T.S. Cale

1.6k total citations
83 papers, 1.2k citations indexed

About

T.S. Cale is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, T.S. Cale has authored 83 papers receiving a total of 1.2k indexed citations (citations by other indexed papers that have themselves been cited), including 55 papers in Electrical and Electronic Engineering, 27 papers in Biomedical Engineering and 26 papers in Mechanics of Materials. Recurrent topics in T.S. Cale's work include Copper Interconnects and Reliability (24 papers), Semiconductor materials and devices (22 papers) and Metal and Thin Film Mechanics (21 papers). T.S. Cale is often cited by papers focused on Copper Interconnects and Reliability (24 papers), Semiconductor materials and devices (22 papers) and Metal and Thin Film Mechanics (21 papers). T.S. Cale collaborates with scholars based in United States, Sweden and Netherlands. T.S. Cale's co-authors include Gregory B. Raupp, T. Bibby, Stephen P. Beaudoin, Karey Holland, Bridget R. Rogers, R.J. Gutmann, Jian‐Qiang Lu, Duo Wang, J. J. McMahon and Yongchai Kwon and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Chemistry of Materials.

In The Last Decade

T.S. Cale

78 papers receiving 1.1k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
T.S. Cale United States	18	706	392	322	247	238	83	1.2k
Timothy S. Cale United States	20	743 1.1×	363 0.9×	434 1.3×	315 1.3×	206 0.9×	79	1.3k
K. Yamaguchi Japan	16	521 0.7×	604 1.5×	239 0.7×	131 0.5×	302 1.3×	98	1.2k
Hans-Joachim Quenzer Germany	20	726 1.0×	532 1.4×	274 0.9×	86 0.3×	142 0.6×	57	1.2k
L. T. Romankiw United States	23	1.2k 1.7×	345 0.9×	553 1.7×	158 0.6×	283 1.2×	65	1.7k
Wouter Ruythooren Belgium	23	1.4k 2.0×	203 0.5×	247 0.8×	112 0.5×	208 0.9×	66	1.6k
Kohji Toda Japan	14	419 0.6×	444 1.1×	404 1.3×	280 1.1×	108 0.5×	150	1.0k
Takeshi Araki Japan	20	276 0.4×	363 0.9×	708 2.2×	136 0.6×	480 2.0×	69	1.5k
Zhuyong Li China	20	818 1.2×	519 1.3×	341 1.1×	134 0.5×	390 1.6×	120	1.5k
M. Hecker Germany	20	537 0.8×	202 0.5×	330 1.0×	233 0.9×	265 1.1×	110	1.2k
Michael D. Kriese United States	17	360 0.5×	252 0.6×	317 1.0×	673 2.7×	251 1.1×	34	1.0k

Countries citing papers authored by T.S. Cale

Since Specialization

Citations

This map shows the geographic impact of T.S. Cale's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.S. Cale with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.S. Cale more than expected).

Fields of papers citing papers by T.S. Cale

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by T.S. Cale. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.S. Cale. The network helps show where T.S. Cale may publish in the future.

Co-authorship network of co-authors of T.S. Cale

This figure shows the co-authorship network connecting the top 25 collaborators of T.S. Cale. A scholar is included among the top collaborators of T.S. Cale based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with T.S. Cale. T.S. Cale is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

Sort: Min cites: Since: Top N: Style:

20 of 20 papers shown

Huang, H., et al.. (2006). Grain Based Modeling of Stress Induced Copper Migration for 3D-IC Interwafer Vias. 345–348. 3 indexed citations

Pozder, Scott, Jian‐Qiang Lu, Stefan Zollner, et al.. (2004). Back-end compatibility of bonding and thinning processes for a wafer-level 3D interconnect technology platform. 102–104. 14 indexed citations

Mathad, Shridhar N. & T.S. Cale. (2003). Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium. Electrochemical Society eBooks. 2 indexed citations

Cale, T.S., James Castracane, Eric Eisenbraun, et al.. (2003). Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems. TechConnect Briefs. 1(2003). 530–533. 1 indexed citations

Cale, T.S., et al.. (2002). Integrated multiscale process simulation. Computational Materials Science. 23(1-4). 3–14. 26 indexed citations

Soukane, Sofiane, et al.. (2002). Feature Superfilling in Copper Electrochemical Deposition. Journal of The Electrochemical Society. 149(1). C74–C74. 16 indexed citations

Yang, Dongliang, et al.. (2000). Programmed Rate Chemical Vapor Deposition Protocols. Journal of The Electrochemical Society. 147(2). 723–723. 3 indexed citations

Yang, Dongliang, et al.. (1999). Programmed substrate temperature ramping to increase nucleation density and decrease surface roughness during metalorganic chemical vapor deposition of aluminum. Journal of materials research/Pratt's guide to venture capital sources. 14(5). 1982–1989. 7 indexed citations

Beaudoin, Stephen P., et al.. (1997). Stress distribution in chemical mechanical polishing. Thin Solid Films. 308-309. 533–537. 83 indexed citations

10.

Drucker, Jeff, et al.. (1995). Morphology of Ag Islands Grown on GaAs (110) at Low Coverage: Monte Carlo Simulations. MRS Proceedings. 399. 2 indexed citations

11.

Cale, T.S., et al.. (1994). Modeling of Collimateti Titanium Nitride Physical Vapor Deposition using a Combined Specular-Diffuse Formulation. MRS Proceedings. 355. 2 indexed citations

12.

Cale, T.S. & Gregory B. Raupp. (1993). PECVD of Silicon Dioxide from TEOS/Oxygen Mixtures. Materials science forum. 140-142. 1–16. 4 indexed citations

13.

Cale, T.S., et al.. (1992). Ballistic transport-reaction prediction of film conformality in tetraethoxysilane O2 plasma enhanced deposition of silicon dioxide. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 10(4). 1128–1134. 21 indexed citations

14.

Cale, T.S., et al.. (1992). Estimating Local Deposition Conditions and Kinetic Parameters Using Film Profiles. MRS Proceedings. 260. 7 indexed citations

15.

Cale, T.S., et al.. (1991). Impacts of Temperature and Reactant Flow Rate Transients on LPCVD Tungsten Silicide Film Properties. MRS Proceedings. 224. 3 indexed citations

16.

Cale, T.S. & Gregory B. Raupp. (1990). A unified line-of-sight model of deposition in rectangular trenches. Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena. 8(6). 1242–1248. 100 indexed citations

17.

Cale, T.S.. (1988). EFFECTIVENESS FACTOR FOR A SINGLE PELLET DURING ETHANE HYDROGENOLYSIS. Chemical Engineering Communications. 70(1). 57–65. 1 indexed citations

18.

Cale, T.S. & James T. Richardson. (1985). Cyclopropane hydrogenolysis reactions over catalysts. Journal of Catalysis. 94(1). 289–291. 6 indexed citations

19.

Cale, T.S. & Douglas K. Ludlow. (1984). Application of AC Permeametry to Catalytic Crystallite Thermometry. Instrumentation Science & Technology. 13(2). 183–192. 5 indexed citations

20.

Cale, T.S.. (1984). Nickel crystallite thermometry during ethane hydrogenolysis. Journal of Catalysis. 90(1). 40–48. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

Explore authors with similar magnitude of impact