T.S. Cale
Impact in
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- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Plasma Diagnostics and Applications
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- Copper Interconnects and Reliability
Papers in ⓘ
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- Copper Interconnects and Reliability 24
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- Metal and Thin Film Mechanics 21
- Co-authors
- Gregory B. Raupp (15 shared papers)Karey Holland (2 shared papers)T. Bibby (3 shared papers)Stephen P. Beaudoin (3 shared papers)Bridget R. Rogers (10 shared papers)R.J. Gutmann (19 shared papers)Jian‐Qiang Lu (12 shared papers)Duo Wang (1 shared paper)
- Journals
- Thin Solid Films (10 papers)Journal of The Electrochemical Society (5 papers)Journal of Catalysis (4 papers)Chemical Engineering Communications (4 papers)Journal of Vacuum Science & Technology A Vacuum Surfaces and Films (4 papers)
- Partner nations
- United StatesSwedenNetherlands
In The Last Decade
T.S. Cale
78 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 64
- Electrical and Electronic Engineering 706
- Electronic, Optical and Magnetic Materials 223
- Mechanics of Materials 247
- Biomedical Engineering 392
- Materials Chemistry 322
Countries citing papers authored by T.S. Cale
This map shows the geographic impact of T.S. Cale's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.S. Cale with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.S. Cale more than expected).
Fields of papers citing papers by T.S. Cale
This network shows the impact of papers produced by T.S. Cale. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.S. Cale. The network helps show where T.S. Cale may publish in the future.
Co-authors
The 25 scholars most cited alongside T.S. Cale, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 83 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1997 | 130 | |
| 2 | 1990 | 100 | |
| 3 | 1997 | 83 | |
| 4 | 2006 | 69 | |
| 5 | 1990 | 47 | |
| 6 | 1990 | 45 | |
| 7 | 1991 | 29 | |
| 8 | 1989 | 29 | |
| 9 | 2004 | 27 | |
| 10 | 2002 | 26 | |
| 11 | 1998 | 26 | |
| 12 | 1991 | 26 | |
| 13 | 2002 | 25 | |
| 14 | 1983 | 24 | |
| 15 | 1990 | 23 | |
| 16 | 1992 | 21 | |
| 17 | 2003 | 19 | |
| 18 | 1998 | 19 | |
| 19 | 1984 | 17 | |
| 20 | 2002 | 17 |
About T.S. Cale
T.S. Cale is a scholar working on Electronic, Optical and Magnetic Materials, Mechanics of Materials, Electrical and Electronic Engineering, Biomedical Engineering and Surfaces, Coatings and Films, having authored 83 papers that have together received 1.2k indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (24 papers), Semiconductor materials and devices (22 papers), Metal and Thin Film Mechanics (21 papers), 3D IC and TSV technologies (15 papers), Advanced Surface Polishing Techniques (13 papers), Electronic Packaging and Soldering Technologies (12 papers), Plasma Diagnostics and Applications (12 papers) and Nanofabrication and Lithography Techniques (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (706 citations), Electronic, Optical and Magnetic Materials (223 citations), Mechanics of Materials (247 citations), Biomedical Engineering (392 citations) and Materials Chemistry (322 citations). T.S. Cale has collaborated with scholars based in United States, Sweden and Netherlands. Frequent co-authors include Gregory B. Raupp, Karey Holland, T. Bibby, Stephen P. Beaudoin, Bridget R. Rogers, R.J. Gutmann, Jian‐Qiang Lu, Duo Wang, J. J. McMahon and Yongchai Kwon. Their work appears in journals such as Thin Solid Films, Journal of The Electrochemical Society, Journal of Catalysis, Chemical Engineering Communications and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.