Jiguang Han

612 citations
30 papers · 524 indexed · h-index 13
Topics
Electronic Packaging and Soldering Technologies (14 papers)3D IC and TSV technologies (10 papers)Aluminum Alloys Composites Properties (6 papers)
Partner nations
ChinaUnited States

In The Last Decade

Jiguang Han

26 papers receiving 510 citations

Peers

Jiguang Han
Comparison fields: 5 of 52
  • Electrical and Electronic Engineering 429
  • Mechanical Engineering 284
  • Statistical and Nonlinear Physics 54
  • Mechanics of Materials 47
  • Aerospace Engineering 45
Replace Dolores Gómez with:
Dolores Gómez Spain
Pilar Salgado Spain
Huaqiang Wang China
B.M. Guenin United States
S. V. Kulkarni India
Florea I. Hănţilă Romania
Buzz Wincheski United States
Yu. I. Shtern Russia
Alexey Shitvov United Kingdom
Jiguang Han relative to Dolores Gómez Spain Dolores Gómez's profile →
Citations per field
00.5×6.8×
Dolores Gómez · 1×
Citations per year

Countries citing papers authored by Jiguang Han

Since Specialization
Citations

This map shows the geographic impact of Jiguang Han's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiguang Han with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiguang Han more than expected).

Fields of papers citing papers by Jiguang Han

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jiguang Han. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiguang Han. The network helps show where Jiguang Han may publish in the future.

Co-authorship network of co-authors of Jiguang Han

This figure shows the co-authorship network connecting the top 25 collaborators of Jiguang Han. A scholar is included among the top collaborators of Jiguang Han based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jiguang Han. Jiguang Han is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
#WorkIndexed citations
1 2
2 25
3 5
4 10
5 7
6 0
7 3
8 20
9 37
10 22
11 0
12 9
13 48
14 63
15 33
16 29
17 97
18 24
19 5
20 19

About Jiguang Han

Jiguang Han is a scholar working on Modeling and Simulation, Statistical and Nonlinear Physics and Mechanical Engineering, having authored 30 papers that have together received 524 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (14 papers), 3D IC and TSV technologies (10 papers) and Aluminum Alloys Composites Properties (6 papers). The work is most often cited by research in Mechanical Engineering (284 citations), Electrical and Electronic Engineering (429 citations) and General Materials Science (15 citations). Jiguang Han has collaborated with scholars based in China and United States. Frequent co-authors include Yonghuan Guo, Chengwen He, Liang Zhang, Liang Zhang, Lei Sun, Yong‐Wei Zhang, Hong Zhao, Weitao Wang, Xiangning Lu and Guanglan Liao. Their work appears in journals such as ACS Applied Materials & Interfaces, Small and Materials Science and Engineering A.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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