F. Patrick McCluskey

1.2k total citations · 1 hit paper
60 papers, 968 citations indexed

About

F. Patrick McCluskey is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, F. Patrick McCluskey has authored 60 papers receiving a total of 968 indexed citations (citations by other indexed papers that have themselves been cited), including 45 papers in Electrical and Electronic Engineering, 25 papers in Mechanical Engineering and 7 papers in Biomedical Engineering. Recurrent topics in F. Patrick McCluskey's work include Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (16 papers) and Aluminum Alloys Composites Properties (8 papers). F. Patrick McCluskey is often cited by papers focused on Electronic Packaging and Soldering Technologies (29 papers), 3D IC and TSV technologies (16 papers) and Aluminum Alloys Composites Properties (8 papers). F. Patrick McCluskey collaborates with scholars based in United States, Switzerland and Puerto Rico. F. Patrick McCluskey's co-authors include Nicholas R. Jankowski, Manas Ranjan Dash, D. Huff, Zhiguo Wang, Michael Pecht, Rui Wu, Johannes Karl Fink, Peter Sandborn, Edward B. Magrab and Raphael Mandel and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Applied Energy.

In The Last Decade

F. Patrick McCluskey

55 papers receiving 930 citations

Hit Papers

A review of phase change materials for vehicle component ... 2013 2026 2017 2021 2013 100 200 300
What are hit papers?

Hit papers significantly outperform the citation benchmark for their cohort. A paper qualifies if it has ≥500 total citations, achieves ≥1.5× the top-1% citation threshold for papers in the same subfield and year (this is the minimum needed to enter the top 1%, not the average within it), or reaches the top citation threshold in at least one of its specific research topics.

  1. A review of phase change materials for vehicle component thermal buffering
    2013 368 citations Nicholas R. Jankowski, F. Patrick McCluskey profile →

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
F. Patrick McCluskey United States 15 590 531 177 139 74 60 968
Hongzhi Yan China 20 820 1.4× 360 0.7× 185 1.0× 120 0.9× 73 1.0× 64 1.2k
Gobinath Velu Kaliyannan India 19 211 0.4× 391 0.7× 131 0.7× 225 1.6× 28 0.4× 60 761
Qing He China 16 498 0.8× 272 0.5× 102 0.6× 109 0.8× 18 0.2× 75 828
Fan Bai China 18 224 0.4× 288 0.5× 204 1.2× 304 2.2× 68 0.9× 64 822
Nicholas R. Jankowski United States 14 745 1.3× 205 0.4× 211 1.2× 243 1.7× 75 1.0× 38 929
Menglong Hao China 16 310 0.5× 336 0.6× 118 0.7× 258 1.9× 336 4.5× 38 978
Yanze Li China 16 320 0.5× 359 0.7× 48 0.3× 256 1.8× 128 1.7× 75 815
Abhishek Tiwari India 14 190 0.3× 397 0.7× 122 0.7× 201 1.4× 24 0.3× 36 818
Qinglong Zhang China 14 561 1.0× 120 0.2× 185 1.0× 261 1.9× 61 0.8× 34 920
Sasi Kumar Tippabhotla Singapore 15 134 0.2× 371 0.7× 122 0.7× 101 0.7× 52 0.7× 35 549

Countries citing papers authored by F. Patrick McCluskey

Since Specialization
Citations

This map shows the geographic impact of F. Patrick McCluskey's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by F. Patrick McCluskey with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites F. Patrick McCluskey more than expected).

Fields of papers citing papers by F. Patrick McCluskey

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by F. Patrick McCluskey. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by F. Patrick McCluskey. The network helps show where F. Patrick McCluskey may publish in the future.

Co-authorship network of co-authors of F. Patrick McCluskey

This figure shows the co-authorship network connecting the top 25 collaborators of F. Patrick McCluskey. A scholar is included among the top collaborators of F. Patrick McCluskey based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with F. Patrick McCluskey. F. Patrick McCluskey is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
McCluskey, F. Patrick, et al.. (2022). AI-Based Reliability Assessment of Power Electronic Systems.
2.
3.
McCluskey, F. Patrick, et al.. (2021). Reliable Additive Manufacturing Using Transient Liquid Phase Sintering. 1 indexed citations
4.
McCluskey, F. Patrick, et al.. (2019). Cooling for Electric Aircraft Motors. 1134–1138. 20 indexed citations
5.
6.
McCluskey, F. Patrick, et al.. (2016). Failure mechanisms in encapsulated copper wire-bonded devices. 316–320. 18 indexed citations
7.
Jain, Rupal, F. Patrick McCluskey, & Alison B. Flatau. (2011). MEMS Package for an Iron–Gallium Nanowire-Based Acoustic Sensor. IEEE Transactions on Components Packaging and Manufacturing Technology. 1–9. 3 indexed citations
8.
Jankowski, Nicholas R. & F. Patrick McCluskey. (2010). Electrical Supercooling Mitigation in Erythritol. 409–416. 13 indexed citations
9.
Jankowski, Nicholas R., Brian Morgan, & F. Patrick McCluskey. (2009). Design and Fabrication of a Substrate Integrated Phase Change Thermal Buffer Heat Sink. 75–84. 1 indexed citations
10.
McCluskey, F. Patrick, et al.. (2009). Reliability assessment of indium solder for low temperature electronic packaging. Cryogenics. 49(11). 630–634. 35 indexed citations
11.
McCluskey, F. Patrick, et al.. (2009). Silver-Indium Transient Liquid Phase Sintering for High Temperature Die Attachment. Journal of Microelectronics and Electronic Packaging. 6(1). 66–74. 20 indexed citations
12.
Wu, Rui & F. Patrick McCluskey. (2007). Reliability of Indium Solder for Cold Temperature Packaging. 553–556. 8 indexed citations
13.
McCluskey, F. Patrick, et al.. (2006). Packaging of an iron-gallium nanowire acoustic sensor. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 6172. 617217–617217. 1 indexed citations
14.
McCluskey, F. Patrick, et al.. (2006). Packaging of an Iron-Gallium Nanowire Acoustic Sensor. 99. 1406–1409. 1 indexed citations
15.
Ghosh, Kaushik, F. Patrick McCluskey, & V.A.K. Temple. (2005). Mechanical Reliability Evaluation of Chip Scale Power Package. 77–85.
16.
McCluskey, F. Patrick, et al.. (2003). Die attach and wirebond systems for high temperature electronics. 63–63. 1 indexed citations
17.
Morris, James E. & F. Patrick McCluskey. (2002). A multidisciplinary sophomore course in electronics packaging. 535–540. 2 indexed citations
18.
McCluskey, F. Patrick & Michael Pecht. (1999). Rapid Reliability Assessment Using CADMP-II. TechConnect Briefs. 495–497. 1 indexed citations
19.
McCluskey, F. Patrick & Diganta Das. (1998). Component Technology Insertion into Critical Avionics Applications. 1 indexed citations
20.
McCluskey, F. Patrick, et al.. (1996). Reliability Assessment of BGA Interconnects With CADMP-II. 93–100. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact

Breakdown of academic impact, for papers by Hongzhi Yan Breakdown of academic impact, for papers by Gobinath Velu Kaliyannan Breakdown of academic impact, for papers by Qing He Breakdown of academic impact, for papers by Fan Bai Breakdown of academic impact, for papers by Nicholas R. Jankowski Breakdown of academic impact, for papers by Menglong Hao Breakdown of academic impact, for papers by Yanze Li Breakdown of academic impact, for papers by Abhishek Tiwari Breakdown of academic impact, for papers by Qinglong Zhang Breakdown of academic impact, for papers by Sasi Kumar Tippabhotla
Rankless by CCL
2026