Immediate Impact
6 standout
Citing Papers
Adhesively bonded joints – A review on design, manufacturing, experiments, modeling and challenges
2024 Standout
Eutectic high-entropy alloys and their applications in materials processing engineering: A review
2024 Standout
Works of Chengwen He being referenced
Microstructures and Properties of SnZn Lead-Free Solder Joints Bearing La for Electronic Packaging
2012
Microstructures and properties of SnZn-xEr lead-free solders
2012
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| Chengwen He | 451 | 332 | 5 | 49 | 18 | 480 | |
| G.Y. Li | 503 | 449 | 53 | 17 | 532 | ||
| Jiguang Han | 390 | 267 | 38 | 27 | 476 | ||
| Chi-Won Hwang | 432 | 360 | 87 | 13 | 454 | ||
| Zhong Sheng | 490 | 440 | 1 | 100 | 14 | 529 | |
| Zhixian Min | 419 | 431 | 98 | 26 | 530 | ||
| Ignacio Lope | 440 | 285 | 3 | 21 | 33 | 521 | |
| J. Read | 536 | 414 | 131 | 20 | 573 | ||
| W. Engelmaier | 364 | 196 | 34 | 15 | 415 | ||
| D. Grivas | 454 | 397 | 96 | 15 | 526 | ||
| Bite Zhou | 407 | 263 | 126 | 16 | 439 |
All Works
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