
11.
12.
Witt, C., R. Rosenberg, Griselda Bonilla, et al.. (2009). Stress Relaxation in Cu Thin Films. AIP conference proceedings. 156–165. 5 indexed citations
13.
Aubel, Oliver, Michael Meyer, H. Engelmann, et al.. (2008). Extensive investigations of temperature influence on barrier integrity during reliability testing. Microelectronic Engineering. 85(10). 2042–2046. 1 indexed citations
14.
Josell, D., C. Witt, & Thomas P. Moffat. (2006). Osmium Barriers for Direct Copper Electrodeposition in Damascene Processing. Electrochemical and Solid-State Letters. 9(2). C41–C43. 42 indexed citations
15.
Moffat, Thomas P., Mitchell L. R. Walker, John E. Bonevich, et al.. (2005). Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing. Journal of The Electrochemical Society. 153(1). C37–C37. 97 indexed citations
16.
Witt, C., Cynthia A. Volkert, & Eduard Arzt. (2002). Electromigration-induced Cu motion and precipitation in bamboo Al–Cu interconnects. Acta Materialia. 51(1). 49–60. 37 indexed citations
17.
Josell, D., A. B. Baker, C. Witt, Daniel Wheeler, & T. P. Moffat. (2002). Via Filling by Electrodeposition. Journal of The Electrochemical Society. 149(12). C637–C637. 53 indexed citations
18.
19.
Krämer, Stephan, Joachim Mayer, C. Witt, A. Weickenmeier, & M. Rühle. (2000). Analysis of local strain in aluminium interconnects by energy filtered CBED. Ultramicroscopy. 81(3-4). 245–262. 66 indexed citations
20.
Hundhausen, Martin, L. Ley, & C. Witt. (1996). Influence of space charges on the resonant photoconductor employing a moving laser induced grating. Applied Physics Letters. 69(12). 1746–1748. 2 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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