Peter Sandborn
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- Transportation Systems and Infrastructure 38
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- Technology Assessment and Management 39
- Reliability and Maintenance Optimization 38
- Software top 5%
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- Manufacturing Process and Optimization 19
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- Life Cycle Costing Analysis 16
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- VLSI and FPGA Design Techniques 15
- 3D IC and TSV technologies 13
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- Historical Studies in Central America 14
- Co-authors
- Michael PechtAndre KleynerNavid GoudarziChris WilkinsonC.F. MurphyP.A. BlakeyMagdy S. AbadirDiego Galar
- Cited by
- Management of Technology and InnovationSafety, Risk, Reliability and QualityMedical Laboratory Technology
- Journals
- Microelectronics Reliability (7 papers)IEEE Transactions on Components and Packaging Technologies (6 papers)IEEE Transactions on Electronics Packaging Manufacturing (5 papers)
- Partner nations
- United StatesSwedenCanada
In The Last Decade
Peter Sandborn
152 papers receiving 2.2k citations
Peers
Comparison fields: 5 of 113
- Management of Technology and Innovation 733
- Safety, Risk, Reliability and Quality 894
- Medical Laboratory Technology 96
- Statistics, Probability and Uncertainty 251
- Software 101
Countries citing papers authored by Peter Sandborn
This map shows the geographic impact of Peter Sandborn's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Peter Sandborn with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Peter Sandborn more than expected).
Fields of papers citing papers by Peter Sandborn
This network shows the impact of papers produced by Peter Sandborn. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Peter Sandborn. The network helps show where Peter Sandborn may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Peter Sandborn, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 0 | |
| 2 | 2025 | 1 | |
| 3 | 2024 | 4 | |
| 4 | 2024 | 0 | |
| 5 | 2023 | 1 | |
| 6 | 2016 | 5 | |
| 7 | 2016 | 6 | |
| 8 | 2015 | 2 | |
| 9 | The need for aggregated indicators in performance asset management | 2014 | 10 |
| 10 | 2014 | 5 | |
| 11 | 2014 | 3 | |
| 12 | Maintenance within Product Service Systems: Is technical knowledge enough to link performance and cost? | 2013 | 2 |
| 13 | 2011 | 15 | |
| 14 | Using Teardown Analysis as a Vehicle to Teach Electronic Systems Manufacturing Cost Modeling | 2009 | 2 |
| 15 | Using embedded resistor emulation and trimming to demonstrate measurement methods and associated engineering model development | 2007 | 6 |
| 16 | 2005 | 11 | |
| 17 | 2005 | 5 | |
| 18 | 2005 | 1 | |
| 19 | 2002 | 9 | |
| 20 | Tradeoff Analysis and Partitioning in Multiple Board/MCM Systems | 1995 | 1 |
About Peter Sandborn
Peter Sandborn is a scholar working on Safety, Risk, Reliability and Quality, Management of Technology and Innovation, Medical Laboratory Technology, Software and Hardware and Architecture, having authored 167 papers that have together received 2.4k indexed citations. Recurring topics across this work include Technology Assessment and Management (39 papers), Reliability and Maintenance Optimization (38 papers), Transportation Systems and Infrastructure (38 papers), Manufacturing Process and Optimization (19 papers), Life Cycle Costing Analysis (16 papers), VLSI and FPGA Design Techniques (15 papers), Historical Studies in Central America (14 papers) and 3D IC and TSV technologies (13 papers). The work is most often cited by research in Management of Technology and Innovation (733 citations), Safety, Risk, Reliability and Quality (894 citations), Medical Laboratory Technology (96 citations), Statistics, Probability and Uncertainty (251 citations) and Software (101 citations). Peter Sandborn has collaborated with scholars based in United States, Sweden and Canada. Frequent co-authors include Michael Pecht, Andre Kleyner, Navid Goudarzi, Chris Wilkinson, C.F. Murphy, P.A. Blakey, Magdy S. Abadir, Diego Galar, Uday Kumar and Paramvir Singh. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Advanced Packaging and Renewable Energy.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.