G.Y. Li

641 total citations
21 papers, 563 citations indexed

About

G.Y. Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, G.Y. Li has authored 21 papers receiving a total of 563 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 13 papers in Mechanical Engineering and 3 papers in Biomedical Engineering. Recurrent topics in G.Y. Li's work include Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Aluminum Alloys Composites Properties (5 papers). G.Y. Li is often cited by papers focused on Electronic Packaging and Soldering Technologies (16 papers), 3D IC and TSV technologies (12 papers) and Aluminum Alloys Composites Properties (5 papers). G.Y. Li collaborates with scholars based in China, Australia and Hong Kong. G.Y. Li's co-authors include Yu Tang, Shuqiong Luo, Zhenlong Li, Jianping Huang, Chaojun Hou, Zichun Zhong, Jiajun Zhuang, Bin Li, Xu Shi and Zhaoyu Wu and has published in prestigious journals such as Materials Science and Engineering A, Biomacromolecules and Journal of Alloys and Compounds.

In The Last Decade

G.Y. Li

18 papers receiving 552 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
G.Y. Li China 12 531 470 58 42 37 21 563
Zhong Sheng China 11 534 1.0× 476 1.0× 105 1.8× 38 0.9× 26 0.7× 15 575
Alice C. Kilgo United States 7 377 0.7× 356 0.8× 109 1.9× 29 0.7× 60 1.6× 26 454
A. Fawzy Egypt 13 687 1.3× 663 1.4× 157 2.7× 46 1.1× 48 1.3× 24 767
Omid Mokhtari Japan 14 739 1.4× 610 1.3× 116 2.0× 44 1.0× 21 0.6× 38 796
G.S. Al-Ganainy Egypt 10 298 0.6× 312 0.7× 96 1.7× 28 0.7× 18 0.5× 18 382
B. Kempf Germany 9 167 0.3× 303 0.6× 56 1.0× 36 0.9× 33 0.9× 20 355
Flora Somidin Malaysia 10 316 0.6× 255 0.5× 41 0.7× 27 0.6× 8 0.2× 33 354
J. K. Lin United States 6 606 1.1× 428 0.9× 115 2.0× 41 1.0× 29 0.8× 8 616
T. Shoji Japan 6 313 0.6× 301 0.6× 33 0.6× 26 0.6× 42 1.1× 8 425
Zijie Cai United States 8 661 1.2× 430 0.9× 243 4.2× 25 0.6× 141 3.8× 12 678

Countries citing papers authored by G.Y. Li

Since Specialization
Citations

This map shows the geographic impact of G.Y. Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by G.Y. Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites G.Y. Li more than expected).

Fields of papers citing papers by G.Y. Li

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by G.Y. Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by G.Y. Li. The network helps show where G.Y. Li may publish in the future.

Co-authorship network of co-authors of G.Y. Li

This figure shows the co-authorship network connecting the top 25 collaborators of G.Y. Li. A scholar is included among the top collaborators of G.Y. Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with G.Y. Li. G.Y. Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Xiaomin, Tao Zhang, Juan Pang, et al.. (2025). An antifreezing and antidehydration interpenetrating polymer network conductive hydrogel for flexible and wearable strain sensors. Measurement. 257. 118783–118783.
2.
Zhang, Xiaomin, Zhuoya Zhang, Wangjia Tang, et al.. (2025). Sodium Alginate-Based Frost-Resistant and Antidry Conductive Hydrogel for Human Motion Monitoring and Human–Computer Interaction. Biomacromolecules. 26(10). 7140–7151.
3.
4.
Chen, Si, et al.. (2020). An ion beam layer removal method of determining the residual stress in the as-fabricated TSV-Cu/TiW/SiO2/Si interface on a nanoscale. Microelectronics Reliability. 112. 113826–113826. 10 indexed citations
5.
Tang, Yu, et al.. (2019). Effects of CeO2 nanoparticles addition on shear properties of low-silver Sn–0.3Ag–0.7Cu-xCeO2 solder alloys. Journal of Alloys and Compounds. 789. 150–162. 32 indexed citations
6.
Tang, Yu, et al.. (2019). A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints. Journal of Alloys and Compounds. 818. 152893–152893. 37 indexed citations
7.
Tang, Yu, et al.. (2018). Morphological Evolution and Growth Kinetics of Interfacial Cu6Sn5 and Cu3Sn Layers in Low-Ag Sn-0.3Ag-0.7Cu-xMn/Cu Solder Joints During Isothermal Ageing. Journal of Electronic Materials. 47(10). 5913–5929. 14 indexed citations
8.
Tang, Yu, et al.. (2017). Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints. Journal of Alloys and Compounds. 719. 365–375. 46 indexed citations
9.
Tang, Yu, et al.. (2016). Effect of Nano-TiO2 particles on growth of interfacial Cu6Sn5 and Cu3Sn layers in Sn 3.0Ag 0.5Cu xTiO2 solder joints. Journal of Alloys and Compounds. 684. 299–309. 43 indexed citations
10.
Li, G.Y., et al.. (2016). Effects of active element Ti on interfacial microstructure and bonding strength of SiO2/ SiO2 joints soldered using Sn3.5Ag4Ti(Ce,Ga) alloy filler. Materials Science and Engineering A. 680. 317–323. 20 indexed citations
11.
Li, Zhenlong, et al.. (2016). Effects of joint size and isothermal aging on interfacial IMC growth in Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints. Journal of Alloys and Compounds. 697. 104–113. 53 indexed citations
12.
Li, Zhenlong, et al.. (2016). Size effect on IMC growth in micro-scale Sn-3.0Ag-0.5Cu-0.1TiO2 solder joints in reflow process. Journal of Alloys and Compounds. 685. 983–991. 24 indexed citations
13.
Li, G.Y., et al.. (2016). Influence of active element Ti on interfacial reaction and soldering strength between Sn3.5Ag4Ti(Ce,Ga) alloy filler and Si substrate. Materials Science and Engineering A. 658. 42–49. 9 indexed citations
14.
Li, G.Y., et al.. (2015). A novel low temperature active bonding of Si/Si with Sn3.5Ag4Ti(Ce,Ga) alloy filler. Materials Letters. 165. 103–106. 3 indexed citations
15.
Tang, Yu, et al.. (2013). Effects of TiO2 nanoparticles addition on microstructure, microhardness and tensile properties of Sn–3.0Ag–0.5Cu–xTiO2 composite solder. Materials & Design (1980-2015). 55. 574–582. 120 indexed citations
16.
Tang, Yu, et al.. (2012). Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints in reflow process. Journal of Alloys and Compounds. 554. 195–203. 93 indexed citations
17.
Tang, Yu, G.Y. Li, & Xu Shi. (2012). Low-Cycle Fatigue Behavior of 95.8Sn-3.5Ag-0.7Cu Solder Joints. Journal of Electronic Materials. 42(1). 192–200. 13 indexed citations
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Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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