Yoshiya Hagimoto
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Biomedical Engineering
- Atomic and Molecular Physics, and Optics
- Surfaces, Coatings and Films top 10%
- Co-authors
- M. OshimaKanta OnoHayato IwamotoAkira ToriumiN. HirashitaJongho OhAkito KakizakiHan Woong Yeom
- Topics
- Semiconductor materials and devices (15 papers)3D IC and TSV technologies (9 papers)Electronic Packaging and Soldering Technologies (7 papers)
- Partner nations
- TaiwanJapanUnited States
In The Last Decade
Yoshiya Hagimoto
29 papers receiving 384 citations
Peers
Comparison fields: 5 of 42
- Electrical and Electronic Engineering 375
- Materials Chemistry 166
- Biomedical Engineering 65
- Atomic and Molecular Physics, and Optics 55
- Surfaces, Coatings and Films 54
Countries citing papers authored by Yoshiya Hagimoto
This map shows the geographic impact of Yoshiya Hagimoto's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yoshiya Hagimoto with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yoshiya Hagimoto more than expected).
Fields of papers citing papers by Yoshiya Hagimoto
This network shows the impact of papers produced by Yoshiya Hagimoto. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yoshiya Hagimoto. The network helps show where Yoshiya Hagimoto may publish in the future.
Co-authorship network of co-authors of Yoshiya Hagimoto
This figure shows the co-authorship network connecting the top 25 collaborators of Yoshiya Hagimoto. A scholar is included among the top collaborators of Yoshiya Hagimoto based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yoshiya Hagimoto. Yoshiya Hagimoto is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 2 | |
| 4 | 1 | |
| 5 | 1 | |
| 6 | 3 | |
| 7 | 3 | |
| 8 | 9 | |
| 9 | 13 | |
| 10 | 1 | |
| 11 | 0 | |
| 12 | 52 | |
| 13 | 7 | |
| 14 | 1 | |
| 15 | 2 | |
| 16 | 20 | |
| 17 | 8 | |
| 18 | 3 | |
| 19 | 179 | |
| 20 | 10 |
About Yoshiya Hagimoto
Yoshiya Hagimoto is a scholar working on Electrical and Electronic Engineering, Surfaces, Coatings and Films and Automotive Engineering, having authored 32 papers that have together received 407 indexed citations. Recurring topics across this work include Semiconductor materials and devices (15 papers), 3D IC and TSV technologies (9 papers) and Electronic Packaging and Soldering Technologies (7 papers). The work is most often cited by research in Instrumentation (27 citations), Surfaces, Coatings and Films (54 citations) and Electrical and Electronic Engineering (375 citations). Yoshiya Hagimoto has collaborated with scholars based in Taiwan, Japan and United States. Frequent co-authors include M. Oshima, Kanta Ono, Hayato Iwamoto, Akira Toriumi, N. Hirashita, Jongho Oh, Akito Kakizaki, Han Woong Yeom, Suguru Saito and Hiroshi Fujioka. Their work appears in journals such as Physical review. B, Condensed matter, Applied Physics Letters and Scientific Reports.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.