Chengwen He

618 total citations
22 papers, 532 citations indexed

About

Chengwen He is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Ocean Engineering. According to data from OpenAlex, Chengwen He has authored 22 papers receiving a total of 532 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 14 papers in Mechanical Engineering and 5 papers in Ocean Engineering. Recurrent topics in Chengwen He's work include Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloys Composites Properties (6 papers). Chengwen He is often cited by papers focused on Electronic Packaging and Soldering Technologies (15 papers), 3D IC and TSV technologies (9 papers) and Aluminum Alloys Composites Properties (6 papers). Chengwen He collaborates with scholars based in China, United States and Italy. Chengwen He's co-authors include Yonghuan Guo, Liang Zhang, Jiguang Han, Liang Zhang, Yong‐Wei Zhang, Lei Sun, Bingfeng Tan, Yunbin Yuan, Jun Cai and Dian He and has published in prestigious journals such as Materials Science and Engineering A, IEEE Access and Sensors.

In The Last Decade

Chengwen He

21 papers receiving 523 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Chengwen He China 11 498 357 57 38 25 22 532
Kuo-Chuan Liu United States 11 333 0.7× 214 0.6× 52 0.9× 19 0.5× 19 0.8× 24 352
Paweł Górecki Poland 14 514 1.0× 278 0.8× 15 0.3× 10 0.3× 22 0.9× 66 573
Hua Ye United States 7 327 0.7× 99 0.3× 18 0.3× 74 1.9× 69 2.8× 11 428
Andy Yoon United States 13 308 0.6× 103 0.3× 46 0.8× 5 0.1× 51 2.0× 18 358
Ranjit Pandher United States 8 291 0.6× 130 0.4× 54 0.9× 31 0.8× 3 0.1× 25 324
Dehui Zeng China 11 251 0.5× 88 0.2× 47 0.8× 36 0.9× 7 0.3× 18 364
Hongxian Zhang China 8 217 0.4× 82 0.2× 63 1.1× 7 0.2× 37 1.5× 30 318
Lin Ruan China 10 208 0.4× 172 0.5× 56 1.0× 19 0.5× 27 1.1× 87 348
Przemysław Ptak Poland 12 344 0.7× 184 0.5× 12 0.2× 9 0.2× 10 0.4× 57 405

Countries citing papers authored by Chengwen He

Since Specialization
Citations

This map shows the geographic impact of Chengwen He's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chengwen He with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chengwen He more than expected).

Fields of papers citing papers by Chengwen He

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Chengwen He. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chengwen He. The network helps show where Chengwen He may publish in the future.

Co-authorship network of co-authors of Chengwen He

This figure shows the co-authorship network connecting the top 25 collaborators of Chengwen He. A scholar is included among the top collaborators of Chengwen He based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chengwen He. Chengwen He is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Yuanyuan, Lipeng He, G. S. Huang, et al.. (2025). Synergy of Reservoir Mapping Service and Drilling Intelligence Service to Successfully Push the Longest ERD Well to the Limit in a Faulted Reservoir of Offshore China Marginal Oilfield. SPE/IADC Middle East Drilling Technology Conference and Exhibition. 1 indexed citations
2.
Cai, Jun, et al.. (2023). Online Incentive Mechanism Designs for Asynchronous Federated Learning in Edge Computing. IEEE Internet of Things Journal. 11(5). 7787–7804. 9 indexed citations
3.
Li, Xiaolong, et al.. (2022). Optimizing Anchor Node Deployment for Fingerprint Localization With Low-Cost and Coarse-Grained Communication Chips. IEEE Internet of Things Journal. 9(16). 15297–15311. 9 indexed citations
4.
He, Chengwen, Yunbin Yuan, & Bingfeng Tan. (2021). Alternating Direction Method of Multipliers for TOA-Based Positioning Under Mixed Sparse LOS/NLOS Environments. IEEE Access. 9. 28407–28412. 9 indexed citations
5.
He, Chengwen, Yunbin Yuan, & Bingfeng Tan. (2021). Constrained L1-Norm Minimization Method for Range-Based Source Localization under Mixed Sparse LOS/NLOS Environments. Sensors. 21(4). 1321–1321. 3 indexed citations
6.
7.
Zhang, Liang, Yonghuan Guo, Lei Sun, & Chengwen He. (2016). Reliability of SnAgCuFe Solder Joints in WLCSP30 Device. Rare Metal Materials and Engineering. 45(11). 2823–2826. 9 indexed citations
8.
Zhang, Liang, K. N. Tu, Lei Sun, Yonghuan Guo, & Chengwen He. (2015). Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders. 36(1). 59–62. 1 indexed citations
9.
Zhang, Liang, K. N. Tu, Lei Sun, Yonghuan Guo, & Chengwen He. (2015). Reviews on latest advances in micro/nano-sized particles enhanced composite solders. 46(1). 49–65. 3 indexed citations
10.
Zhang, Liang, et al.. (2014). Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging. International Journal of Nonlinear Sciences and Numerical Simulation. 15(3-4). 197–206. 10 indexed citations
11.
Zhang, Liang, Lei Sun, Yonghuan Guo, & Chengwen He. (2014). Reliability of lead-free solder joints in CSP device under thermal cycling. Journal of Materials Science Materials in Electronics. 25(3). 1209–1213. 45 indexed citations
12.
Zhang, Liang, et al.. (2014). Properties enhancement of SnAgCu solders containing rare earth Yb. Materials & Design (1980-2015). 57. 646–651. 49 indexed citations
13.
Zhang, Liang, Jiguang Han, Yonghuan Guo, & Chengwen He. (2014). Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments. Materials Science and Engineering A. 597. 219–224. 37 indexed citations
14.
Zhang, Liang, et al.. (2014). Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices. Electronic Materials Letters. 10(3). 645–647. 20 indexed citations
15.
Zhang, Liang, K. N. Tu, Yonghuan Guo, Chengwen He, & Jian Zhang. (2013). Effect of aging on the interface and properties of SnAgCu/SnAgCu-TiO_2 solder joints. 34(8). 43–46. 1 indexed citations
16.
Zhang, Liang, Jiguang Han, Yonghuan Guo, & Chengwen He. (2013). Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices. Microelectronics Reliability. 54(1). 281–286. 48 indexed citations
17.
Zhang, Liang, Jiguang Han, Chengwen He, & Yonghuan Guo. (2012). Reliability behavior of lead-free solder joints in electronic components. Journal of Materials Science Materials in Electronics. 24(1). 172–190. 63 indexed citations
18.
Zhang, Liang, Jiguang Han, Chengwen He, & Yonghuan Guo. (2012). Effect of Zn on properties and microstructure of SnAgCu alloy. Journal of Materials Science Materials in Electronics. 23(11). 1950–1956. 33 indexed citations
19.
Zhang, Liang, et al.. (2012). Microstructures and properties of SnZn-xEr lead-free solders. Journal of Rare Earths. 30(8). 790–793. 29 indexed citations
20.
Zhang, Liang, et al.. (2011). Development of SnAg-based lead free solders in electronics packaging. Microelectronics Reliability. 52(3). 559–578. 97 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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