G.Y. Li
- Electrical and Electronic Engineering top 10%
- Mechanical Engineering top 5%
- Aerospace Engineering
- General Materials Science top 2%
- Mechanics of Materials
- Topics
- Electronic Packaging and Soldering Technologies (16 papers)3D IC and TSV technologies (12 papers)Aluminum Alloys Composites Properties (5 papers)
In The Last Decade
G.Y. Li
18 papers receiving 552 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 531
- Mechanical Engineering 470
- Aerospace Engineering 58
- General Materials Science 42
- Mechanics of Materials 37
Countries citing papers authored by G.Y. Li
This map shows the geographic impact of G.Y. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G.Y. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G.Y. Li more than expected).
Fields of papers citing papers by G.Y. Li
This network shows the impact of papers produced by G.Y. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G.Y. Li. The network helps show where G.Y. Li may publish in the future.
Co-authorship network of co-authors of G.Y. Li
This figure shows the co-authorship network connecting the top 25 collaborators of G.Y. Li. A scholar is included among the top collaborators of G.Y. Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G.Y. Li. G.Y. Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 10 | |
| 5 | 32 | |
| 6 | 37 | |
| 7 | 14 | |
| 8 | 46 | |
| 9 | 43 | |
| 10 | 20 | |
| 11 | 53 | |
| 12 | 24 | |
| 13 | 9 | |
| 14 | 3 | |
| 15 | 120 | |
| 16 | 93 | |
| 17 | 13 | |
| 18 | 1 | |
| 19 | 2 | |
| 20 | 3 |
About G.Y. Li
G.Y. Li is a scholar working on Mechanical Engineering, General Materials Science and Electrical and Electronic Engineering, having authored 21 papers that have together received 563 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Aluminum Alloys Composites Properties (5 papers). The work is most often cited by research in General Materials Science (42 citations), Mechanical Engineering (470 citations) and Electrical and Electronic Engineering (531 citations). G.Y. Li has collaborated with scholars based in China, Australia and Hong Kong. Frequent co-authors include Yu Tang, Shuqiong Luo, Zhenlong Li, Jianping Huang, Chaojun Hou, Zichun Zhong, Jiajun Zhuang, Bin Li, Xu Shi and Zhaoyu Wu. Their work appears in journals such as Materials Science and Engineering A, Biomacromolecules and Journal of Alloys and Compounds.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.